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Description for Henkel Bondmaster E3520
• Low visc. structural adhesive • Various metal and plastic bonding •Brand Bondmaster Application Type Bond 1 Part or 2 Part 2-Part Material Form Liquid Substrate ferrite, Composite, Metal Manufacturer Henkel Chemistry Epoxy Cure Method Resin/Hardener, Induction heating Cure Temperature (°C) 20 to 25 Room Temperature Cure Time (min) 1,440 Viscosity (cPs) Low, 15 M (cP) Color Gray High Temperature Resistance (°C) 80 Low Temperature Resistance (°C) -55 Other Resistance Exceptional temperature -
Technical Data for Henkel Bondmaster E3520
Overview
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Application Type
- Adhesive - Bond
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1 Part or 2 Part
- 2-Part
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Material Form
- Liquid
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Substrate
- Ceramic - ferrite
- Metal
- Composites - Composite
- Other - thermoset, a wide range of material substrates
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Industry
- Construction - Masonry
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Chemistry
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Cure Method
- Heat - Induction heating
- 2-Part Cure - Resin/Hardener
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Color
- Gray
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Brand
- Bondmaster
Specifications
Cure Specs
Cure Temperature (°C) 20 to 25 Room Temperature Cure Time (min) 1,440 Viscosity (cPs) Low, 15 M (cP) Set Time (min) 480 Mix Ratio 10:6 (by volume), 2:1 (by weight) Bond Strength
Structural/Load-Bearing Structural Shear Strength (psi) High, <3,500 Material Resistance
High Temperature Resistance (°C) 80 Low Temperature Resistance (°C) -55 Other Resistance Exceptional temperature -
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Best Practices for Henkel Bondmaster E3520
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Comparable Materials for Henkel Bondmaster E3520
Spec Engine® Results
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