• Description for Henkel E01

    A two-part, epoxy adhesive that is easy to use and apply. It comes to a full cure at room temperature, is non-flammable, has low shrinkage and adheres to a wide variety of substrates. Has a soft paste consistency for precise application to parts.

    *See Terms of Use Below

    Brand Bondmaster
    Application Type Bond, Repair
    1 Part or 2 Part 2 Part
    Material Form Liquid
    Substrate Ceramic, Neoprene, Plastic, Nitrile Rubber, Steel, Wood, Metal
    Manufacturer Henkel
    Chemistry Epoxy, Hardener, Resin
    Cure Method Part A/Part B
    Cure Temperature (°C) 20 to 25, 20 to 25
    Cure Time (min) 1,440, Rapidly
    Viscosity (cPs) 35,000
    Color Colorless, Clear
    High Temperature Resistance (°C) 100
    Low Temperature Resistance (°C) -55
  • Best Practices for Henkel E01

    *See Terms of Use Below

    1. Application

      Mate the two substrates together and clamp the assembly for 5 minutes until handling strength is achieved.

      Full cure is obtained 24 hours after adhesive application at room temperature, 25°C (77°F).

      The curing temperature may be increased to facilitate full cure of the adhesive.

    2. Mixing

      Thoroughly mix the resin and the hardener in a 1:1 ratio by weight or volume, taking care not to introduce excess entrapped air into the bulk material. Once mixed thoroughly, apply a bead of adhesive to one of the bonding surfaces.

    3. Clean-Up

      Unreacted resin & hardener can be cleaned using acetone, isopropanol or methyl ethyl ketone (MEK).

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Gluespec Poll

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Fixture or Handling Strength Time Test Methods
Fixture or Handling Strength Time Fixture-Handling Strength Time Temperature
5.00 min 25°C
Viscosity Test Methods
Viscosity Temperature
35,000 cPs 25°C
Work / Pot Time Test Methods
Work / Pot Time Temperature
3.00 min 25°C
Shear Strength Test Methods
Shear Strength Substrate
1,300 psi Steel