Henkel E01

CONTACT REP

Description for Henkel E01

A two-part, epoxy adhesive that is easy to use and apply. It comes to a full cure at room temperature, is non-flammable, has low shrinkage and adheres to a wide variety of substrates. Has a soft paste consistency for precise application to parts.

*See Terms of Use Below

Brand	Bondmaster
Application Type	Bond, Repair
1 Part or 2 Part	2 Part
Material Form	Liquid
Substrate	Ceramic, Metal, Neoprene, Plastic, Steel, Wood, Nitrile Rubber
Manufacturer	Henkel
Chemistry	Epoxy, Hardener, Resin
Cure Method	Part A/Part B
Cure Temperature (°C)	20 to 25, 20 to 25
Cure Time (min)	1,440, Rapidly
Viscosity (cPs)	35,000
Color	Colorless, Clear
High Temperature Resistance (°C)	100
Low Temperature Resistance (°C)	-55

Best Practices for Henkel E01

Register for FREE to view more details

Why register?

View Technical Details
View Test Methods
View Key Specifications
View Similar Materials
Save your Project Searches

See what Gluespec offers

Sign up now Already registered? Sign in!

Email: *

Password: *

Confirm Password: *

Do you prefer to see data in °F or °C?

First Name: *

Last Name: *

Phone: *

Company Name: *

Address: *

Postal Code: *

Country: *

Job Function: *

Industry: *

Describe: *

I agree to the terms of use *

*: Required

Technical Data for Henkel E01

*See Terms of Use Below

Overview

Application Type
- Adhesive - Bond
- Repair & Maintenance - Repair
1 Part or 2 Part
- 1 Part or 2 Part - 2 Part
Material Form
- Liquid
Substrate
- Ceramic
- Metal
- Steel
- Plastic
- Neoprene
- Nitrile Rubber
- Wood
Chemistry
- Epoxy
- Other - Hardener, Resin
Cure Method
- 2-Part Cure - Part A/Part B
Color
- Clear / Transparent - Clear
- Other - Colorless
Brand
- Bondmaster

Specifications

Cure Specs

Cure Temperature (°C)	20 to 25, 20 to 25
Cure Time (min)	1,440, Rapidly
Viscosity (cPs)	35,000	Test Method
Fixture or Handling Strength Time (min)	5.00	Test Method
Linear Shrinkage (%)	Low
Work / Pot Time (min)	3.00	Test Method
Mix Ratio	1:1 (by volume), 100:94 (by weight)

Bond Strength

Shear Strength (psi)	1,300	Test Method

Material Resistance

High Temperature Resistance (°C)	100
Low Temperature Resistance (°C)	-55

Other Properties

Specific Gravity	1.160
Flash Point (°F)	>212.0
% Solids (%)	100

Business Information

Shelf Life Details	When stored in the original unopened containers at 5-25°C, the shelf life of this product is 24 months from the date of despatch from Bondmaster.
Shelf Life Temperature (°F)	41 to 77
Shelf Life Type	Date of despatch
Shelf Life (mon)	24

Best Practices for Henkel E01

*See Terms of Use Below
1. Application
  
  Mate the two substrates together and clamp the assembly for 5 minutes until handling strength is achieved.
  
  Full cure is obtained 24 hours after adhesive application at room temperature, 25°C (77°F).
  
  The curing temperature may be increased to facilitate full cure of the adhesive.
2. Mixing
  
  Thoroughly mix the resin and the hardener in a 1:1 ratio by weight or volume, taking care not to introduce excess entrapped air into the bulk material. Once mixed thoroughly, apply a bead of adhesive to one of the bonding surfaces.
3. Clean-Up
  
  Unreacted resin & hardener can be cleaned using acetone, isopropanol or methyl ethyl ketone (MEK).
Comparable Materials for Henkel E01

*See Terms of Use Below

Spec Engine^® Results
- Oxy-Bond 1105(Henkel)
  High performance, medium viscosity, 5 minute fixture adhesive.
- Bondmaster Double Bubble(Henkel)
  Bond to a wide variety of materials (i.e. wood, metal, plastic and ceramic) and cures rapidly to give handling strength in approximately 5 minutes.
- Oxy-Bond 105 2.5 Minute(Henkel)
  An excellent epoxy formulation recommended for lower temperature or wet industrial bonding applications where fast curing is required. This clear, two-part, low viscosity system develops strong, tough bonds to metals, phenolic plastics, polyesters, glass, rubber, masonry materials and other construction materials.
- Compare All