Henkel E01

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Description for Henkel E01

A two-part, epoxy adhesive that is easy to use and apply. It comes to a full cure at room temperature, is non-flammable, has low shrinkage and adheres to a wide variety of substrates. Has a soft paste consistency for precise application to parts.

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Brand	Bondmaster
Application Type	Bond, Repair
1 Part or 2 Part	2 Part
Material Form	Liquid
Substrate	Ceramic, Neoprene, Plastic, Nitrile Rubber, Steel, Wood, Metal
Manufacturer	Henkel
Chemistry	Epoxy, Hardener, Resin
Cure Method	Part A/Part B
Cure Temperature (°C)	20 to 25, 20 to 25
Cure Time (min)	1,440, Rapidly
Viscosity (cPs)	35,000
Color	Colorless, Clear
High Temperature Resistance (°C)	100
Low Temperature Resistance (°C)	-55

Best Practices for Henkel E01

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Technical Data for Henkel E01

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Overview

Application Type
- Adhesive - Bond
- Repair & Maintenance - Repair
1 Part or 2 Part
- 1 Part or 2 Part - 2 Part
Material Form
- Liquid
Substrate
- Ceramic
- Metal
- Steel
- Plastic
- Neoprene
- Nitrile Rubber
- Wood
Chemistry
- Epoxy
- Other - Hardener, Resin
Cure Method
- 2-Part Cure - Part A/Part B
Color
- Clear / Transparent - Clear
- Other - Colorless
Brand
- Bondmaster

Specifications

Cure Specs

Cure Temperature (°C)	20 to 25, 20 to 25
Cure Time (min)	1,440, Rapidly
Viscosity (cPs)	35,000	Test Method
Fixture or Handling Strength Time (min)	5.00	Test Method
Linear Shrinkage (%)	Low
Work / Pot Time (min)	3.00	Test Method
Mix Ratio	1:1 (by volume), 100:94 (by weight)

Bond Strength

Shear Strength (psi)	1,300	Test Method

Material Resistance

High Temperature Resistance (°C)	100
Low Temperature Resistance (°C)	-55

Other Properties

Specific Gravity	1.160
Flash Point (°F)	>212.0
% Solids (%)	100

Business Information

Shelf Life Details	When stored in the original unopened containers at 5-25°C, the shelf life of this product is 24 months from the date of despatch from Bondmaster.
Shelf Life Temperature (°F)	41 to 77
Shelf Life Type	Date of despatch
Shelf Life (mon)	24

Best Practices for Henkel E01

*See Terms of Use Below
1. Application
  
  Mate the two substrates together and clamp the assembly for 5 minutes until handling strength is achieved.
  
  Full cure is obtained 24 hours after adhesive application at room temperature, 25°C (77°F).
  
  The curing temperature may be increased to facilitate full cure of the adhesive.
2. Mixing
  
  Thoroughly mix the resin and the hardener in a 1:1 ratio by weight or volume, taking care not to introduce excess entrapped air into the bulk material. Once mixed thoroughly, apply a bead of adhesive to one of the bonding surfaces.
3. Clean-Up
  
  Unreacted resin & hardener can be cleaned using acetone, isopropanol or methyl ethyl ketone (MEK).
Comparable Materials for Henkel E01

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Spec Engine^® Results
- Oxy-Bond 1105(Henkel)
  High performance, medium viscosity, 5 minute fixture adhesive.
- Bondmaster Double Bubble(Henkel)
  Bond to a wide variety of materials (i.e. wood, metal, plastic and ceramic) and cures rapidly to give handling strength in approximately 5 minutes.
- Oxy-Bond 105 2.5 Minute(Henkel)
  An excellent epoxy formulation recommended for lower temperature or wet industrial bonding applications where fast curing is required. This clear, two-part, low viscosity system develops strong, tough bonds to metals, phenolic plastics, polyesters, glass, rubber, masonry materials and other construction materials.
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