Henkel E01

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Description for Henkel E01

A two-part, epoxy adhesive that is easy to use and apply. It comes to a full cure at room temperature, is non-flammable, has low shrinkage and adheres to a wide variety of substrates. Has a soft paste consistency for precise application to parts.

*See Terms of Use Below

Brand	Bondmaster
Application Type	Bond, Repair
1 Part or 2 Part	2 Part
Material Form	Liquid
Substrate	Ceramic, Neoprene, Plastic, Nitrile Rubber, Steel, Wood, Metal
Manufacturer	Henkel
Chemistry	Epoxy, Hardener, Resin
Cure Method	Part A/Part B
Cure Temperature (°C)	20 to 25, 20 to 25
Cure Time (min)	1,440, Rapidly
Viscosity (cPs)	35,000
Color	Colorless, Clear
High Temperature Resistance (°C)	100
Low Temperature Resistance (°C)	-55

Best Practices for Henkel E01

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Best Practices for Henkel E01

*See Terms of Use Below
1. Application
  
  Mate the two substrates together and clamp the assembly for 5 minutes until handling strength is achieved.
  
  Full cure is obtained 24 hours after adhesive application at room temperature, 25°C (77°F).
  
  The curing temperature may be increased to facilitate full cure of the adhesive.
2. Mixing
  
  Thoroughly mix the resin and the hardener in a 1:1 ratio by weight or volume, taking care not to introduce excess entrapped air into the bulk material. Once mixed thoroughly, apply a bead of adhesive to one of the bonding surfaces.
3. Clean-Up
  
  Unreacted resin & hardener can be cleaned using acetone, isopropanol or methyl ethyl ketone (MEK).