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Description for Henkel E01
A two-part, epoxy adhesive that is easy to use and apply. It comes to a full cure at room temperature, is non-flammable, has low shrinkage and adheres to a wide variety of substrates. Has a soft paste consistency for precise application to parts.Brand Bondmaster Application Type Bond, Repair 1 Part or 2 Part 2-Part Material Form Liquid Substrate Ceramic, Neoprene, Plastic, Nitrile Rubber, Steel, Wood, Metal Manufacturer Henkel Chemistry Epoxy, Hardener, Resin Cure Method Part A/Part B Cure Temperature (°C) 20 to 25, 20 to 25 Cure Time (min) 1,440, Rapidly Viscosity (cPs) 35,000 Color Colorless, Clear High Temperature Resistance (°C) 100 Low Temperature Resistance (°C) -55 -
Technical Data for Henkel E01
Overview
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Application Type
- Adhesive - Bond
- Repair & Maintenance - Repair
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1 Part or 2 Part
- 2-Part
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Material Form
- Liquid
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Chemistry
- Epoxy
- Other - Hardener, Resin
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Cure Method
- 2-Part Cure - Part A/Part B
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Color
- Clear / Transparent - Clear
- Other - Colorless
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Brand
- Bondmaster
Specifications
Cure Specs
Cure Temperature (°C) 20 to 25, 20 to 25 Cure Time (min) 1,440, Rapidly Viscosity (cPs) 35,000 Test Method Fixture or Handling Strength Time (min) 5.00 Test Method Linear Shrinkage (%) Low Work / Pot Time (min) 3.00 Test Method Mix Ratio 1:1 (by volume), 100:94 (by weight) Bond Strength
Shear Strength (psi) 1,300 Test Method Material Resistance
High Temperature Resistance (°C) 100 Low Temperature Resistance (°C) -55 Other Properties
Specific Gravity 1.160 Flash Point (°F) >212.0 % Solids (%) 100 Business Information
Shelf Life Details When stored in the original unopened containers at 5-25°C, the shelf life of this product is 24 months from the date of despatch from Bondmaster. Shelf Life Temperature (°F) 41 to 77 Shelf Life Type Date of despatch Shelf Life (mon) 24 -
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Best Practices for Henkel E01
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Application
Mate the two substrates together and clamp the assembly for 5 minutes until handling strength is achieved.
Full cure is obtained 24 hours after adhesive application at room temperature, 25°C (77°F).
The curing temperature may be increased to facilitate full cure of the adhesive.
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Mixing
Thoroughly mix the resin and the hardener in a 1:1 ratio by weight or volume, taking care not to introduce excess entrapped air into the bulk material. Once mixed thoroughly, apply a bead of adhesive to one of the bonding surfaces.
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Clean-Up
Unreacted resin & hardener can be cleaned using acetone, isopropanol or methyl ethyl ketone (MEK).
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Comparable Materials for Henkel E01
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Fixture or Handling Strength Time Test Methods
Fixture or Handling Strength Time | Fixture-Handling Strength Time Temperature |
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5.00 min | 25°C |
Viscosity Test Methods
Viscosity | Temperature |
---|---|
35,000 cPs | 25°C |
Work / Pot Time Test Methods
Work / Pot Time | Temperature |
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3.00 min | 25°C |
Shear Strength Test Methods
Shear Strength | Substrate |
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1,300 psi | Steel |