Brand Bondmaster Application Type Bond, Repair 1 Part or 2 Part 2 Part Material Form Liquid Substrate Ceramic, Neoprene, Plastic, Nitrile Rubber, Steel, Wood, Metal Manufacturer Henkel Chemistry Epoxy, Hardener, Resin Cure Method Part A/Part B Cure Temperature (°C) 20 to 25, 20 to 25 Cure Time (min) 1,440, Rapidly Viscosity (cPs) 35,000 Color Colorless, Clear High Temperature Resistance (°C) 100 Low Temperature Resistance (°C) -55
Best Practices for Henkel E01
Mate the two substrates together and clamp the assembly for 5 minutes until handling strength is achieved.
Full cure is obtained 24 hours after adhesive application at room temperature, 25°C (77°F).
The curing temperature may be increased to facilitate full cure of the adhesive.
Thoroughly mix the resin and the hardener in a 1:1 ratio by weight or volume, taking care not to introduce excess entrapped air into the bulk material. Once mixed thoroughly, apply a bead of adhesive to one of the bonding surfaces.
Unreacted resin & hardener can be cleaned using acetone, isopropanol or methyl ethyl ketone (MEK).
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Fixture or Handling Strength Time Test Methods
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Viscosity Test Methods
Work / Pot Time Test Methods
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Shear Strength Test Methods