• Description for Henkel E18

    • Fast setting • Environmentally Friendly – 100% Solids • Full Cure at Room Temperature • Low Shrinkage • Adhesion to a Wide Variety of Substrates • Nonflammable •<br/><br/>

    *See Terms of Use Below

    Brand Bondmaster
    Application Type Bond
    1 Part or 2 Part 2 Part
    Material Form Liquid
    Substrate Composites, Copper, Metal, Rubber: Neoprene, Steel, Rubber: Nitrile Rubber
    Manufacturer Henkel
    Chemistry Epoxy, Hardener, Resin
    Cure Method Part A/Part B
    Cure Temperature (°C) 20 to 25 Room Temperature, 20 to 25 Room Temperature, 20 to 25 Room Temperature
    Cure Time (min) 1,440, 30
    Viscosity (cPs) 35,000
    Color Clear
    High Temperature Resistance (°C) 100
    Low Temperature Resistance (°C) -55
  • Technical Data

    Overview
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    Specifications
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  • Best Practices

    *See Terms of Use Below

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Fixture or Handling Strength Time Test Methods
Fixture or Handling Strength Time Fixture-Handling Strength Time Temperature
15 min 25°C
Rapid
Viscosity Test Methods
Viscosity Temperature
35,000 cPs 25°C
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
8 min The work life refers to the pot life of the epoxy after mixing. 25°C
Shear Strength Test Methods
Shear Strength Substrate
1,300 psi Steel