• Description for Henkel E18

    • Fast setting • Environmentally Friendly – 100% Solids • Full Cure at Room Temperature • Low Shrinkage • Adhesion to a Wide Variety of Substrates • Nonflammable •<br/><br/>

    *See Terms of Use Below

    Brand Bondmaster
    Application Type Bond
    1 Part or 2 Part 2 Part
    Material Form Liquid
    Substrate Composites, Copper, Metal, Neoprene, Nitrile Rubber, Steel
    Manufacturer Henkel
    Chemistry Epoxy, Hardener, Resin
    Cure Method Part A/Part B
    Cure Temperature (°C) 20 to 25 Room Temperature, 20 to 25 Room Temperature, 20 to 25 Room Temperature
    Cure Time (min) 1,440, 30
    Viscosity (cPs) 35,000
    Color Clear
    High Temperature Resistance (°C) 100
    Low Temperature Resistance (°C) -55
  • Technical Data for Henkel E18

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 2 Part
      • Part A Name - Part A
      • Part B Name - Part B
    • Material Form
      • Liquid
    • Substrate
    • Chemistry
      • Epoxy
      • Other - Hardener, Resin
    • Cure Method
      • 2-Part Cure - Part A/Part B
    • Color
      • Clear / Transparent - Clear
    • Brand
      • Bondmaster
    Specifications
    Cure Specs
    Cure Temperature (°C) 20 to 25 Room Temperature, 20 to 25 Room Temperature, 20 to 25 Room Temperature
    Cure Time (min) 1,440, 30
    Viscosity (cPs) 35,000 Test Method
    Fixture or Handling Strength Time (min) 15, Rapid Test Method
    Set Time (min) Fast
    Linear Shrinkage (%) Low
    Work / Pot Time (min) 8 Test Method
    Mix Ratio 1:1 (by volume)
    Bond Strength
    Shear Strength (psi) 1,300 Test Method
    Material Resistance
    High Temperature Resistance (°C) 100
    Low Temperature Resistance (°C) -55
    Other Properties
    Specific Gravity 1.160
    Flash Point (°F) >212.0
    % Solids (%) 100
    Business Information
    Shelf Life Details Uncured Adhesive, Uncured Adhesive, When stored properly, the adhesive has a shelf life of one year.
    Shelf Life (mon) 12 Part A, 12 Part B, 12
  • Best Practices for Henkel E18

    *See Terms of Use Below

    1. Application

      Apply a bead of adhesive to one of the bonding surfaces.

      Mate the two substrates together and clamp the assembly for 15 minutes or until handling strength is achieved.

      Full cure is obtained after 24 hours of adhesive application at room temperature, 23°C (73°F).

      The curing temperature may be increased to obtain full cure of the adhesive.

    2. Mixing

      Thoroughly mix the resin and the hardener in a 100:94 ratio by weight or 1:1 by volume, taking care not to introduce excess entrapped air into the bulk material. Do not mix more material than can be applied during the work life of the product. The bonding surfaces should be clean, dry and grease free before applying the adhesive.

    3. Clean-Up

      Unreacted resin & hardener can be cleaned using acetone, isopropanol or methyl ethyl ketone (MEK).

  • Comparable Materials for Henkel E18

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Fixture or Handling Strength Time Test Methods
Fixture or Handling Strength Time Fixture-Handling Strength Time Temperature
15 min 25°C
Rapid
Viscosity Test Methods
Viscosity Temperature
35,000 cPs 25°C
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
8 min The work life refers to the pot life of the epoxy after mixing. 25°C
Shear Strength Test Methods
Shear Strength Substrate
1,300 psi Steel