Henkel E3030

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Description for Henkel E3030

• Two-Part Epoxy • Membrane filter production • Potting • Environmentally Friendly – 100% Solids • Full Cure at Room Temperature • Long Pot Life • Easy to Use & Apply • Low Shrinkage • Adhesion to a Wide Variety of Substrates • Nonflammable • Low viscosity •<br/><br/>

*See Terms of Use Below

Brand	Bondmaster
Application Type	Bond
1 Part or 2 Part	2-Part
Material Form	Liquid
Substrate	Ceramic, Copper, Glass, Metal, Neoprene, Plastic, Steel, Wood, Nitrile Rubber
Manufacturer	Henkel
Chemistry	Epoxy, Hardener, Resin
Cure Method	Part A/Part B
Cure Temperature (°C)	20 to 25 Room Temperature
Cure Time (min)	4,320
Viscosity (cPs)	Low, 600
Color	Purple
High Temperature Resistance (°C)	80
Low Temperature Resistance (°C)	-55

Best Practices for Henkel E3030

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Technical Data for Henkel E3030

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Overview

Application Type
- Adhesive - Bond
1 Part or 2 Part
- 2-Part
Material Form
- Liquid
Substrate
- Ceramic
- Glass
- Metal
- Copper
- Steel
- Plastic
- Neoprene
- Nitrile Rubber
- Wood
Chemistry
- Epoxy
- Other - Hardener, Resin
Cure Method
- 2-Part Cure - Part A/Part B
Color
- Purple
Brand
- Bondmaster

Specifications

Cure Specs

Cure Temperature (°C)	20 to 25 Room Temperature
Cure Time (min)	4,320
Viscosity (cPs)	Low, 600	Test Method
Fixture or Handling Strength Time (min)	480	Test Method
Work / Pot Time (min)	Long, 60	Test Method
Mix Ratio	3:1 (by volume), 100:29 (by weight)

Bond Strength

Shear Strength (psi)	Excellent, 2,300	Test Method
Impact Strength (psi)	Excellent

Material Resistance

High Temperature Resistance (°C)	80
Impact Resistance	Impact resistance
Low Temperature Resistance (°C)	-55

Other Properties

Specific Gravity	1.110
Flash Point (°F)	>212.0
% Solids (%)	100

Business Information

Shelf Life Details	Uncured Adhesive, Uncured Adhesive, When stored properly, the adhesive has a shelf life of one year.
Shelf Life (mon)	12 Part A, 12 Part B, 12

Best Practices for Henkel E3030

*See Terms of Use Below
1. Application
  
  Apply a bead of adhesive to one of the bonding surfaces.
  
  Mate the two substrates together and clamp the assembly for 8 hours until handling strength is achieved.
  
  Full cure is obtained 72 hours after assembly at room temperature, 25°C (77°F).
  
  The curing temperature may be increased to facilitate full cure of the adhesive.
2. Mixing
  
  Thoroughly mix the resin and the hardener in a 100:29 ratio by weight or 3:1 by volume, taking care not to introduce excess entrapped air into the bulk material. Do not mix more material than can be applied during the work life of the product. The bonding surfaces should be clean, dry and grease-free before applying the adhesive.
3. Clean-Up
  
  Unreacted resin & hardener can be cleaned using acetone, isopropanol or methyl ethyl ketone (MEK).
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