Henkel E3300

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Description for Henkel E3300

Designed as a filler for strengthening lightweight panels and has a paste consistency that makes it easy to mix and spread. The adhesive bonds well to a wide variety of surfaces to provide excellent strength, can easily be machined.

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Brand	Bondmaster
Application Type	Bond
1 Part or 2 Part	2-Part
Material Form	Paste
Manufacturer	Henkel
Chemistry	Epoxy, Hardener, Resin
Cure Method	Part A/Part B
Cure Temperature (°C)	20 to 25
Cure Time (min)	600
Viscosity (cPs)	Paste, Good flow control
Color	Beige, Beige
High Temperature Resistance (°C)	80
Low Temperature Resistance (°C)	-55

Best Practices for Henkel E3300

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Technical Data for Henkel E3300

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Overview

Application Type
- Adhesive - Bond
1 Part or 2 Part
- 2-Part
Material Form
- Paste
Industry
- Industrial - Edge filler
Chemistry
- Epoxy
- Other - Hardener, Resin
Cure Method
- 2-Part Cure - Part A/Part B
Color
- Brown - Beige
- Off-White - Beige
Brand
- Bondmaster

Specifications

Cure Specs

Cure Temperature (°C)	20 to 25
Cure Time (min)	600
Viscosity (cPs)	Paste, Good flow control	Test Method
Fixture or Handling Strength Time (min)	480	Test Method
Work / Pot Time (min)	Long, 60	Test Method
Thixotropic	Thixotropy
Mix Ratio	1:1 (by volume), 100:79 (by weight)

Bond Strength

General Bond Strength (psi)	Excellent

Material Resistance

High Temperature Resistance (°C)	80
Low Temperature Resistance (°C)	-55

Conductivity

Filler	Edge

Other Properties

Specific Gravity	0.610
Flash Point (°F)	>212.0
% Solids (%)	100

Business Information

Shelf Life Details	BONDMASTER E3300 should be stored in a cool place, 5oC to 25oC (41oF to 77oF), and kept away from excessive heat, sparks, flame, and sunlight. When stored properly, the adhesive has a shelf life of one year., Shelf Life Test Method, Shelf Life Test Method
Shelf Life (mon)	12, 12 Part A, 12 Part B

Best Practices for Henkel E3300

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1. Application
  
  Apply the adhesive to one of the bonding surfaces.
  
  Full cure is obtained 10 hours after adhesive application at room temperature, 25°C (77°F).
  
  The curing temperature may be increased to facilitate full cure of the adhesive.
2. Mixing
  
  Thoroughly mix the resin and the hardener in a 100:79 ratio by weight or 1:1 by volume. Do not mix more material than can be applied during the ‘work life’ of the product. The bonding surfaces should be clean, dry and grease free before applying the adhesive
3. Clean-Up
  
  Unreacted resin & hardener can be cleaned using acetone, isopropanol or methyl ethyl ketone (MEK).
Comparable Materials for Henkel E3300

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Spec Engine^® Results
- Epo-Tek EJ2189(Epoxy Technology)
  An electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although other heat cures can be used.
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  A two component, room temperature curing, general and structural grade epoxy resin.
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