• Description for Henkel E3300

    Designed as a filler for strengthening lightweight panels and has a paste consistency that makes it easy to mix and spread. The adhesive bonds well to a wide variety of surfaces to provide excellent strength, can easily be machined.

    *See Terms of Use Below

    Brand Bondmaster
    Application Type Bond
    1 Part or 2 Part 2-Part
    Material Form Paste
    Manufacturer Henkel
    Chemistry Epoxy, Hardener, Resin
    Cure Method Part A/Part B
    Cure Temperature (°C) 20 to 25
    Cure Time (min) 600
    Viscosity (cPs) Paste, Good flow control
    Color Beige, Beige
    High Temperature Resistance (°C) 80
    Low Temperature Resistance (°C) -55
  • Technical Data for Henkel E3300

    • Application Type
    • 1 Part or 2 Part
      • 2-Part
    • Material Form
      • Paste
    • Industry
    • Chemistry
      • Epoxy
      • Other - Hardener, Resin
    • Cure Method
      • 2-Part Cure - Part A/Part B
    • Color
      • Brown - Beige
      • Off-White - Beige
    • Brand
      • Bondmaster
    Cure Specs
    Cure Temperature (°C) 20 to 25
    Cure Time (min) 600
    Viscosity (cPs) Paste, Good flow control Test Method
    Fixture or Handling Strength Time (min) 480 Test Method
    Work / Pot Time (min) Long, 60 Test Method
    Thixotropic Thixotropy
    Mix Ratio 1:1 (by volume), 100:79 (by weight)
    Bond Strength
    General Bond Strength (psi) Excellent
    Material Resistance
    High Temperature Resistance (°C) 80
    Low Temperature Resistance (°C) -55
    Filler Edge
    Other Properties
    Specific Gravity 0.610
    Flash Point (°F) >212.0
    % Solids (%) 100
    Business Information
    Shelf Life Details BONDMASTER E3300 should be stored in a cool place, 5oC to 25oC (41oF to 77oF), and kept away from excessive heat, sparks, flame, and sunlight. When stored properly, the adhesive has a shelf life of one year., Shelf Life Test Method, Shelf Life Test Method
    Shelf Life (mon) 12, 12 Part A, 12 Part B
  • Best Practices for Henkel E3300

    *See Terms of Use Below

    1. Application

      Apply the adhesive to one of the bonding surfaces.

      Full cure is obtained 10 hours after adhesive application at room temperature, 25°C (77°F).

      The curing temperature may be increased to facilitate full cure of the adhesive.

    2. Mixing

      Thoroughly mix the resin and the hardener in a 100:79 ratio by weight or 1:1 by volume. Do not mix more material than can be applied during the ‘work life’ of the product. The bonding surfaces should be clean, dry and grease free before applying the adhesive

    3. Clean-Up

      Unreacted resin & hardener can be cleaned using acetone, isopropanol or methyl ethyl ketone (MEK).

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Fixture or Handling Strength Time Test Methods
Fixture or Handling Strength Time Fixture-Handling Strength Time Temperature
480 min 25°C
Viscosity Test Methods
Viscosity Temperature
Paste 25°C
Good flow control
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
60 min The work life refers to the time that the product can be used after mixing. 25°C