• Description for Henkel ESP 314

    • Very High Strength • Epoxy Adhesive • Structural Bonding Applications • Structural Bonding of Dissimilar Substrates • One Component • Very High Cured Bond Strength • Sag Resistant Paste • Structural Bonding to a Wide Variety of Substrates •<br/>

    *See Terms of Use Below

    Brand Bondmaster
    Application Type Bond
    1 Part or 2 Part 1 Part
    Material Form Paste
    Substrate Copper, Plastics, Steel, FRP
    Manufacturer Henkel
    Chemistry Epoxy
    Cure Method Heat
    Cure Temperature (°C) 100, 120, 150
    Cure Time (min) 90, 30, 20
    Viscosity (cPs) Non-sag
    Color Gray Paste
    High Temperature Resistance (°C) 150
    Low Temperature Resistance (°C) -40
  • Technical Data

    Overview
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    Specifications
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  • Best Practices

    *See Terms of Use Below

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  • Comparable Materials

    *See Terms of Use Below

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Shear Strength Test Methods
Shear Strength Type Substrate Test Temperature
High Lap shear strength
5,800 psi Lap shear strength Al to Al 25°C
2,950 psi Lap shear strength Al to Al 100°C
4,700 psi Lap shear strength Steel to steel 25°C
Peel Strength Test Methods
Peel Strength Type Substrate Test Temperature
High
30 (psi) T-peel strength Al to Al 25°C
Shore D Hardness Test Methods
Shore D Hardness Hardness Temperature
78 25°C
35 120°C