• Description for Henkel ESP104

    • Single Part Heat Cured Epoxy Adhesive • Environmentally Friendly – 100% Solids • Easy to Use & Apply • Low Shrinkage • Adhesion to a Wide Variety of Substrates • Nonflammable • Fast Curing at Low Temperatures •<br/>

    *See Terms of Use Below

    Brand Bondmaster
    Application Type Bond
    1 Part or 2 Part 1 Part
    Material Form Liquid
    Substrate Plastics, Steel
    Industry Electronic
    Manufacturer Henkel
    Chemistry Epoxy
    Cure Method Heat
    Cure Temperature (°C) Low, 100, 120, 150
    Cure Time (min) Fast, 30, 20, 10
    Viscosity (cPs) 140,000
    Color Black
    High Temperature Resistance (°C) 150
    Low Temperature Resistance (°C) -40
  • Technical Data

    Overview
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    Specifications
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  • Best Practices

    *See Terms of Use Below

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  • Comparable Materials

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Viscosity Test Methods
Viscosity Temperature
140,000 cPs 25°C
Shear Strength Test Methods
Shear Strength Substrate Test Method
Excellent Steel/Steel
2,000 psi ASTM D1002