Henkel ESP104

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Description for Henkel ESP104

• Single Part Heat Cured Epoxy Adhesive • Environmentally Friendly – 100% Solids • Easy to Use & Apply • Low Shrinkage • Adhesion to a Wide Variety of Substrates • Nonflammable • Fast Curing at Low Temperatures •<br/>

*See Terms of Use Below

Brand	Bondmaster
Application Type	Bond
1 Part or 2 Part	1 Part
Material Form	Liquid
Substrate	Plastics, Steel
Industry	Electronic
Manufacturer	Henkel
Chemistry	Epoxy
Cure Method	Heat
Cure Temperature (°C)	Low, 100, 120, 150
Cure Time (min)	Fast, 30, 20, 10
Viscosity (cPs)	140,000
Color	Black
High Temperature Resistance (°C)	150
Low Temperature Resistance (°C)	-40

Best Practices for Henkel ESP104

*See Terms of Use Below

Application

The surfaces to be bonded must be cleaned and dried.

Apply a bead of adhesive to one of the bonding surfaces.

Mate the two substrates together and clamp the assembly until handling strength is achieved.
Clean-Up

Unreacted resin & hardener can be cleaned using acetone, isopropanol or methyl ethyl ketone (MEK).

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Technical Data

Overview

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Specifications

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Best Practices

*See Terms of Use Below
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Comparable Materials

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Viscosity Test Methods

Viscosity	Temperature
140,000 cPs	25°C

Shear Strength Test Methods

Shear Strength	Substrate	Test Method
Excellent	Steel/Steel
2,000 psi		ASTM D1002

Henkel ESP104

Description for Henkel ESP104

Best Practices for Henkel ESP104

Application