Henkel ESP104

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Description for Henkel ESP104

• Single Part Heat Cured Epoxy Adhesive • Environmentally Friendly – 100% Solids • Easy to Use & Apply • Low Shrinkage • Adhesion to a Wide Variety of Substrates • Nonflammable • Fast Curing at Low Temperatures •<br/>

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Brand	Bondmaster
Application Type	Bond
1 Part or 2 Part	1-Part
Material Form	Liquid
Substrate	Plastics, Steel
Industry	Electronic
Manufacturer	Henkel
Chemistry	Epoxy
Cure Method	Heat
Cure Temperature (°C)	Low, 100, 120, 150
Cure Time (min)	Fast, 30, 20, 10
Viscosity (cPs)	140,000
Color	Black
High Temperature Resistance (°C)	150
Low Temperature Resistance (°C)	-40

Best Practices for Henkel ESP104

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Technical Data for Henkel ESP104

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Overview

Application Type
- Adhesive - Bond
1 Part or 2 Part
- 1-Part
Material Form
- Liquid
Substrate
- Steel
- Plastic - Plastics
Industry
- Electronics - Electronic
Chemistry
- Epoxy
Cure Method
- Heat
Color
- Black
Brand
- Bondmaster

Specifications

Cure Specs

Cure Temperature (°C)	Low, 100, 120, 150
Cure Time (min)	Fast, 30, 20, 10
Viscosity (cPs)	140,000	Test Method

Bond Strength

Shear Strength (psi)	Excellent, 2,000	Test Method
Impact Strength (psi)	Excellent

Material Resistance

High Temperature Resistance (°C)	150
Impact Resistance	Impact resistance
Low Temperature Resistance (°C)	-40

Conductivity

Filler	Inert, Polymer

Other Properties

Specific Gravity	1.200
Coefficient of Thermal Expansion (CTE)	65e-6 (mm/mm /°C)
Flash Point (°F)	>212.0
% Solids (%)	100

Business Information

Shelf Life Details	BONDMASTER ESP104 should be stored in a cool place, 5oC (41oF). Do not freeze. The product should be kept away from excessive heat, sparks, flame, and sunlight. When stored under these conditions, the adhesive has a shelf life of 6 months.
Shelf Life (mon)	6

Best Practices for Henkel ESP104

*See Terms of Use Below
1. Application
  
  The surfaces to be bonded must be cleaned and dried.
  
  Apply a bead of adhesive to one of the bonding surfaces.
  
  Mate the two substrates together and clamp the assembly until handling strength is achieved.
2. Clean-Up
  
  Unreacted resin & hardener can be cleaned using acetone, isopropanol or methyl ethyl ketone (MEK).
Comparable Materials for Henkel ESP104

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Spec Engine^® Results
- Loctite Stycast A 316-48(Henkel)
  • One component • Fast heat cure • Heat resistant • Non-conductive • Exceptional thermal stability • Excellent chemical resistance • Heat resistant adhesive • Pourable epoxy adhesive
- EP1325 LV(Resinlab)
  A one part, thixotropic, heat curing epoxy adhesive. It is a high-performance polymer system for applications requiring low shrinkage, and excellent adhesion to a wide variety of plastics, metals and circuit board materials.
- D-275(Henkel)
  A one component, fast curing, epoxy structural adhesive. It features high tensile lap shear strength and good T-Peel strength.
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