• Description for Henkel ESP104

    • Single Part Heat Cured Epoxy Adhesive • Environmentally Friendly – 100% Solids • Easy to Use & Apply • Low Shrinkage • Adhesion to a Wide Variety of Substrates • Nonflammable • Fast Curing at Low Temperatures •<br/>

    *See Terms of Use Below

    Brand Bondmaster
    Application Type Bond
    1 Part or 2 Part 1-Part
    Material Form Liquid
    Substrate Plastics, Steel
    Industry Electronic
    Manufacturer Henkel
    Chemistry Epoxy
    Cure Method Heat
    Cure Temperature (°C) Low, 100, 120, 150
    Cure Time (min) Fast, 30, 20, 10
    Viscosity (cPs) 140,000
    Color Black
    High Temperature Resistance (°C) 150
    Low Temperature Resistance (°C) -40
  • Technical Data for Henkel ESP104

    • Application Type
    • 1 Part or 2 Part
      • 1-Part
    • Material Form
      • Liquid
    • Substrate
    • Industry
    • Chemistry
    • Cure Method
      • Heat
    • Color
      • Black
    • Brand
      • Bondmaster
    Cure Specs
    Cure Temperature (°C) Low, 100, 120, 150
    Cure Time (min) Fast, 30, 20, 10
    Viscosity (cPs) 140,000 Test Method
    Bond Strength
    Shear Strength (psi) Excellent, 2,000 Test Method
    Impact Strength (psi) Excellent
    Material Resistance
    High Temperature Resistance (°C) 150
    Impact Resistance Impact resistance
    Low Temperature Resistance (°C) -40
    Filler Inert, Polymer
    Other Properties
    Specific Gravity 1.200
    Coefficient of Thermal Expansion (CTE) 65e-6 (mm/mm /°C)
    Flash Point (°F) >212.0
    % Solids (%) 100
    Business Information
    Shelf Life Details BONDMASTER ESP104 should be stored in a cool place, 5oC (41oF). Do not freeze. The product should be kept away from excessive heat, sparks, flame, and sunlight. When stored under these conditions, the adhesive has a shelf life of 6 months.
    Shelf Life (mon) 6
  • Best Practices for Henkel ESP104

    *See Terms of Use Below

    1. Application

      The surfaces to be bonded must be cleaned and dried.

      Apply a bead of adhesive to one of the bonding surfaces.

      Mate the two substrates together and clamp the assembly until handling strength is achieved.

    2. Clean-Up

      Unreacted resin & hardener can be cleaned using acetone, isopropanol or methyl ethyl ketone (MEK).

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Viscosity Test Methods
Viscosity Temperature
140,000 cPs 25°C
Shear Strength Test Methods
Shear Strength Substrate Test Method
Excellent Steel/Steel
2,000 psi ASTM D1002