Brand Bondmaster Application Type Bond, Maintain, Seal, Gaskets, Lock, Repair 1 Part or 2 Part 1 Part Material Form Liquid Substrate Ceramic, Copper, Glass, Ferrites, Plastics, Rubber, Steel, Metals, Reinforced plastics Manufacturer Henkel Chemistry Epoxy, Solvent-free Cure Method Heat Cure Temperature (°C) 100, 121, 149 Cure Time (min) 120, 45, 15 Viscosity (cPs) 67,500 Color Gray Chemical Resistance Chemical resistance High Temperature Resistance (°C) 177, Excellent Low Temperature Resistance (°C) -40
Technical Data for Henkel ESP4582
1 Part or 2 Part
- 1 Part or 2 Part - 1 Part
- Industrial - Pipes, Rivets, Vessels
Cure Temperature (°C) 100, 121, 149 Cure Time (min) 120, 45, 15 Viscosity (cPs) 67,500 Set Time (min) Fast Test Method
Shear Strength (psi) 2,900 Test Method
Chemical Resistance Chemical resistance Environmental Resistance Excellent High Temperature Resistance (°C) 177, Excellent Low Temperature Resistance (°C) -40
Specific Gravity 1.190 Coefficient of Thermal Expansion (CTE) 36e-6 (in./ in/°F) % Solids (%) 100
Shelf Life Details When stored in the original unopened containers at 5-7°C, the shelf life of this product is 9 months from the date of manufacture. Shelf Life Type From the date of manufacture Shelf Life (mon) 9
Best Practices for Henkel ESP4582
Surfaces should be clean, dry and grease free before applying the adhesive. Where ultimate performance is required then the surfaces should be shot blasted, or lightly abraded, in the presence of Bondmaster SIP.
The adhesive should be extruded using a bead diameter that will allow complete coverage of the bond area. Care should be taken not to include, or trap, any air within the joint. Normally it should be applied to only one surface. Assemble the parts and squeeze together with sufficient pressure to ensure the adhesive spreads to cover the entire bond area. Jig the components using a light clamping pressure and place in the oven to cure. Do not disturb the joint until the adhesive has cured.
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