

-
Description for Henkel ESP4582
A single component solvent-free epoxy based product which sets quickly when heated. Bonded assemblies have excellent resistance to high temperatures and severe environments.Brand Bondmaster Chemical Resistance Chemical resistance Application Type Bond, Maintain, Seal, Gaskets, Repair 1 Part or 2 Part 1-Part Material Form Liquid Substrate Ceramic, Copper, Glass, Ferrites, Plastics, Rubber, Steel, Metals, Reinforced plastics Industry Rivets Manufacturer Henkel Chemistry Epoxy, Solvent-free Cure Method Heat Cure Temperature (°C) 100, 121, 149 Cure Time (min) 120, 45, 15 Viscosity (cPs) 67,500 Color Gray High Temperature Resistance (°C) 177, Excellent Low Temperature Resistance (°C) -40 -
Technical Data for Henkel ESP4582
Overview
-
Chemical Resistance
- Chemical Resistance
-
Application Type
- Gasketing - Gaskets
- Adhesive - Bond
- Repair & Maintenance - Maintain, Repair
- Sealant - Seal
-
1 Part or 2 Part
- 1-Part
-
Material Form
- Liquid
-
Industry
- Rivet - Rivets
- Industrial - Pipes, Vessels
-
Chemistry
-
Cure Method
- Heat
-
Color
- Gray
-
Brand
- Bondmaster
Specifications
Cure Specs
Cure Temperature (°C) 100, 121, 149 Cure Time (min) 120, 45, 15 Viscosity (cPs) 67,500 Set Time (min) Fast Test Method Bond Strength
Shear Strength (psi) 2,900 Test Method Material Resistance
Environmental Resistance Excellent High Temperature Resistance (°C) 177, Excellent Low Temperature Resistance (°C) -40 Other Properties
Specific Gravity 1.190 Coefficient of Thermal Expansion (CTE) 36e-6 (in./ in/°F) % Solids (%) 100 Business Information
Shelf Life Details When stored in the original unopened containers at 5-7°C, the shelf life of this product is 9 months from the date of manufacture. Shelf Life Type From the date of manufacture Shelf Life (mon) 9 -
-
Best Practices for Henkel ESP4582
-
Surface Preparation
Surfaces should be clean, dry and grease free before applying the adhesive. Where ultimate performance is required then the surfaces should be shot blasted, or lightly abraded, in the presence of Bondmaster SIP.
-
Application
The adhesive should be extruded using a bead diameter that will allow complete coverage of the bond area. Care should be taken not to include, or trap, any air within the joint. Normally it should be applied to only one surface. Assemble the parts and squeeze together with sufficient pressure to ensure the adhesive spreads to cover the entire bond area. Jig the components using a light clamping pressure and place in the oven to cure. Do not disturb the joint until the adhesive has cured.
-
-
Comparable Materials for Henkel ESP4582
Spec Engine® Results
Popular Articles
Staking materials and properties
Read ArticleInfographic: ENSURING A STRONG BOND - 6 Basic Methods of Surface Preparation
Read ArticleLearn how to bond and protect at the same time with this adhesive sealants Q&A primer
Read ArticleTesting the effectiveness of surface treatments
Read ArticleSponsored Articles
Unique Advantages of Contact Adhesives
Read ArticleUsing LOCTITE® 454™ is a Valid Option for Engineers Working with a Wide Variety of Materials
Read ArticleSylgard 184 by DOW is the Top Choice for a Transparent, Silicone Encapsulant. Read Why:
Read ArticleCase Study: Creating reliable, corrosion-free bonds with LORD® 406 acrylic adhesive
Read ArticleFeatured Ads
