Henkel ESP4582

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Description for Henkel ESP4582

A single component solvent-free epoxy based product which sets quickly when heated. Bonded assemblies have excellent resistance to high temperatures and severe environments.

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Brand	Bondmaster
Application Type	Bond, Maintain, Seal, Gaskets, Lock, Repair
1 Part or 2 Part	1 Part
Material Form	Liquid
Substrate	Ceramic, Copper, Glass, Ferrites, Plastics, Rubber, Steel, Metals, Reinforced plastics
Manufacturer	Henkel
Chemistry	Epoxy, Solvent-free
Cure Method	Heat
Cure Temperature (°C)	100, 121, 149
Cure Time (min)	120, 45, 15
Viscosity (cPs)	67,500
Color	Gray
Chemical Resistance	Chemical resistance
High Temperature Resistance (°C)	177, Excellent
Low Temperature Resistance (°C)	-40

Best Practices for Henkel ESP4582

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Technical Data for Henkel ESP4582

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Overview

Application Type
- Gasketing - Gaskets
- Adhesive - Bond, Lock
- Repair & Maintenance - Maintain, Repair
- Sealant - Seal
1 Part or 2 Part
- 1 Part or 2 Part - 1 Part
Material Form
- Liquid
Substrate
- Ceramic
- Glass
- Metal - Ferrites, Metals
- Copper
- Steel
- Plastic - Plastics, Reinforced plastics
- Rubber
- Other - SMC
Industry
- Industrial - Pipes, Rivets, Vessels
Chemistry
- Solvent-Free
- Epoxy
Cure Method
- Heat
Color
- Gray
Brand
- Bondmaster

Specifications

Cure Specs

Cure Temperature (°C)	100, 121, 149
Cure Time (min)	120, 45, 15
Viscosity (cPs)	67,500
Set Time (min)	Fast	Test Method

Bond Strength

Shear Strength (psi)	2,900	Test Method

Material Resistance

Chemical Resistance	Chemical resistance
Environmental Resistance	Excellent
High Temperature Resistance (°C)	177, Excellent
Low Temperature Resistance (°C)	-40

Other Properties

Specific Gravity	1.190
Coefficient of Thermal Expansion (CTE)	36e-6 (in./ in/°F)
% Solids (%)	100

Business Information

Shelf Life Details	When stored in the original unopened containers at 5-7°C, the shelf life of this product is 9 months from the date of manufacture.
Shelf Life Type	From the date of manufacture
Shelf Life (mon)	9

Best Practices for Henkel ESP4582

*See Terms of Use Below
1. Surface Preparation
  
  Surfaces should be clean, dry and grease free before applying the adhesive. Where ultimate performance is required then the surfaces should be shot blasted, or lightly abraded, in the presence of Bondmaster SIP.
2. Application
  
  The adhesive should be extruded using a bead diameter that will allow complete coverage of the bond area. Care should be taken not to include, or trap, any air within the joint. Normally it should be applied to only one surface. Assemble the parts and squeeze together with sufficient pressure to ensure the adhesive spreads to cover the entire bond area. Jig the components using a light clamping pressure and place in the oven to cure. Do not disturb the joint until the adhesive has cured.
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