• Description for Henkel ESP4582

    A single component solvent-free epoxy based product which sets quickly when heated. Bonded assemblies have excellent resistance to high temperatures and severe environments.

    *See Terms of Use Below

    Brand Bondmaster
    Application Type Bond, Maintain, Seal, Gaskets, Repair
    1 Part or 2 Part 1 Part
    Material Form Liquid
    Substrate Ceramic, Copper, Glass, Ferrites, Plastics, Rubber, Steel, Metals, Reinforced plastics
    Industry Rivets
    Manufacturer Henkel
    Chemistry Epoxy, Solvent-free
    Cure Method Heat
    Cure Temperature (°C) 100, 121, 149
    Cure Time (min) 120, 45, 15
    Viscosity (cPs) 67,500
    Color Gray
    Chemical Resistance Chemical resistance
    High Temperature Resistance (°C) 177, Excellent
    Low Temperature Resistance (°C) -40
  • Technical Data for Henkel ESP4582

    Overview
    Specifications
    Cure Specs
    Cure Temperature (°C) 100, 121, 149
    Cure Time (min) 120, 45, 15
    Viscosity (cPs) 67,500
    Set Time (min) Fast Test Method
    Bond Strength
    Shear Strength (psi) 2,900 Test Method
    Material Resistance
    Chemical Resistance Chemical resistance
    Environmental Resistance Excellent
    High Temperature Resistance (°C) 177, Excellent
    Low Temperature Resistance (°C) -40
    Other Properties
    Specific Gravity 1.190
    Coefficient of Thermal Expansion (CTE) 36e-6 (in./ in/°F)
    % Solids (%) 100
    Business Information
    Shelf Life Details When stored in the original unopened containers at 5-7°C, the shelf life of this product is 9 months from the date of manufacture.
    Shelf Life Type From the date of manufacture
    Shelf Life (mon) 9
  • Best Practices for Henkel ESP4582

    *See Terms of Use Below

    1. Surface Preparation

      Surfaces should be clean, dry and grease free before applying the adhesive. Where ultimate performance is required then the surfaces should be shot blasted, or lightly abraded, in the presence of Bondmaster SIP.

    2. Application

      The adhesive should be extruded using a bead diameter that will allow complete coverage of the bond area. Care should be taken not to include, or trap, any air within the joint. Normally it should be applied to only one surface. Assemble the parts and squeeze together with sufficient pressure to ensure the adhesive spreads to cover the entire bond area. Jig the components using a light clamping pressure and place in the oven to cure. Do not disturb the joint until the adhesive has cured.

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Set Time Test Methods
Set Time Set Temperature
Fast 149°C
Shear Strength Test Methods
Shear Strength Substrate
2,900 psi Steel