Henkel ESP4582

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Description for Henkel ESP4582

A single component solvent-free epoxy based product which sets quickly when heated. Bonded assemblies have excellent resistance to high temperatures and severe environments.

*See Terms of Use Below

Brand	Bondmaster
Application Type	Bond, Maintain, Seal, Lock, Repair
1 Part or 2 Part	1 Part
Material Form	Liquid
Substrate	Ceramic, Copper, Glass, Ferrites, Plastics, Rubber, Steel, Metals, Reinforced plastics
Manufacturer	Henkel
Chemistry	Epoxy, Solvent-free
Cure Method	Heat
Cure Temperature (°C)	100, 121, 149
Cure Time (min)	120, 45, 15
Viscosity (cPs)	67,500
Color	Gray
Chemical Resistance	Chemical resistance
High Temperature Resistance (°C)	177, Excellent
Low Temperature Resistance (°C)	-40

Best Practices for Henkel ESP4582

*See Terms of Use Below

Surface Preparation

Surfaces should be clean, dry and grease free before applying the adhesive. Where ultimate performance is required then the surfaces should be shot blasted, or lightly abraded, in the presence of Bondmaster SIP.
Application

The adhesive should be extruded using a bead diameter that will allow complete coverage of the bond area. Care should be taken not to include, or trap, any air within the joint. Normally it should be applied to only one surface. Assemble the parts and squeeze together with sufficient pressure to ensure the adhesive spreads to cover the entire bond area. Jig the components using a light clamping pressure and place in the oven to cure. Do not disturb the joint until the adhesive has cured.

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Technical Data

Overview

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Specifications

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Best Practices

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Comparable Materials

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Set Time Test Methods

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2,900 psi	Steel

Henkel ESP4582

Description for Henkel ESP4582

Best Practices for Henkel ESP4582

Surface Preparation