• Description for Henkel ETP 350

    • Two-Part, General Purpose, Epoxy Adhesive • Wide Range of Product Assembly Applications • Bonding Metal and Plastic Pipes • Easy to Use and Apply • Low Shrinkage • Adhesion to a Wide Variety of Substrates<br/>• Good Thermal Conductivity • Thixotropic, Non- Sag Paste •<br/>

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    Brand Bondmaster
    Application Type Bond
    1 Part or 2 Part 2 Part
    Material Form Paste
    Substrate Metal, Neoprene, Plastics, Nitrile Rubber, Aluminum
    Manufacturer Henkel
    Chemistry Epoxy, Amine
    Cure Method Part A/Part B
    Cure Temperature (°C) 20 to 25 Room Temperature, 25 Room Temperature, 45, 65
    Cure Time (min) 1,440, 240, 120
    Viscosity (cPs) Non-sag
    Color White
    High Temperature Resistance (°C) 105
    Low Temperature Resistance (°C) -55
  • Technical Data

    Overview
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    Specifications
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  • Best Practices

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Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
30 min The pot life refers to the work life of the epoxy after mixing. 25°C Room Temperature
Shear Strength Test Methods
Shear Strength Type Substrate Test Temperature Test Method
2,200 psi Lap shear strength Al to Al 25°C Room Temperature ASTM D-1002
Flexural Strength Test Methods
Flexural Strength Test Method
12,000 psi ASTM D-790
Thermal Conductivity Test Methods
Thermal Conductivity Test Method
Good Thermal Conductivity Test Method
7.20 W/m°K ASTM D-2214
Volume Resistivity Test Methods
Volume Resistivity Temp (°C) Test Method
>1e15 (ohms/cm) 25°C Room Temperature ASTM D-257
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Test Method
36e-6 ASTM D-3386