Henkel ETP 350 Datasheet Henkel ETP 350

CONTACT REP
Information provided by Gluespec

  • Description for Henkel ETP 350

    • Two-Part, General Purpose, Epoxy Adhesive • Wide Range of Product Assembly Applications • Bonding Metal and Plastic Pipes • Easy to Use and Apply • Low Shrinkage • Adhesion to a Wide Variety of Substrates<br/>• Good Thermal Conductivity • Thixotropic, Non- Sag Paste •<br/>

    *See Terms of Use Below

    Brand Bondmaster
    Application Type Bond
    1 Part or 2 Part 2 Part
    Material Form Paste
    Substrate Aluminum, Metal, Neoprene, Plastics, Nitrile Rubber
    Manufacturer Henkel
    Chemistry Epoxy, Amine
    Cure Method Part A/Part B
    Cure Temperature (°C) 20 to 25 Room Temperature, 25 Room Temperature, 45, 65
    Cure Time (min) 1,440, 240, 120
    Viscosity (cPs) Non-sag
    Color White
    High Temperature Resistance (°C) 105
    Low Temperature Resistance (°C) -55
  Download Technical Data Sheet   Save This Material   Compare Saved Items

Popular Articles

Electrically Conductive Adhesives

Read Article

Epoxies in the Medical Device Industry

Read Article

Testing the effectiveness of surface treatments

Read Article

Infographic: ENSURING A STRONG BOND - 6 Basic Methods of Surface Preparation

Read Article

Sponsored Articles

Unique Advantages of Contact Adhesives

Read Article

Using LOCTITE® 454™ is a Valid Option for Engineers Working with a Wide Variety of Materials

Read Article

Sylgard 184 by DOW is the Top Choice for a Transparent, Silicone Encapsulant. Read Why:

Read Article

Case Study: Creating reliable, corrosion-free bonds with LORD® 406 acrylic adhesive

Read Article

Featured Ads

Gluespec Poll

When you're researching or sourcing materials online, what device are you using?
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
30 min The pot life refers to the work life of the epoxy after mixing. 25°C Room Temperature
Flexural Strength Test Methods
Flexural Strength Test Method
12,000 psi ASTM D-790
Shear Strength Test Methods
Shear Strength Type Substrate Test Temperature Test Method
2,200 psi Lap shear strength Al to Al 25°C Room Temperature ASTM D-1002
Thermal Conductivity Test Methods
Thermal Conductivity Test Method
Good Thermal Conductivity Test Method
7.20 W/m°K ASTM D-2214
Volume Resistivity Test Methods
Volume Resistivity Temp (°C) Test Method
>1e15 (ohms/cm) 25°C Room Temperature ASTM D-257
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Test Method
36e-6 ASTM D-3386