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Description for Henkel ETP 350
• Two-Part, General Purpose, Epoxy Adhesive • Wide Range of Product Assembly Applications • Bonding Metal and Plastic Pipes • Easy to Use and Apply • Low Shrinkage • Adhesion to a Wide Variety of Substrates<br/>• Good Thermal Conductivity • Thixotropic, Non- Sag Paste •<br/>Brand Bondmaster Application Type Bond 1 Part or 2 Part 2-Part Material Form Paste Substrate Metal, Neoprene, Plastics, Nitrile Rubber, Aluminum Manufacturer Henkel Chemistry Epoxy, Amine Cure Method Part A/Part B Cure Temperature (°C) 20 to 25 Room Temperature, 25 Room Temperature, 45, 65 Cure Time (min) 1,440, 240, 120 Viscosity (cPs) Non-sag Color White High Temperature Resistance (°C) 105 Low Temperature Resistance (°C) -55 Volume Resistivity (O) >1e15 (ohms/cm) -
Technical Data for Henkel ETP 350
Overview
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Application Type
- Adhesive - Bond
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1 Part or 2 Part
- 2-Part
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Material Form
- Paste
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Industry
- Industrial - Pipes
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Chemistry
- Epoxy
- Other - Amine
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Cure Method
- 2-Part Cure - Part A/Part B
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Color
- White
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Brand
- Bondmaster
Specifications
Cure Specs
Cure Temperature (°C) 20 to 25 Room Temperature, 25 Room Temperature, 45, 65 Cure Time (min) 1,440, 240, 120 Viscosity (cPs) Non-sag Set Time (min) Quickly Work / Pot Time (min) 30 Test Method Thixotropic Thixotropic Mix Ratio 1:1 (by volume), 180:100 (by weight) Bond Strength
Shear Strength (psi) 2,200 Test Method Flexural Strength (psi) 12,000 Test Method Material Resistance
High Temperature Resistance (°C) 105 Low Temperature Resistance (°C) -55 Conductivity
Thermal Conductivity (W/m°K) Good, 7.20 Test Method Volume Resistivity (O) >1e15 (ohms/cm) Test Method Other Properties
Specific Gravity 1.210, 2.000 Coefficient of Thermal Expansion (CTE) 36e-6 Test Method Business Information
Shelf Life Details Shelf Life Test Method, Shelf Life Test Method, BONDMASTER ETP 350 Parts A and B have a shelf life of 12 months when stored at or below 27°C (80°F).Do not freeze. Keep away from excessive heat, sparks, flame, and sunlight. If crystallization of either component occurs on storage, warm the contents of the container to 50°C-60°C until all crystals have dissolved. The container should be loosely covered during the warming stage. Gently stir the contents taking care to avoid entrapping air while mixing. Allow contents to cool to ambient temperature before using. Shelf Life (mon) 12 Part A, 12 Part B, 12 -
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Best Practices for Henkel ETP 350
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Surface Preparation
For optimum bond strength and durability, the substrate surfaces to be bonded should be clean and dry. Chemical treatment of metallic surfaces gives optimum durability, but a simple abrade and degrease process may often be adequate. Cleaning or degreasing of plastic and composite surfaces is generally recommended to remove mold release agents which may inhibit optimum bonding results.
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Application
Thoroughly mix the resin and the hardener in a 1:1 ratio by volume (or 1.8 : 1 by weight), taking care not to introduce excess air into the bulk material.
The optimum method of mixing is accomplished via in-line static mixers with a minimum of 18 mixing elements.
Once mixed thoroughly, to a uniform white color
i.e. no visible streaks, apply a bead of adhesive to one of the bonding surfaces.
Mate the two substrates together and clamp the assembly until handling strength is achieved.
Full cure is obtained within 24 hours of adhesive application at room temperature, 25°C (77°F).
The curing temperature may be increased to accelerate the full cure of the adhesive.
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Mixing
Thoroughly mix the resin and the hardener in a 1:1 ratio by volume (or 1.8 : 1 by weight), taking care not to introduce excess air into the bulk material.
The optimum method of mixing is accomplished via in-line static mixers with a minimum of 18 mixing elements.
Once mixed thoroughly, to a uniform white color
i.e. no visible streaks, apply a bead of adhesive to one of the bonding surfaces.
BONDMASTER ETP 350 Part A & Part B should not be mixed in large quantities, as a vigorous chemical reaction will occur generating a significant amount of heat and vapors.
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Curing
Thoroughly mix the resin and the hardener in a 1:1 ratio by volume (or 1.8 : 1 by weight), taking care not to introduce excess air into the bulk material. The optimum method of mixing is accomplished via in-line static mixers with a minimum of 18 mixing elements. Once mixed thoroughly, to a uniform white color
i.e. no visible streaks, apply a bead of adhesive to one of the bonding surfaces. Mate the two substrates together and clamp the assembly until handling strength is achieved. Full cure is obtained within 24 hours of adhesive application at room temperature, 25°C (77°F).The curing temperature may be increased to accelerate the full cure of the adhesive.
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Clean-Up
Unreacted resin & hardener can be cleaned using acetone, isopropanol or methyl ethyl ketone (MEK).
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Work / Pot Time Test Methods
Work / Pot Time | Test Method | Temperature |
---|---|---|
30 min | The pot life refers to the work life of the epoxy after mixing. | 25°C Room Temperature |
Shear Strength Test Methods
Shear Strength | Type | Substrate | Test Temperature | Test Method |
---|---|---|---|---|
2,200 psi | Lap shear strength | Al to Al | 25°C Room Temperature | ASTM D-1002 |
Flexural Strength Test Methods
Flexural Strength | Test Method |
---|---|
12,000 psi | ASTM D-790 |
Thermal Conductivity Test Methods
Thermal Conductivity | Test Method |
---|---|
Good | Thermal Conductivity Test Method |
7.20 W/m°K | ASTM D-2214 |
Volume Resistivity Test Methods
Volume Resistivity | Temp (°C) | Test Method |
---|---|---|
>1e15 (ohms/cm) | 25°C Room Temperature | ASTM D-257 |
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) | CTE Test Method |
---|---|
36e-6 | ASTM D-3386 |