Henkel ETP 350

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Description for Henkel ETP 350

• Two-Part, General Purpose, Epoxy Adhesive • Wide Range of Product Assembly Applications • Bonding Metal and Plastic Pipes • Easy to Use and Apply • Low Shrinkage • Adhesion to a Wide Variety of Substrates<br/>• Good Thermal Conductivity • Thixotropic, Non- Sag Paste •<br/>

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Brand	Bondmaster
Application Type	Bond
1 Part or 2 Part	2-Part
Material Form	Paste
Substrate	Metal, Neoprene, Plastics, Nitrile Rubber, Aluminum
Manufacturer	Henkel
Chemistry	Epoxy, Amine
Cure Method	Part A/Part B
Cure Temperature (°C)	20 to 25 Room Temperature, 25 Room Temperature, 45, 65
Cure Time (min)	1,440, 240, 120
Viscosity (cPs)	Non-sag
Color	White
High Temperature Resistance (°C)	105
Low Temperature Resistance (°C)	-55
Volume Resistivity (O)	>1e15 (ohms/cm)

Best Practices for Henkel ETP 350

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Technical Data for Henkel ETP 350

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Overview

Application Type
- Adhesive - Bond
1 Part or 2 Part
- 2-Part
Material Form
- Paste
Substrate
- Metal
- Aluminum
- Plastic - Plastics
- Neoprene
- Nitrile Rubber
Industry
- Industrial - Pipes
Chemistry
- Epoxy
- Other - Amine
Cure Method
- 2-Part Cure - Part A/Part B
Color
- White
Brand
- Bondmaster

Specifications

Cure Specs

Cure Temperature (°C)	20 to 25 Room Temperature, 25 Room Temperature, 45, 65
Cure Time (min)	1,440, 240, 120
Viscosity (cPs)	Non-sag
Set Time (min)	Quickly
Work / Pot Time (min)	30	Test Method
Thixotropic	Thixotropic
Mix Ratio	1:1 (by volume), 180:100 (by weight)

Bond Strength

Shear Strength (psi)	2,200	Test Method
Flexural Strength (psi)	12,000	Test Method

Material Resistance

High Temperature Resistance (°C)	105
Low Temperature Resistance (°C)	-55

Conductivity

Thermal Conductivity (W/m°K)	Good, 7.20	Test Method
Volume Resistivity (O)	>1e15 (ohms/cm)	Test Method

Other Properties

Specific Gravity	1.210, 2.000
Coefficient of Thermal Expansion (CTE)	36e-6	Test Method

Business Information

Shelf Life Details	Shelf Life Test Method, Shelf Life Test Method, BONDMASTER ETP 350 Parts A and B have a shelf life of 12 months when stored at or below 27°C (80°F).Do not freeze. Keep away from excessive heat, sparks, flame, and sunlight. If crystallization of either component occurs on storage, warm the contents of the container to 50°C-60°C until all crystals have dissolved. The container should be loosely covered during the warming stage. Gently stir the contents taking care to avoid entrapping air while mixing. Allow contents to cool to ambient temperature before using.
Shelf Life (mon)	12 Part A, 12 Part B, 12

Best Practices for Henkel ETP 350

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1. Surface Preparation
  
  For optimum bond strength and durability, the substrate surfaces to be bonded should be clean and dry. Chemical treatment of metallic surfaces gives optimum durability, but a simple abrade and degrease process may often be adequate. Cleaning or degreasing of plastic and composite surfaces is generally recommended to remove mold release agents which may inhibit optimum bonding results.
2. Application
  
  Thoroughly mix the resin and the hardener in a 1:1 ratio by volume (or 1.8 : 1 by weight), taking care not to introduce excess air into the bulk material.
  
  The optimum method of mixing is accomplished via in-line static mixers with a minimum of 18 mixing elements.
  
  Once mixed thoroughly, to a uniform white color
  
  i.e. no visible streaks, apply a bead of adhesive to one of the bonding surfaces.
  
  Mate the two substrates together and clamp the assembly until handling strength is achieved.
  
  Full cure is obtained within 24 hours of adhesive application at room temperature, 25°C (77°F).
  
  The curing temperature may be increased to accelerate the full cure of the adhesive.
3. Mixing
  
  Thoroughly mix the resin and the hardener in a 1:1 ratio by volume (or 1.8 : 1 by weight), taking care not to introduce excess air into the bulk material.
  
  The optimum method of mixing is accomplished via in-line static mixers with a minimum of 18 mixing elements.
  
  Once mixed thoroughly, to a uniform white color
  
  i.e. no visible streaks, apply a bead of adhesive to one of the bonding surfaces.
  
  BONDMASTER ETP 350 Part A & Part B should not be mixed in large quantities, as a vigorous chemical reaction will occur generating a significant amount of heat and vapors.
4. Curing
  
  Thoroughly mix the resin and the hardener in a 1:1 ratio by volume (or 1.8 : 1 by weight), taking care not to introduce excess air into the bulk material. The optimum method of mixing is accomplished via in-line static mixers with a minimum of 18 mixing elements. Once mixed thoroughly, to a uniform white color
  
  i.e. no visible streaks, apply a bead of adhesive to one of the bonding surfaces. Mate the two substrates together and clamp the assembly until handling strength is achieved. Full cure is obtained within 24 hours of adhesive application at room temperature, 25°C (77°F).The curing temperature may be increased to accelerate the full cure of the adhesive.
5. Clean-Up
  
  Unreacted resin & hardener can be cleaned using acetone, isopropanol or methyl ethyl ketone (MEK).
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