• Description for Henkel ETP 350

    • Two-Part, General Purpose, Epoxy Adhesive • Wide Range of Product Assembly Applications • Bonding Metal and Plastic Pipes • Easy to Use and Apply • Low Shrinkage • Adhesion to a Wide Variety of Substrates<br/>• Good Thermal Conductivity • Thixotropic, Non- Sag Paste •<br/>

    *See Terms of Use Below

    Brand Bondmaster
    Application Type Bond
    1 Part or 2 Part 2 Part
    Material Form Paste
    Substrate Metal, Neoprene, Plastics, Nitrile Rubber, Aluminum
    Manufacturer Henkel
    Chemistry Epoxy, Amine
    Cure Method Part A/Part B
    Cure Temperature (°C) 20 to 25 Room Temperature, 25 Room Temperature, 45, 65
    Cure Time (min) 1,440, 240, 120
    Viscosity (cPs) Non-sag
    Color White
    High Temperature Resistance (°C) 105
    Low Temperature Resistance (°C) -55
  • Technical Data for Henkel ETP 350

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 2 Part
      • Part A Name - Part A
      • Part B Name - Part B
    • Material Form
      • Paste
    • Substrate
    • Industry
    • Chemistry
    • Cure Method
      • 2-Part Cure - Part A/Part B
    • Color
      • White
    • Brand
      • Bondmaster
    Specifications
    Cure Specs
    Cure Temperature (°C) 20 to 25 Room Temperature, 25 Room Temperature, 45, 65
    Cure Time (min) 1,440, 240, 120
    Viscosity (cPs) Non-sag
    Set Time (min) Quickly
    Work / Pot Time (min) 30 Test Method
    Thixotropic Thixotropic
    Mix Ratio 1:1 (by volume), 180:100 (by weight)
    Bond Strength
    Shear Strength (psi) 2,200 Test Method
    Flexural Strength (psi) 12,000 Test Method
    Material Resistance
    High Temperature Resistance (°C) 105
    Low Temperature Resistance (°C) -55
    Conductivity
    Thermal Conductivity (W/m°K) Good, 7.20 Test Method
    Volume Resistivity (O) >1e15 (ohms/cm) Test Method
    Other Properties
    Specific Gravity 1.210, 2.000
    Coefficient of Thermal Expansion (CTE) 36e-6 Test Method
    Business Information
    Shelf Life Details Shelf Life Test Method, Shelf Life Test Method, BONDMASTER ETP 350 Parts A and B have a shelf life of 12 months when stored at or below 27°C (80°F).Do not freeze. Keep away from excessive heat, sparks, flame, and sunlight. If crystallization of either component occurs on storage, warm the contents of the container to 50°C-60°C until all crystals have dissolved. The container should be loosely covered during the warming stage. Gently stir the contents taking care to avoid entrapping air while mixing. Allow contents to cool to ambient temperature before using.
    Shelf Life (mon) 12 Part A, 12 Part B, 12
  • Best Practices for Henkel ETP 350

    *See Terms of Use Below

    1. Surface Preparation

      For optimum bond strength and durability, the substrate surfaces to be bonded should be clean and dry. Chemical treatment of metallic surfaces gives optimum durability, but a simple abrade and degrease process may often be adequate. Cleaning or degreasing of plastic and composite surfaces is generally recommended to remove mold release agents which may inhibit optimum bonding results.

    2. Application

      Thoroughly mix the resin and the hardener in a 1:1 ratio by volume (or 1.8 : 1 by weight), taking care not to introduce excess air into the bulk material.

      The optimum method of mixing is accomplished via in-line static mixers with a minimum of 18 mixing elements.

      Once mixed thoroughly, to a uniform white color

      i.e. no visible streaks, apply a bead of adhesive to one of the bonding surfaces.

      Mate the two substrates together and clamp the assembly until handling strength is achieved.

      Full cure is obtained within 24 hours of adhesive application at room temperature, 25°C (77°F).

      The curing temperature may be increased to accelerate the full cure of the adhesive.

    3. Mixing

      Thoroughly mix the resin and the hardener in a 1:1 ratio by volume (or 1.8 : 1 by weight), taking care not to introduce excess air into the bulk material.

      The optimum method of mixing is accomplished via in-line static mixers with a minimum of 18 mixing elements.

      Once mixed thoroughly, to a uniform white color

      i.e. no visible streaks, apply a bead of adhesive to one of the bonding surfaces.

      BONDMASTER ETP 350 Part A & Part B should not be mixed in large quantities, as a vigorous chemical reaction will occur generating a significant amount of heat and vapors.

    4. Curing

      Thoroughly mix the resin and the hardener in a 1:1 ratio by volume (or 1.8 : 1 by weight), taking care not to introduce excess air into the bulk material. The optimum method of mixing is accomplished via in-line static mixers with a minimum of 18 mixing elements. Once mixed thoroughly, to a uniform white color

      i.e. no visible streaks, apply a bead of adhesive to one of the bonding surfaces. Mate the two substrates together and clamp the assembly until handling strength is achieved. Full cure is obtained within 24 hours of adhesive application at room temperature, 25°C (77°F).The curing temperature may be increased to accelerate the full cure of the adhesive.

    5. Clean-Up

      Unreacted resin & hardener can be cleaned using acetone, isopropanol or methyl ethyl ketone (MEK).

  • Comparable Materials for Henkel ETP 350

    *See Terms of Use Below

    Spec Engine® Results

Questions about this material?

Henkel - ETP 350

Get personal assistance with your specific application needs.

Your Profile Edit

Popular Articles

Electrically Conductive Adhesives

Read Article

Epoxies in the Medical Device Industry

Read Article

Testing the effectiveness of surface treatments

Read Article

Infographic: ENSURING A STRONG BOND - 6 Basic Methods of Surface Preparation

Read Article

Sponsored Articles

Unique Advantages of Contact Adhesives

Read Article

Using LOCTITE® 454™ is a Valid Option for Engineers Working with a Wide Variety of Materials

Read Article

Sylgard 184 by DOW is the Top Choice for a Transparent, Silicone Encapsulant. Read Why:

Read Article

Case Study: Creating reliable, corrosion-free bonds with LORD® 406 acrylic adhesive

Read Article
Information provided by Gluespec

Why Register?

  • View Technical Details
  • View Test Methods
  • View Key Specifications
  • View Similar Materials
  • Save your Project Searches

Already registered? Sign in.

Questions? Learn more about Gluespec

Gluespec Poll

When you're researching or sourcing materials online, what device are you using?
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
30 min The pot life refers to the work life of the epoxy after mixing. 25°C Room Temperature
Shear Strength Test Methods
Shear Strength Type Substrate Test Temperature Test Method
2,200 psi Lap shear strength Al to Al 25°C Room Temperature ASTM D-1002
Flexural Strength Test Methods
Flexural Strength Test Method
12,000 psi ASTM D-790
Thermal Conductivity Test Methods
Thermal Conductivity Test Method
Good Thermal Conductivity Test Method
7.20 W/m°K ASTM D-2214
Volume Resistivity Test Methods
Volume Resistivity Temp (°C) Test Method
>1e15 (ohms/cm) 25°C Room Temperature ASTM D-257
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Test Method
36e-6 ASTM D-3386