• Description for Henkel ETP 351

    • Two-Part • General Purpose • Adjustable Flexibility Epoxy Adhesive • Wide Range of Product Assembly Applications • Bonding Dissimilar Substrates • Room Temperature Curable, Accelerated by Heat • Easy to Use and Apply • Easy Mix Ratio • Adjustable Hardness and Flexibility • Adhesion to a Wide Variety of Substrates •<br/>

    *See Terms of Use Below

    Brand Bondmaster
    Application Type Bond
    1 Part or 2 Part 2 Part
    Material Form Liquid
    Substrate Metals, Neoprene, Plastics, Nitrile Rubber, Aluminum
    Manufacturer Henkel
    Chemistry Epoxy, Amine
    Cure Method Part A/Part B
    Cure Temperature (°C) 25, 45, 65, 105
    Cure Time (min) 960 to 1,440, 240 to 360, 120 to 240, 15 to 30
    Viscosity (cPs) 37,000, 37,000, 36,000
    Color Black
    High Temperature Resistance (°C) 65, 80, 90
    Low Temperature Resistance (°C) -40, -55
    Density (g/cm³) 1.340, 1.240, 1.180
  • Technical Data for Henkel ETP 351

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 2 Part
      • Part A Name - Part A
      • Part B Name - Part B
    • Material Form
      • Liquid
    • Substrate
    • Chemistry
    • Cure Method
      • 2-Part Cure - Part A/Part B
    • Color
      • Black
    • Brand
      • Bondmaster
    Specifications
    Cure Specs
    Cure Temperature (°C) 25, 45, 65, 105
    Cure Time (min) 960 to 1,440, 240 to 360, 120 to 240, 15 to 30
    Viscosity (cPs) 37,000, 37,000, 36,000 Test Method
    Work / Pot Time (min) 120, 140, 160 Test Method
    Mix Ratio 100:100 (by volume), 100:50 (by volume), 100:150 (by volume), 100:100 (by weight), 100:150 (by weight), 100:50 (by weight)
    Bond Strength
    Shear Strength (psi) 2,500, 1,400, 1,900, 600 Test Method
    Material Resistance
    High Temperature Resistance (°C) 65, 80, 90
    Low Temperature Resistance (°C) -40, -55
    Conductivity
    Dissipation Factor 0.04000, 0.04000, 0.03000, 0.08000 Test Method
    Dielectric Strength (V/mil) 350 Test Method
    Dielectric Constant 4.40, 4.10, 3.40, 3.30 Test Method
    Thermal Conductivity (W/m°K) 4.15 Test Method
    Volume Resistivity (O) Rigid: >1e13 (ohms/cm), Semi-rigid: >1e13 (ohms/cm), Flexible: >1e10 (ohms/cm) Test Method
    Hardness
    Shore A Hardness 60, Adjustable Test Method
    Shore D Hardness 80, 60, Adjustable Test Method
    Flexibility Adjustable, Rigid, Semi-regid, Flexible
    Other Properties
    Glass Transition Temp (Tg) (°C) 48, 23, 11 Test Method
    Specific Gravity 1.580, 0.970
    Coefficient of Thermal Expansion (CTE) Rigid: 58e-6, Rigid: 158e-6 , Semi-rigid: 73e-6, Semi-rigid: 173e-6, Flexible: 87e-6, Flexible: 209e-6 Test Method
    Density (g/cm³) 1.340, 1.240, 1.180
    Business Information
    Shelf Life Details Shelf Life Details, Shelf Life Details, A shelf life of 6 months when stored at or below 25°C (77°F).
    Shelf Life Temperature (°F) <77, <77, <77
    Shelf Life (mon) 6 Part A, 6 Part B, 6
  • Best Practices for Henkel ETP 351

    *See Terms of Use Below

    1. Surface Preparation

      For optimum bond strength and durability, the substrate surfaces to be bonded should be clean and dry. Chemical treatment of metallic surfaces gives optimum durability, but a simple abrade and degrease process may often be adequate. Cleaning or degreasing of plastic and composite surfaces is generally recommended to remove mold release agents which may inhibit optimum bonding results.

    2. Application

      Mate the two substrates together and clamp the assembly until handling strength is achieved.

      Full cure is obtained within 24 hours of adhesive application at room temperature, 25°C (77°F).

      The curing temperature may be increased to accelerate the full cure of the adhesive.

    3. Mixing

      Thoroughly mix the resin and the hardener, taking care not to introduce excess air into the bulk material. The optimum method of mixing is accomplished via in-line static mixers with a minimum of 18 mixing elements. Once mixed thoroughly, to a uniform black color

      i.e. no visible streaks, apply a bead of adhesive to one of the bonding surfaces.

      BONDMASTER ETP 351 Part A & Part B should not be mixed in large quantities, as a vigorous chemical reaction will occur generating a significant amount of heat and vapors.

    4. Clean-Up

      Unreacted resin & hardener can be cleaned using acetone, isopropanol or methyl ethyl ketone (MEK).

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Viscosity Test Methods
Viscosity Test Method Temperature
37,000 cPs Brookfield Viscosity at 25°C (77°F), Rigid 25°C
37,000 cPs Brookfield Viscosity at 25°C (77°F), Semi-Rigid 25°C
36,000 cPs Brookfield Viscosity at 25°C (77°F), Flexible 25°C
Work / Pot Time Test Methods
Work / Pot Time Test Method
120 min Rigid
140 min Semi-Rigid
160 min Flexible
Shear Strength Test Methods
Shear Strength Type Substrate Test Temperature Test Method
2,500 psi Lap shear strength Al to Al 25°C ASTM D-1002, Rigid
1,400 psi Lap shear strength AL to AL 65°C ASTM D-1002, Rigid
1,900 psi Lap shear strength AL to AL 25°C ASTM D-1002, Semi Rigid
600 psi Lap shear strength AL to AL 25°C ASTM D-1002, Flexible
Dielectric Constant Test Methods
Dielectric Constant Test Method
4.40 Rigid, 60 Hz, ASTM D-150
4.10 Rigid, 1 kHz, ASTM D-150
3.40 Rigid, 1 MHz, ASTM D-150
3.30 Semi-rigid, 1 MHz, ASTM D-150
Dielectric Strength Test Methods
Dielectric Strength Test Method
350 V/mil ASTM D-149
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.04000 Rigid, 60 Hz, ASTM D-150
0.04000 Rigid, 1 kHz, ASTM D-150
0.03000 Rigid, 1 MHz ASTM D-150
0.08000 Semi-rigid, 1 MHz, ASTM D-150
Thermal Conductivity Test Methods
Thermal Conductivity Test Method
4.15 W/m°K ASTM D-2214
Volume Resistivity Test Methods
Volume Resistivity Test Method
Rigid: >1e13 (ohms/cm) ASTM D-257
Semi-rigid: >1e13 (ohms/cm) ASTM D-257
Flexible: >1e10 (ohms/cm) ASTM D-257
Shore A Hardness Test Methods
Shore A Hardness Shore Hardness Test Method
60 Hardness/Durometer Test Method
Adjustable ASTM D-2240
Shore D Hardness Test Methods
Shore D Hardness Shore Hardness Test Method
80 Hardness/Durometer Test Method
60 ASTM D-2240
Adjustable ASTM D-2240
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Test Method
Rigid: 58e-6 ASTM D-150
Rigid: 158e-6 ASTM D-150
Semi-rigid: 73e-6 ASTM D-150
Semi-rigid: 173e-6 ASTM D-150
Flexible: 87e-6 ASTM D-150
Flexible: 209e-6 ASTM D-150
Glass Transition Temp (Tg) Test Methods
Glass Transition Temp (Tg) Glass Transition Temperature (Tg) Test Method
48°C ASTM D-3418
23°C ASTM D-3418
11°C ASTM D-3418