Henkel ETP 352
Brand Bondmaster Application Type Bond 1 Part or 2 Part 2-Part Material Form Liquid Substrate Aluminum, Metals, Neoprene, Plastics, Nitrile Rubber Manufacturer Henkel Chemistry Epoxy, Amine Cure Method Part A/Part B Cure Temperature (°C) 20 to 25 Room Temperature, 25, 45, 65, 105 Cure Time (min) 960 to 1,440, 240 to 360, 120 to 240, 15 to 30 Viscosity (cPs) 20,000, 20,000, 21,000 Color Clear High Temperature Resistance (°C) 90, 80, 65 Low Temperature Resistance (°C) -40, -55, -55 Volume Resistivity (O) Rigid: >1e13 (ohms/cm), Semi rigid: >1e13 (ohms/cm), Flexible: >1e10 (ohms/cm) Density (g/cm³) 1.060, 1.030, 1.010
Technical Data for Henkel ETP 352
Cure Temperature (°C) 20 to 25 Room Temperature, 25, 45, 65, 105 Cure Time (min) 960 to 1,440, 240 to 360, 120 to 240, 15 to 30 Viscosity (cPs) 20,000, 20,000, 21,000 Test Method Work / Pot Time (min) 120, 140, 160 Test Method Mix Ratio 100:100 (by volume), 100:200 (by volume), 100:300 (by volume), 100:100 (by weight), 100:200 (by weight), 100:300 (by weight)
Shear Strength (psi) 2,400 Test Method
High Temperature Resistance (°C) 90, 80, 65 Low Temperature Resistance (°C) -40, -55, -55
Dissipation Factor 0.03000 Test Method Dielectric Strength (V/mil) 400 Test Method Dielectric Constant 3.00 Test Method Volume Resistivity (O) Rigid: >1e13 (ohms/cm), Semi rigid: >1e13 (ohms/cm), Flexible: >1e10 (ohms/cm)
Shore A Hardness 45, Adjustable Test Method Shore D Hardness 75, 52, Adjustable Test Method Flexibility Adjustable
Specific Gravity 1.170, 0.970 Density (g/cm³) 1.060, 1.030, 1.010
Shelf Life Details Shelf Life Details, Shelf Life Details, A shelf life of 12 months when stored at or below 25°C (77°F). Shelf Life (mon) 12 Part A, 12 Part B, 12
Best Practices for Henkel ETP 352
For optimum bond strength and durability, the substrate surfaces to be bonded should be clean and dry. Chemical treatment of metallic surfaces gives optimum durability, but a simple abrade and degrease process may often be adequate. Cleaning or degreasing of plastic and composite surfaces is generally recommended to remove mold release agents which may inhibit optimum bonding results.
Mate the two substrates together and clamp the assembly until handling strength is achieved.
Full cure is obtained within 24 hours of adhesive application at room temperature, 25°C (77°F).
The curing temperature may be increased to accelerate the full cure of the adhesive
Thoroughly mix the resin and the hardener, taking care not to introduce excess air into the bulk material. The optimum method of mixing is accomplished via in-line static mixers with a minimum of 18 mixing elements. Once mixed thoroughly, to a uniform color
i.e.,. no visible streaks, apply a bead of adhesive to one of the bonding surfaces.
BONDMASTER ETP 352 Part A & Part B should not be mixed in large quantities, as a vigorous chemical reaction will occur generating a significant amount of heat and vapors.
Unreacted resin & hardener can be cleaned using acetone, isopropanol or methyl ethyl ketone (MEK).
Comparable Materials for Henkel ETP 352
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Viscosity Test Methods
|20,000 cPs||Brookfield Viscosity, at 25°C 77°F,Rigid||25°C|
|20,000 cPs||Brookfield Viscosity, at 25°C (77°F), Semi Rigid||25°C|
|21,000 cPs||Brookfield Viscosity, at 25°C (77°F), Flexible||25°C|
Work / Pot Time Test Methods
|Work / Pot Time||Test Method|
Shear Strength Test Methods
|Shear Strength||Type||Substrate||Test Temperature||Test Method|
|2,400 psi||Lap shear strength||Al to Al||25°C||ASTM D-1002, Rigid|
Dielectric Constant Test Methods
|Dielectric Constant||Test Method|
|3.00||Dielectric constant, 1 MHz, ASTM D-1550|
Dielectric Strength Test Methods
|Dielectric Strength||Test Method|
|400 V/mil||ASTM D-150|
Dissipation Factor Test Methods
|Dissipation Factor||Test Method|
|0.03000||Dissipation factor, 1 MHz, ASTM D-257|
Shore A Hardness Test Methods
|Shore A Hardness||Shore Hardness Test Method|
|45||Hardness/Durometer Test Method|
Shore D Hardness Test Methods
|Shore D Hardness||Shore Hardness Test Method|
|75||Hardness/Durometer Test Method|