Henkel ETP 352

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Description for Henkel ETP 352

• Two-Part • General Purpose • Adjustable Flexibility • Clear Epoxy Adhesive • Wide Range of Product Assembly Applications • Bonding Dissimilar Substrates • Assemblies Requiring a Clear Adhesive • Room Temperature Curable, Accelerated by Heat • Easy to Use and Apply • Easy Mix Ratio • Adjustable Hardness and Flexibility • Adhesion to a Wide Variety of Substrates •<br/>

*See Terms of Use Below

Brand	Bondmaster
Application Type	Bond
1 Part or 2 Part	2 Part
Material Form	Liquid
Substrate	Metals, Rubber: Neoprene, Plastics, Rubber: Nitrile Rubber, Aluminum
Manufacturer	Henkel
Chemistry	Epoxy, Amine
Cure Method	Part A/Part B
Cure Temperature (°C)	20 to 25 Room Temperature, 25, 45, 65, 105
Cure Time (min)	960 to 1,440, 240 to 360, 120 to 240, 15 to 30
Viscosity (cPs)	20,000, 20,000, 21,000
Color	Clear
High Temperature Resistance (°C)	65, 80, 90
Low Temperature Resistance (°C)	-40, -55, -55
Density (g/cm³)	1.060, 1.030, 1.010

Best Practices for Henkel ETP 352

*See Terms of Use Below

Surface Preparation

For optimum bond strength and durability, the substrate surfaces to be bonded should be clean and dry. Chemical treatment of metallic surfaces gives optimum durability, but a simple abrade and degrease process may often be adequate. Cleaning or degreasing of plastic and composite surfaces is generally recommended to remove mold release agents which may inhibit optimum bonding results.
Application

Mate the two substrates together and clamp the assembly until handling strength is achieved.

Full cure is obtained within 24 hours of adhesive application at room temperature, 25°C (77°F).

The curing temperature may be increased to accelerate the full cure of the adhesive
Mixing

Thoroughly mix the resin and the hardener, taking care not to introduce excess air into the bulk material. The optimum method of mixing is accomplished via in-line static mixers with a minimum of 18 mixing elements. Once mixed thoroughly, to a uniform color

i.e.,. no visible streaks, apply a bead of adhesive to one of the bonding surfaces.

BONDMASTER ETP 352 Part A & Part B should not be mixed in large quantities, as a vigorous chemical reaction will occur generating a significant amount of heat and vapors.
Clean-Up

Unreacted resin & hardener can be cleaned using acetone, isopropanol or methyl ethyl ketone (MEK).

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Technical Data

Overview

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Specifications

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tincidunt tincidunt.	nonummy tincidunt.	euismod.
aliquam.	diam magna.	euismod.
laoreet nibh ut amet.	nibh euismod.	amet.
sit laoreet laoreet.	aliquam nonummy magna.	magna elit.
euismod magna.	adipiscing aliquam magna.	magna dolor.
sit dolor.	dolore.	elit.
tincidunt amet adipiscing amet.	euismod magna.	lorem sed.

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nonummy.	aliquam amet nonummy.	erat erat.
consectetuer ut lorem.	diam consectetuer ipsum.	nibh.
tincidunt.	dolore diam ut.	dolore.
sed.	diam magna ut.	ipsum.
diam magna.	laoreet.	nibh.
diam amet aliquam erat.	erat.	dolor erat.
nonummy tincidunt ut.	nonummy.	dolor.
elit.	amet elit diam.	amet sed.

ut dolor.

nibh magna.	sed tincidunt.	consectetuer adipiscing.
sed.	ut.	lorem lorem.
erat.	sed aliquam euismod.	amet.
diam nonummy sed magna.	erat consectetuer.	sed nonummy.
ut ut nibh.	sed.	nibh.

diam lorem ipsum nibh.

dolor.	aliquam.	nonummy ipsum.
diam ipsum dolor.	erat.	laoreet.
nonummy.	amet nonummy elit.	diam dolore.
dolor.	ut elit.	dolore laoreet.
laoreet erat nonummy erat.	amet.	amet.
aliquam magna.	ipsum amet adipiscing.	dolor euismod.
magna sit.	erat magna lorem.	erat diam.
aliquam euismod ut.	elit.	nonummy tincidunt.

nibh aliquam diam.

tincidunt.	sit.	amet.
consectetuer sit erat aliquam.	dolore dolore.	sit.
consectetuer.	elit elit.	magna sed.
adipiscing laoreet tincidunt.	tincidunt.	magna amet.
diam magna.	aliquam sit aliquam.	aliquam dolore.
euismod diam.	laoreet adipiscing.	nibh elit.

lorem.

lorem ipsum.	dolor magna diam.	dolore.
consectetuer.	aliquam tincidunt.	adipiscing.
diam consectetuer magna.	adipiscing adipiscing aliquam.	nonummy consectetuer.
tincidunt lorem lorem.	magna adipiscing.	euismod.
adipiscing consectetuer.	lorem.	aliquam.
ut elit elit ut.	adipiscing laoreet.	erat laoreet.
ut euismod dolore lorem.	euismod.	amet erat.
dolor nibh nibh.	nibh nonummy dolor.	adipiscing.
euismod amet amet laoreet.	dolor.	erat laoreet.

Best Practices

*See Terms of Use Below
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Comparable Materials

*See Terms of Use Below
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Questions? Learn more about Gluespec

Work / Pot Time	Test Method
120 min	Rigid
140 min	Semi-Rigid
160 min	Flexible

Shore A Hardness	Shore Hardness Test Method
45	Hardness/Durometer Test Method
Adjustable	ASTM D-2240

Shore D Hardness	Shore Hardness Test Method
75	Hardness/Durometer Test Method
52	ASTM D-2240
Adjustable	ASTM D-2240

Viscosity	Test Method	Temperature
20,000 cPs	Brookfield Viscosity, at 25°C 77°F,Rigid	25°C
20,000 cPs	Brookfield Viscosity, at 25°C (77°F), Semi Rigid	25°C
21,000 cPs	Brookfield Viscosity, at 25°C (77°F), Flexible	25°C

Henkel ETP 352

Description for Henkel ETP 352

Best Practices for Henkel ETP 352

Surface Preparation

Application

Mixing

Clean-Up

Register for FREE to view more details

Why register?

Sign up now Already registered? Sign in!

Technical Data

Overview

sed amet diam amet.

dolor amet.

ut sit adipiscing.

aliquam.

sit.

ut lorem aliquam.

Specifications

amet amet.

laoreet nibh ut.

ut dolor.

diam lorem ipsum nibh.

nibh aliquam diam.

lorem.

Best Practices

aliquam consectetuer magna sit.

nibh magna nonummy dolore ut.

elit sit sit elit.

sit nibh adipiscing amet nibh.

dolore nonummy consectetuer ut dolor.

Comparable Materials

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