Henkel ETP 352

Surface Preparation

For optimum bond strength and durability, the substrate surfaces to be bonded should be clean and dry. Chemical treatment of metallic surfaces gives optimum durability, but a simple abrade and degrease process may often be adequate. Cleaning or degreasing of plastic and composite surfaces is generally recommended to remove mold release agents which may inhibit optimum bonding results.

Application

Mate the two substrates together and clamp the assembly until handling strength is achieved.

Full cure is obtained within 24 hours of adhesive application at room temperature, 25°C (77°F).

The curing temperature may be increased to accelerate the full cure of the adhesive

Mixing

Thoroughly mix the resin and the hardener, taking care not to introduce excess air into the bulk material. The optimum method of mixing is accomplished via in-line static mixers with a minimum of 18 mixing elements. Once mixed thoroughly, to a uniform color

i.e.,. no visible streaks, apply a bead of adhesive to one of the bonding surfaces.

BONDMASTER ETP 352 Part A & Part B should not be mixed in large quantities, as a vigorous chemical reaction will occur generating a significant amount of heat and vapors.

Clean-Up

Unreacted resin & hardener can be cleaned using acetone, isopropanol or methyl ethyl ketone (MEK).