Henkel ETP 352 Datasheet Henkel ETP 352

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  • Description for Henkel ETP 352

    • Two-Part • General Purpose • Adjustable Flexibility • Clear Epoxy Adhesive • Wide Range of Product Assembly Applications • Bonding Dissimilar Substrates • Assemblies Requiring a Clear Adhesive • Room Temperature Curable, Accelerated by Heat • Easy to Use and Apply • Easy Mix Ratio • Adjustable Hardness and Flexibility • Adhesion to a Wide Variety of Substrates •<br/>

    *See Terms of Use Below

    Brand Bondmaster
    Application Type Bond
    1 Part or 2 Part 2-Part
    Material Form Liquid
    Substrate Metals, Neoprene, Plastics, Nitrile Rubber, Aluminum
    Manufacturer Henkel
    Chemistry Epoxy, Amine
    Cure Method Part A/Part B
    Cure Temperature (°C) 20 to 25 Room Temperature, 25, 45, 65, 105
    Cure Time (min) 960 to 1,440, 240 to 360, 120 to 240, 15 to 30
    Viscosity (cPs) 20,000, 20,000, 21,000
    Color Clear
    High Temperature Resistance (°C) 90, 80, 65
    Low Temperature Resistance (°C) -40, -55, -55
    Volume Resistivity (O) Rigid: >1e13 (ohms/cm), Semi rigid: >1e13 (ohms/cm), Flexible: >1e10 (ohms/cm)
    Density (g/cm³) 1.060, 1.030, 1.010

  • Technical Data for Henkel ETP 352

    *See Terms of Use Below

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 2-Part
    • Material Form
      • Liquid
    • Substrate
    • Chemistry
    • Cure Method
      • 2-Part Cure - Part A/Part B
    • Color
      • Clear / Transparent - Clear
    • Brand
      • Bondmaster
    Specifications
    Cure Specs
    Cure Temperature (°C) 20 to 25 Room Temperature, 25, 45, 65, 105
    Cure Time (min) 960 to 1,440, 240 to 360, 120 to 240, 15 to 30
    Viscosity (cPs) 20,000, 20,000, 21,000 Test Method
    Work / Pot Time (min) 120, 140, 160 Test Method
    Mix Ratio 100:100 (by volume), 100:200 (by volume), 100:300 (by volume), 100:100 (by weight), 100:200 (by weight), 100:300 (by weight)
    Bond Strength
    Shear Strength (psi) 2,400 Test Method
    Material Resistance
    High Temperature Resistance (°C) 90, 80, 65
    Low Temperature Resistance (°C) -40, -55, -55
    Conductivity
    Dissipation Factor 0.03000 Test Method
    Dielectric Strength (V/mil) 400 Test Method
    Dielectric Constant 3.00 Test Method
    Volume Resistivity (O) Rigid: >1e13 (ohms/cm), Semi rigid: >1e13 (ohms/cm), Flexible: >1e10 (ohms/cm)
    Hardness
    Shore A Hardness 45, Adjustable Test Method
    Shore D Hardness 75, 52, Adjustable Test Method
    Flexibility Adjustable
    Other Properties
    Specific Gravity 1.170, 0.970
    Density (g/cm³) 1.060, 1.030, 1.010
    Business Information
    Shelf Life Details Shelf Life Details, Shelf Life Details, A shelf life of 12 months when stored at or below 25°C (77°F).
    Shelf Life (mon) 12 Part A, 12 Part B, 12

  • Best Practices for Henkel ETP 352

    *See Terms of Use Below

    1. Surface Preparation

      For optimum bond strength and durability, the substrate surfaces to be bonded should be clean and dry. Chemical treatment of metallic surfaces gives optimum durability, but a simple abrade and degrease process may often be adequate. Cleaning or degreasing of plastic and composite surfaces is generally recommended to remove mold release agents which may inhibit optimum bonding results.

    2. Application

      Mate the two substrates together and clamp the assembly until handling strength is achieved.

      Full cure is obtained within 24 hours of adhesive application at room temperature, 25°C (77°F).

      The curing temperature may be increased to accelerate the full cure of the adhesive

    3. Mixing

      Thoroughly mix the resin and the hardener, taking care not to introduce excess air into the bulk material. The optimum method of mixing is accomplished via in-line static mixers with a minimum of 18 mixing elements. Once mixed thoroughly, to a uniform color

      i.e.,. no visible streaks, apply a bead of adhesive to one of the bonding surfaces.

      BONDMASTER ETP 352 Part A & Part B should not be mixed in large quantities, as a vigorous chemical reaction will occur generating a significant amount of heat and vapors.

    4. Clean-Up

      Unreacted resin & hardener can be cleaned using acetone, isopropanol or methyl ethyl ketone (MEK).

  • Comparable Materials for Henkel ETP 352

    *See Terms of Use Below

    Spec Engine® Results

    • Henkel
      Stycast 2741 LV w/ Catalyst 15 LV(Henkel)

      Black filled room temperature curing epoxy encapsulant. It has excellent shock and impact resistance and excellent adhesion to glass, metals, plastics and ceramics.

    • Henkel
      ETP 351(Henkel)

      • Two-Part • General Purpose • Adjustable Flexibility Epoxy Adhesive • Wide Range of Product Assembly Applications • Bonding Dissimilar Substrates • Room Temperature Curable, Accelerated by Heat • Easy to Use and Apply • Easy Mix Ratio • Adjustable Hardness and Flexibility • Adhesion to a Wide Variety of Substrates •

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Viscosity Test Methods
Viscosity Test Method Temperature
20,000 cPs Brookfield Viscosity, at 25°C 77°F,Rigid 25°C
20,000 cPs Brookfield Viscosity, at 25°C (77°F), Semi Rigid 25°C
21,000 cPs Brookfield Viscosity, at 25°C (77°F), Flexible 25°C
Work / Pot Time Test Methods
Work / Pot Time Test Method
120 min Rigid
140 min Semi-Rigid
160 min Flexible
Shear Strength Test Methods
Shear Strength Type Substrate Test Temperature Test Method
2,400 psi Lap shear strength Al to Al 25°C ASTM D-1002, Rigid
Dielectric Constant Test Methods
Dielectric Constant Test Method
3.00 Dielectric constant, 1 MHz, ASTM D-1550
Dielectric Strength Test Methods
Dielectric Strength Test Method
400 V/mil ASTM D-150
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.03000 Dissipation factor, 1 MHz, ASTM D-257
Shore A Hardness Test Methods
Shore A Hardness Shore Hardness Test Method
45 Hardness/Durometer Test Method
Adjustable ASTM D-2240
Shore D Hardness Test Methods
Shore D Hardness Shore Hardness Test Method
75 Hardness/Durometer Test Method
52 ASTM D-2240
Adjustable ASTM D-2240