Henkel Loctite 3609 Datasheet Henkel Loctite 3609

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  • Description for Henkel Loctite 3609

    It is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where medium to high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required.

    *See Terms of Use Below

    Brand Loctite
    Chemical Resistance Air, Chemical Resistance: Solvent resistance
    Application Type Bond, Mount
    1 Part or 2 Part 1-Part
    Material Form Gel
    Substrate Steel (grit blasted), Mild steel (grit blasted)
    Industry Bonding of surface mounted devices to printed circuit boards, Bonding of surface mounted devices to printed circuit boards
    Manufacturer Henkel
    Chemistry Epoxy
    Cure Method Heat
    Cure Temperature (°C) 150
    Cure Time (min) 1.50 to 2.00
    Viscosity (cPs) 0.16 to 2.0 (Pa.s)
    Color dark, Red
    High Temperature Resistance (°C) Heat
    Volume Resistivity (O) 2e15 (O·cm)
    Density (g/cm³) 1.400
  • Technical Data for Henkel Loctite 3609

    Overview
    • Chemical Resistance
      • Chemical Resistance - Air
      • Chemical Resistance : Relative Solvent Resistance - Solvent resistance
    • Application Type
    • 1 Part or 2 Part
      • 1-Part
    • Material Form
      • Gel
    • Substrate
      • Steel - Steel (grit blasted), Mild steel (grit blasted)
      • Other - SMD components, FR4 board
    • Industry
      • Printed Circuit Board (PCB) - Bonding of surface mounted devices to printed circuit boards
      • Surface Mount - Bonding of surface mounted devices to printed circuit boards
      • Industrial - Mounted devices
    • Chemistry
    • Application Method
      • Other - Syringe
    • Cure Method
      • Heat
    • Color
      • Red
      • Other - dark
    • Brand
      • Loctite
    Specifications
    Cure Specs
    Cure Temperature (°C) 150
    Cure Time (min) 1.50 to 2.00
    Viscosity (cPs) 0.16 to 2.0 (Pa.s) Test Method
    Bond Strength
    Shear Strength (psi) >1,450 Test Method
    Material Resistance
    Environmental Resistance Environmental Resistance
    High Temperature Resistance (°C) Heat
    Moisture/Humidity Resistance humidity
    Conductivity
    Dissipation Factor 0.00900, 0.03000, 0.03000, 0.03000 Test Method
    Dielectric Constant 3.70, 3.30, 3.20, 3.10 Test Method
    Thermal Conductivity (W/m°K) 0.40 Test Method
    Surface Resistivity (O) 2e15 (ohms) Test Method
    Volume Resistivity (O) 2e15 (O·cm) Test Method
    Other Properties
    Glass Transition Temp (Tg) (°C) 73 Test Method
    Specific Gravity 1.200 Test Method
    Coefficient of Thermal Expansion (CTE) 145e-6 (K(-1)) Test Method
    Density (g/cm³) 1.400 Test Method
    Business Information
    Shelf Life Details Storage: Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling.;Optimal Storage: 2 °C to 8 °C. Storage below 2 °C or greater than 8 °C can adversely affect product properties. Material removed from containers may be contaminated during use. Do not return product to the original container. Henkel Corporation cannot assume responsibility for product which has been contaminated or stored under conditions other than those previously indicated.
    Shelf Life Temperature (°F) 36 to 46
  • Best Practices for Henkel Loctite 3609

    *See Terms of Use Below

    1. Application

      3609™ is supplied de-aerated in a range of ready-to-use syringes which fit straight into a variety of air pressure/time dispensing systems commonly available.

      After storage in a refrigerator the adhesive must be allowed to equilibrate to room temperature before use, typically 2 to 4 hours.

      Avoid cross contamination with other adhesive residues by ensuring dispense nozzles, adapters etc. are thoroughly cleaned.

      Do not leave dirty nozzles on dispensing equipment while not in use or soaking in solvents for long periods of time.

      The quantity of adhesive dispensed will depend on the dispense pressure, time, nozzle size and temperature.

      These parameters will vary depending on the type of dispensing system used and should be optimized accordingly.

      Dispensing temperature should ideally be controlled at a value between 30 °C to 35 °C for optimum results, however higher dispense temperatures are possible.

      3609™ can also be dispensed using positive displacement pump systems.

      The product is not recommended for dispensing by pin transfer.

    2. Curing

      Recommended conditions for curing are exposure to heat above 100 °C (typically 90-120 seconds @ 150 °C). Rate of cure and final strength will depend on the residence time at the cure temperature.

    3. Clean-Up

      Uncured adhesive can be cleaned from the board with isopropanol, MEK or ester blends such as LOCTITE® 7360.

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    *See Terms of Use Below

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Viscosity Test Methods
Viscosity Temperature
0.16 to 2.0 (Pa.s) 25°C
Shear Strength Test Methods
Shear Strength Type Cure Time Cure Temperature Substrate Test Method
>1,450 psi Lap shear strength 30 min 150°C Steel (grit blasted) ISO 4587, Cured for 30 minutes @ 150 °C
Dielectric Constant Test Methods
Dielectric Constant Test Method
3.70 IEC 60250, 1 KHz
3.30 IEC 60250, 10 KHz
3.20 IEC 60250, 1000 KHz
3.10 IEC 60250, 10000 KHz
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00900 IEC 60250, 1 KHz
0.03000 IEC 60250, 10 KHz
0.03000 IEC 60250, 1000 KHz
0.03000 IEC 60250, 10000 KHz
Surface Resistivity Test Methods
Surface Resistivity Test Method
2e15 (ohms) IEC 60093
Thermal Conductivity Test Methods
Thermal Conductivity Test Method
0.40 W/m°K ISO 8302
Volume Resistivity Test Methods
Volume Resistivity Test Method
2e15 (O·cm) IEC 60093
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Temperature (°C) CTE Time CTE Test Method
145e-6 (K(-1)) 150°C 30 min ISO 11359-2, cured for 30 minutes @150oC
Density Test Methods
Density Temperature Test Method
1.400 g/cm³ 25°C BS 5350-B1, Cured for 30 minutes @ 150 °C
Glass Transition Temp (Tg) Test Methods
Glass Transition Temp (Tg) Glass Transition Temperature (Tg) Test Method
73°C ASTM D 4065, Cured for 30 minutes @ 150oC
Specific Gravity Test Methods
Specific Gravity Temperature
1.200 25°C