Henkel Loctite Ablestik 8006NS

Henkel Loctite Ablestik 8006NS Datasheet
  • Description for Henkel Loctite Ablestik 8006NS

    Non-conductive die attach adhesive has been formulated for use in high throughput die attach applications.

    *See Terms of Use Below

    Brand Ablestik, Loctite
    Application Type Bond
    1 Part or 2 Part 1 Part
    Material Form Liquid
    Industry Die attach, Wafer backside coating, Leadframe
    Manufacturer Henkel
    Chemistry Epoxy
    Cure Method Heat cure
    Cure Temperature (°C) 160, 175
    Cure Time (min) 120, 30
    Viscosity (cPs) 55,000
    Color White
    Non-conductive Non-conductive
  • Technical Data for Henkel Loctite Ablestik 8006NS

    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Liquid
    • Industry
      • Wafer - Wafer backside coating
      • Leadframe
      • Die-Attach - Die attach
    • Chemistry
    • Application Method
      • Other - Stencil
      • Screen Print - Screen printing
    • Cure Method
      • Heat - Heat cure
    • Color
      • White
    • Brand
      • Ablestik
      • Loctite
    Cure Specs
    Cure Temperature (°C) 160, 175 Test Method
    Cure Time (min) 120, 30 Test Method
    Viscosity (cPs) 55,000 Test Method
    Work / Pot Time (min) <1,440 Test Method
    Thixotropic Thixotropic
    Bond Strength
    Shear Strength (psi) 23 kg-f Test Method
    Non-conductive Non-conductive
    Filler Alumina/Silica
    Dielectric Strength (V/mil) 728 Test Method
    Thermal Conductivity (W/m°K) 0.44 Test Method
    Volume Resistivity (O) 0.43e14 ohms-cm Test Method
    Modulus (psi) 856,700, 634,500, 176,400, 10,100 Test Method
    Business Information
    Shelf Life Details Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling., Optimal Storage: -40 °C. Storage below minus (-)40 °C or greater than minus (-)40 °C can adversely affect product properties., Material removed from containers may be contaminated during use. Do not return product to the original container. Henkel Corporation cannot assume responsibility for product which has been contaminated or stored under conditions other than those previously indicated. If additional information is required, please contact your local Technical Service Center or Customer Service Representative.
    Shelf Life Temperature (°F) -40
    Shelf Life (mon) 12
  • Best Practices for Henkel Loctite Ablestik 8006NS

    *See Terms of Use Below

    1. Application

      Adhesive is normally applied by screen printing using stainless steel mesh. Typical screen mesh is 105 wires per inch with a <6 micron emulsion coating. Squeegee pressure of 2 to 4 kilos and print speed of 10 to 40 mm/sec with a print gap of 3 mm are suitable to print 150 mm diameter wafers. Lower pressure and slower speed may be used for very thin wafers., Apply enough adhesive to the stencil to ensure complete filling of the stencil with a 15 to 20 mm diameter bead. Typically, this requires 20 to 50 cc of adhesive depending on the stencil size., For two-direction printing, double beading is recommended., NOTE: Please refer to the Wafer Backside Coating Applications and Data Package for this product to review process windows and recommendations for each step.

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Cure Time Test Methods
Cure Time Test Method
120 min
30 min Alternate Cure
Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
175°C Alternate Cure
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
<1,440 min Uncured 25°C
Viscosity Test Methods
Viscosity Test Method Temperature
55,000 cPs Brookfield CP51, Uncured, Speed 5 rpm 25°C
Shear Strength Test Methods
Shear Strength Type Cure Temperature Substrate Test Method
23 kg-f Die Shear Strength 25°C 2 x 2 mm Si die on ceramic Cured
Thermal Conductivity Test Methods
Thermal Conductivity Test Method
0.44 W/m°K Cured
Dielectric Strength Test Methods
Dielectric Strength Test Method
728 V/mil Cured
Volume Resistivity Test Methods
Volume Resistivity Test Method
0.43e14 ohms-cm Cured
Modulus Test Methods
Modulus Temperature Test Method
856,700 psi -65°C Tensile Modulus, DMTA, Cured
634,500 psi 25°C Tensile Modulus, DMTA, Cured
176,400 psi 150°C Tensile Modulus, DMTA, Cured
10,100 psi 250°C Tensile Modulus, DMTA, Cured