Henkel Loctite Ablestik CDF 200

Henkel Loctite Ablestik CDF 200 Datasheet
  • Description for Henkel Loctite Ablestik CDF 200

    A highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes.

    *See Terms of Use Below

    Brand Loctite, Ablestik
    Application Type Bond
    1 Part or 2 Part 1 Part
    Material Form Film
    Industry Die attach, Integrated circuits, Integrated components, Attachment of integrated circuits onto metallic leadframes, Thin wafer handling applications, Silicon wafer backside lamination, Attachment of integrated circuits onto metallic leadframes, Attachment of integrated components onto metallic leadframes, Silicon wafer backside lamination, Attachment of integrated circuits onto metallic leadframes
    Manufacturer Henkel
    Chemistry Hybrid
    Cure Method Heat cure
    Cure Temperature (°C) 25 to 200, 200, 25 to 175, 175
    Cure Time (min) 30, 60, 30, 60
    Color Silver
  • Technical Data for Henkel Loctite Ablestik CDF 200

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Film
    • Industry
      • Wafer - Thin wafer handling applications, Silicon wafer backside lamination
      • Laminate Packaging - Silicon wafer backside lamination
      • Leadframe - Attachment of integrated circuits onto metallic leadframes, Attachment of integrated circuits onto metallic leadframes
      • Electronics - Integrated circuits, Integrated components, Attachment of integrated circuits onto metallic leadframes, Attachment of integrated components onto metallic leadframes
      • Die-Attach - Die attach
      • Packaging - SO, SOIC, QFN
    • Chemistry
      • Other - Hybrid
    • Cure Method
      • Heat - Heat cure
    • Color
      • Gray - Silver
    • Brand
      • Ablestik
      • Loctite
    Specifications
    Cure Specs
    Cure Temperature (°C) 25 to 200, 200, 25 to 175, 175 Test Method
    Cure Time (min) 30, 60, 30, 60 Test Method
    Work / Pot Time (min) 129,600 Test Method
    Bond Strength
    General Bond Strength (psi) Strong
    Shear Strength (psi) 1.3 (kg/mm²) Test Method
    Conductivity
    Filler Highly filled
    Electrical Conductivity (mhos/cm) High
    Thermal Conductivity (W/m°K) High, 2.30 Test Method
    Volume Resistivity (O) 0.0007 (ohm-cm) Test Method
    Hardness
    Modulus (psi) 783,216 Test Method
    Other Properties
    Glass Transition Temp (Tg) (°C) 15 Test Method
    Coefficient of Thermal Expansion (CTE) 48 (ppm/°C), 119 (ppm/°C) Test Method
    Business Information
    Shelf Life Details Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling.; Optimal Storage : 0 to 5 °C
    Shelf Life Temperature (°F) 32 to 41
    Shelf Life (mon) 12
  • Best Practices for Henkel Loctite Ablestik CDF 200

    *See Terms of Use Below

    1. Application

      Refrigerator storage is recommended.

      Care must be exercised to avoid entrapment of contaminants.

      Avoid overheating.

      Alternate thicknesses may be used depending on the application requirements.

      Recommended silicon wafer backside lamination temperature is 65ºC or higher.

  • Comparable Materials for Henkel Loctite Ablestik CDF 200

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Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
129,600 min Work Life, Uncured 25°C
Cure Time Test Methods
Cure Time Test Method
30 min Ramp
60 min
30 min Alternate Cure, Ramp
60 min Alternate Cure
Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
25 to 200°C Ramp
200°C
25 to 175°C Alternate Cure, Ramp
175°C Alternate Cure
Shear Strength Test Methods
Shear Strength Type Cure Temperature Test Method
1.3 (kg/mm²) Hot Die Shear Strength 260°C 2 X 2 mm (80 x 80 mil) die on PPF LF, Cured
Thermal Conductivity Test Methods
Thermal Conductivity Test Method
High
2.30 W/m°K ASTM E1461, Bulk, Cured
Volume Resistivity Test Methods
Volume Resistivity Test Method
0.0007 (ohm-cm) Bulk, Cured
Modulus Test Methods
Modulus Temperature Test Method
783,216 psi 25°C Tensile Modulus, Cured
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Test Method
48 (ppm/°C) Below Tg, Cured
119 (ppm/°C) Below Tg, Cured
Glass Transition Temp (Tg) Test Methods
Glass Transition Temp (Tg) Glass Transition Temperature (Tg) Test Method
15°C Cured