Henkel Loctite Ablestik CDF 200

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Description for Henkel Loctite Ablestik CDF 200

A highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes.

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Brand	Loctite, Ablestik
Application Type	Bond
1 Part or 2 Part	1-Part
Material Form	Film
Industry	Integrated circuits, Integrated components, Attachment of integrated circuits onto metallic leadframes, Die attach, Silicon wafer backside lamination, Attachment of integrated circuits onto metallic leadframes, Thin wafer handling applications, Attachment of integrated components onto metallic leadframes, Attachment of integrated circuits onto metallic leadframes, Silicon wafer backside lamination
Manufacturer	Henkel
Chemistry	Hybrid
Cure Method	Heat cure
Cure Temperature (°C)	25 to 200, 200, 25 to 175, 175
Cure Time (min)	30, 60, 30, 60
Color	Silver
Volume Resistivity (O)	0.0007 (ohm-cm)

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Technical Data for Henkel Loctite Ablestik CDF 200

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Overview

Application Type
- Adhesive - Bond
1 Part or 2 Part
- 1-Part
Material Form
- Film
Industry
- Laminate Packaging - Silicon wafer backside lamination
- Leadframe - Attachment of integrated circuits onto metallic leadframes, Attachment of integrated circuits onto metallic leadframes
- Wafer - Thin wafer handling applications, Silicon wafer backside lamination
- Electronics - Integrated circuits, Integrated components, Attachment of integrated circuits onto metallic leadframes, Attachment of integrated components onto metallic leadframes
- Die-Attach - Die attach
- Packaging - SO, SOIC, QFN
Chemistry
- Other - Hybrid
Cure Method
- Heat - Heat cure
Color
- Gray - Silver
Brand
- Ablestik
- Loctite

Specifications

Cure Specs

Cure Temperature (°C)	25 to 200, 200, 25 to 175, 175	Test Method
Cure Time (min)	30, 60, 30, 60	Test Method
Work / Pot Time (min)	129,600	Test Method

Bond Strength

General Bond Strength (psi)	Strong
Shear Strength (psi)	1.3 (kg/mm²)	Test Method

Conductivity

Filler	Highly filled
Electrical Conductivity (mhos/cm)	High
Thermal Conductivity (W/m°K)	High, 2.30	Test Method
Volume Resistivity (O)	0.0007 (ohm-cm)	Test Method

Hardness

Modulus (psi)	783,216	Test Method

Other Properties

Glass Transition Temp (Tg) (°C)	15	Test Method
Coefficient of Thermal Expansion (CTE)	48 (ppm/°C), 119 (ppm/°C)	Test Method

Business Information

Shelf Life Details	Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling.; Optimal Storage : 0 to 5 °C
Shelf Life Temperature (°F)	32 to 41
Shelf Life (mon)	12

Best Practices for Henkel Loctite Ablestik CDF 200

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1. Application
  
  Refrigerator storage is recommended.
  
  Care must be exercised to avoid entrapment of contaminants.
  
  Avoid overheating.
  
  Alternate thicknesses may be used depending on the application requirements.
  
  Recommended silicon wafer backside lamination temperature is 65ºC or higher.
Comparable Materials for Henkel Loctite Ablestik CDF 200

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Spec Engine^® Results
- Loctite Ablestik CF 3350(Henkel)
  ● Epoxy film adhesive ● High electrical conductivity ● High thermal conductivity ● Heat cure ● Gray Tan color ● Formulated for electrical, thermal and mechanical assembly applications.
- Loctite Ablestik 5025E(Henkel)
  It is an unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required.
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