Henkel Loctite Ablestik CT 5047-2 Datasheet Henkel Loctite Ablestik CT 5047-2

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  • Description for Henkel Loctite Ablestik CT 5047-2

    Two component, general purpose, room temperature cure. Adhesive - Electrically Conductive

    *See Terms of Use Below

    Brand Loctite, Hysol, Eccobond, Ablestik, Emerson & Cuming
    Application Type Bond
    1 Part or 2 Part 2-Part
    Material Form Liquid (Comp. B), Paste (Comp. A)
    Substrate Aluminum
    Industry Electrical, Electrical connections
    Manufacturer Henkel
    Chemistry Epoxy
    Cure Method Part A/Part B, Heat
    Cure Temperature (°C) 25, 65, 100
    Cure Time (min) 1,440, 120, 60
    High Temperature Resistance (°C) 130, Excellent
    Low Temperature Resistance (°C) -40
    Silver (Ag)-Filled Filler: Silver
    Volume Resistivity (O) 0.002 (ohms/cm), 0.02 (ohms/cm)

  • Technical Data for Henkel Loctite Ablestik CT 5047-2

    *See Terms of Use Below

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 2-Part
    • Material Form
      • Liquid - Liquid (Comp. B)
      • Paste - Paste (Comp. A)
    • Substrate
    • Industry
    • Chemistry
    • Application Method
      • Dispenser - Good Dispense Behavior
    • Cure Method
      • Heat
      • 2-Part Cure - Part A/Part B
    • Brand
      • Ablestik
      • Hysol
      • Loctite
      • Emerson & Cuming
      • Eccobond
    • Also Known As
      • Old Name - EccoBond CT 5047-2 A/B
    Specifications
    Cure Specs
    Cure Temperature (°C) 25, 65, 100
    Cure Time (min) 1,440, 120, 60
    Work / Pot Time (min) 60 Test Method
    Thixotropic Thixotropic
    Mix Ratio 100:6 (by volume), 100:6 (by weight)
    Bond Strength
    General Bond Strength (psi) High
    Tensile Strength (psi) 1,000 Test Method
    Material Resistance
    High Temperature Resistance (°C) 130, Excellent
    Low Temperature Resistance (°C) -40
    Conductivity
    Electrical Conductivity (mhos/cm) Good
    Thermal Conductivity (W/m°K) 2.00
    Volume Resistivity (O) 0.002 (ohms/cm), 0.02 (ohms/cm) Test Method
    Hardness
    Shore D Hardness 82 Test Method
    Other Properties
    Outgassing 0.39 (%TML), 0.00 (%CVCM) Test Method
    Business Information
    Shelf Life Temperature (°F) 77
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 24

  • Best Practices for Henkel Loctite Ablestik CT 5047-2

    *See Terms of Use Below

    1. Surface Preparation

      To ensure the long term performance of the bonded assembly, complete cleaning of the substrates should be performed to remove contamination such as oxide layers, dust, moisture, salt, and oils which can cause poor adhesion or corrosion in a bonded part. For information on proper substrate preparation, refer to the reprint “Good Adhesive Bonding Starts With Surface Preparation” available from Emerson & Cuming.

    2. Application

      Apply the adhesive to all surfaces to be bonded and join together. In most applications only contact pressure is required.

    3. Mixing

      Accurately weigh resin and hardener into a clean container in the recommended ratio. Weighing apparatus having an accuracy in proportion to the amounts being weighed should be used.

      Blend components by hand, using a kneading motion, for 2-3 minutes. Scrape the bottom and sides of the mixing container frequently to produce a uniform mixture.

    4. Curing

      Cure at any one of the recommended cure schedules. For optimum properties, cure at 65°C or higher.

  • Comparable Materials for Henkel Loctite Ablestik CT 5047-2

    *See Terms of Use Below

    Spec Engine® Results

    • Henkel
      Loctite Ablestik 64C(Henkel)

      A low cost, two component, non-silver, electrically conductive epoxy adhesive.

    • Master Bond
      Polymer System EP76M(Master Bond)

      A two component, nickel filled, electrically conductive epoxy system for high performance bonding, sealing and coating. It bonds well to a wide variety of substrates, including metals, composites, glass, ceramics, vulcanized rubbers and many plastics.

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Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
60 min 100 grams @ 25ºC 25°C
Tensile Strength Test Methods
Tensile Strength Type Substrate Test Temperature Test Method
1,000 psi Tensile Lap Shear Strength Aluminum to aluminum 25°C TP-21
Volume Resistivity Test Methods
Volume Resistivity Temp (°C) Test Method
0.002 (ohms/cm) 65°C Cured 2 hours @ 65ºC
0.02 (ohms/cm) 25°C Cured 24 hours @ 25ºC
Shore D Hardness Test Methods
Shore D Hardness Shore Hardness Test Method
82 TP-311
Outgassing Test Methods
Outgassing Temperature (°C) Test Method
0.39 (%TML) 100°C NASA OUTGASSING, per NASA Reference Publication 1124. Sample tested was cured for 24 hours @ 25°C plus 2 hours @ 65°C plus 1 hour @ 100°C.
0.00 (%CVCM) 100°C NASA OUTGASSING, per NASA Reference Publication 1124. Sample tested was cured for 24 hours @ 25°C plus 2 hours @ 65°C plus 1 hour @ 100°C.