Henkel Loctite E-2510

Henkel Loctite E-2510 Datasheet
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  • Description for Henkel Loctite E-2510

    • Single component epoxy • Low Shrinkage • High Temperature Resistance • Cures at elevated temperatures<br/>

    *See Terms of Use Below

    Brand Bondmaster, Loctite, Eccobond
    Application Type Bond
    1 Part or 2 Part 1 Part
    Material Form Paste
    Substrate High tech composite, Metal
    Industry Bicycle frames
    Manufacturer Henkel
    Chemistry Epoxy
    Cure Method Heat
    Cure Temperature (°C) 135, 149, 163
    Cure Time (min) 0.50, 0.25, 0.17
    Viscosity (cPs) Low
    Color Gray
    High Temperature Resistance (°C) High heat resistance, 177, 193
    Low Temperature Resistance (°C) -40, -40

  • Technical Data for Henkel Loctite E-2510

    *See Terms of Use Below

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Paste
    • Substrate
    • Industry
      • Automotive - Bicycle frames
      • Other - Lamp housing
    • Chemistry
    • Application Method
      • Dispenser
    • Cure Method
      • Heat
    • Color
      • Gray
    • Brand
      • Loctite
      • Bondmaster
      • Eccobond
    • Also Known As
      • Old Name - BMS Eccobond E-2510
    Specifications
    Cure Specs
    Cure Temperature (°C) 135, 149, 163
    Cure Time (min) 0.50, 0.25, 0.17
    Viscosity (cPs) Low
    Linear Shrinkage (%) Low
    Bond Strength
    General Bond Strength (psi) High
    Shear Strength (psi) 2,500, 3,000, 2,000, 500, 500 Test Method
    Material Resistance
    High Temperature Resistance (°C) High heat resistance, 177, 193
    Low Temperature Resistance (°C) 0, -40, -40
    Other Properties
    Specific Gravity 1.620 Test Method
    Flash Point (°F) >199.4 Test Method

  • Best Practices for Henkel Loctite E-2510

    *See Terms of Use Below

  • Comparable Materials for Henkel Loctite E-2510

    *See Terms of Use Below

    Spec Engine® Results

    • Henkel
      Eccobond E 3032(Henkel)

      • One component • Sag resistant paste • Low temperature cure • Excellent chemical resistance • High HDT • Non-conductive • Surface mount adhesive • Heat cure

    • Resinlab
      EP1330 Black(Resinlab)

      It is one-part heat cure epoxy polymer system. This product can also be used as a component staking compound, thermally conductive paste adhesive or a dam barrier in a “dam and fill” application when used in conjunction with EP1330LV.

    • Resinlab
      EP1330-SB5 Black(Resinlab)

      A one-part heat cure epoxy polymer system that is a modification of EP1330 with additional 5mil (0.005”) spacer beads

    • Compare All
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Shear Strength Test Methods
Shear Strength Type Substrate Test Method
2,500 psi LAP SHEAR STRENGTH Steel /Steel ASTM D1002
3,000 psi LAP SHEAR STRENGTH Aluminum / Aluminum ASTM D1002
2,000 psi LAP SHEAR STRENGTH Stainless Steel / Stainless Steel ASTM D1002
500 psi LAP SHEAR STRENGTH Glass / Glass ASTM D1002
500 psi LAP SHEAR STRENGTH Glass/ Steel ASTM D1002
Specific Gravity Test Methods
Specific Gravity Temperature
1.620 25°C
Flash Point Test Methods
Flash Point Test Method
>93.0°C TCC