Henkel Loctite Stycast A 316-48 Datasheet Henkel Loctite Stycast A 316-48

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  • Description for Henkel Loctite Stycast A 316-48

    • One component • Fast heat cure • Heat resistant • Non-conductive • Exceptional thermal stability • Excellent chemical resistance • Heat resistant adhesive • Pourable epoxy adhesive

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    Brand Loctite, Hysol, Stycast, Eccobond, Emerson & Cuming
    Chemical Resistance Excellent
    Application Type Bond
    1 Part or 2 Part 1-Part
    Material Form Liquid
    Substrate Aluminum, Ceramics, Metals, Plastics, Phenolics
    Industry Control modules, Automotive, Sensors, Harsh automotive applications
    Manufacturer Henkel
    Chemistry Epoxy
    Cure Method Heat
    Cure Temperature (°C) 100, 120, 140, 160
    Cure Time (min) Fast, 120 to 240, 30, 5.00, 3.00, 1.00
    Viscosity (cPs) Pourable, 50,000
    Color Black
    High Temperature Resistance (°C) 180, Heat Resistant, Exceptional thermal stability
    Low Temperature Resistance (°C) -40
    Non-conductive Non-conductive
    Volume Resistivity (O) 1e15 (ohms/cm), 3e13 (ohms/cm), 1e15 (ohms-cm), 3e13 (ohms-cm)

  • Technical Data for Henkel Loctite Stycast A 316-48

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    Overview
    • Chemical Resistance
      • Chemical Resistance - Excellent
    • Application Type
    • 1 Part or 2 Part
      • 1-Part
    • Material Form
      • Liquid
    • Substrate
    • Industry
    • Chemistry
    • Cure Method
      • Heat
    • Color
      • Black
    • Brand
      • Hysol
      • Loctite
      • Emerson & Cuming
      • Stycast
      • Eccobond
    • Also Known As
      • Old Name - EccoBond A 316-48
    Specifications
    Cure Specs
    Cure Temperature (°C) 100, 120, 140, 160
    Cure Time (min) Fast, 120 to 240, 30, 5.00, 3.00, 1.00
    Viscosity (cPs) Pourable, 50,000 Test Method
    Bond Strength
    Tensile Strength (psi) 2,500 Test Method
    Material Resistance
    High Temperature Resistance (°C) 180, Heat Resistant, Exceptional thermal stability Test Method
    Low Temperature Resistance (°C) -40 Test Method
    Conductivity
    Non-conductive Non-conductive
    Filler Oxide
    Dielectric Constant 3.75 Test Method
    Thermal Conductivity (W/m°K) 0.40 Test Method
    Volume Resistivity (O) 1e15 (ohms/cm), 3e13 (ohms/cm), 1e15 (ohms-cm), 3e13 (ohms-cm) Test Method
    Hardness
    Shore D Hardness 86, 40, 86, 40 Test Method
    Other Properties
    Glass Transition Temp (Tg) (°C) 145 Test Method
    Specific Gravity 1.400 Test Method
    Coefficient of Thermal Expansion (CTE) 55 (ppm/°C), 155 (ppm/°C) Test Method
    Business Information
    Shelf Life Details Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling.
    Shelf Life Temperature (°F) 77
    Shelf Life (mon) 3

  • Best Practices for Henkel Loctite Stycast A 316-48

    *See Terms of Use Below

    1. Surface Preparation

      Complete cleaning of the substrates should be performed to remove contamination such as oxide layers, dust, moisture, salt and oils which can cause poor adhesion or corrosion in a bonded part

    2. Application

      Apply the adhesive to all surfaces to be bonded and join together. In most applications only contact pressure is required.

    3. Curing

      Cure at any of the following schedules. For optimum performance, follow the initial cure with a post cure of 2 to 4 hours at the highest expected use temperature.

  • Comparable Materials for Henkel Loctite Stycast A 316-48

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    Spec Engine® Results

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Viscosity Test Methods
Viscosity Test Method
Pourable
50,000 cPs Brookfield, uncured
Tensile Strength Test Methods
Tensile Strength Cure Temperature Substrate
2,500 psi 25°C Aluminum
High Temperature Resistance Test Methods
High Temperature Resistance Test Method
180°C Operating Temperature
Heat Resistant
Exceptional thermal stability
Low Temperature Resistance Test Methods
Low Temperature Resistance Test Method
-40°C Operating Temperature
Dielectric Constant Test Methods
Dielectric Constant Test Method
3.75 IEC 60250, 1 KHz, Cured
Thermal Conductivity Test Methods
Thermal Conductivity Test Method
0.40 W/m°K Cured
Volume Resistivity Test Methods
Volume Resistivity Temp (°C) Test Method
1e15 (ohms/cm) 25°C TP-183
3e13 (ohms/cm) 130°C TP-183
1e15 (ohms-cm) 25°C Cured
3e13 (ohms-cm) 25°C Cured
Shore D Hardness Test Methods
Shore D Hardness Shore Hardness Test Method Hardness Temperature
86 TP-311 25°C
40 TP-311 130°C
86 Cured 25°C
40 Cured 130°C
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Test Method
55 (ppm/°C) ISO 11359-2, Below Tg, Cured
155 (ppm/°C) ISO 11359-2, Above Tg, Cured
Density Test Methods
Density Test Method
Glass Transition Temp (Tg) Test Methods
Glass Transition Temp (Tg) Glass Transition Temperature (Tg) Test Method
145°C ISO 11357-2, Cured
Specific Gravity Test Methods
Specific Gravity Test Method
1.400 Uncured