Henkel Product E-310

Henkel Product E-310 Datasheet
  • Description for Henkel Product E-310

    A single-component epoxy designed for structural bonding of metal, glass and plastic. The single component epoxy cures at elevated temperatures. Excellent vibration and impact resistance. High viscosity at curing temperature.<br/><br/>

    *See Terms of Use Below

    Brand Loctite, Bondmaster
    Application Type Bond
    1 Part or 2 Part 1 Part
    Material Form Paste
    Substrate Aluminum, Copper, Glass, Carbide, Plastic, Steel, Stainless Steel, Metal: Brass, Ferrite, SMC Plastic, Metal, Thermoset Plastics
    Manufacturer Henkel
    Chemistry Epoxy
    Cure Method Heat
    Cure Temperature (°C) 150, 180, 200
    Cure Time (min) 45, 17, 12
    Viscosity (cPs) High, 400,000
    Color Silver-Gray
    Chemical Resistance Alcohols, Aqueous, Hydrocarbons, Salt spray, Water
    Relative Solvent Resistance Chemical Resistance: Halogenated solvents
    High Temperature Resistance (°C) 204
    Low Temperature Resistance (°C) -85
  • Technical Data

    Overview
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    Specifications
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  • Best Practices

    *See Terms of Use Below

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Set Time Test Methods
Set Time Set Temperature
2.33 min 150°C
0.67 min 180°C
0.33 min 200°C
Viscosity Test Methods
Viscosity Temperature
High
400,000 cPs 25°C
Work / Pot Time Test Methods
Work / Pot Time Test Method
1,440 min The work life refers to the use life of the epoxy after application of the adhesive to the bonding surface
Peel Strength Test Methods
Peel Strength Substrate Test Method
24 (lb / linear inch) Steel/Steel ASTM 1876
Shear Strength Test Methods
Shear Strength Substrate Test Method
6,000 psi Steel/Steel ASTM D1002
5,800 psi Aluminum/Aluminum ASTM D1002
5,800 psi Stainless steel/Stainless steel ASTM D1002
4,000 psi Copper/Copper ASTM D1002
3,800 psi Brass/Brass ASTM D1002
5,800 psi Carbide/Carbide ASTM D1002
5,800 psi Ferrite/Ferrite ASTM D1002, Denotes substrate failure of the bonded material, not the adhesive joint.
1,800 psi SMC Plastic/SMC Plastic ASTM D1002, Denotes substrate failure of the bonded material, not the adhesive joint.
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Test Method
57.7e-6 (in./ in/°C) Below Tg
173e-6 (in./ in/°C) Above Tg
Specific Gravity Test Methods
Specific Gravity Temperature
1.500 25°C