Masterbond EP21LVMed

Masterbond EP21LVMed Datasheet
  • Description for Masterbond EP21LVMed

    Masterbond EP21LVMed is a 2 Part Elevated temperatures Epoxy Liquid used to Bonding a variety of substrates, Metals and Glass

    *See Terms of Use Below

    Application Type Bonding, Sealing, Coating, Encapsulating, Casting
    1 Part or 2 Part 2 Part
    Material Form Liquid
    Substrate Metals, Glass, Ceramics, Wood, Rubbers, Many plastics, Aluminum
    Manufacturer Masterbond
    Chemistry Epoxy
    Cure Method Elevated temperatures, Part A/Part B
    Cure Temperature (°C) 25, 24, 93
    Viscosity (cPs) Low
    Chemical Resistance Excellent chemical resistance
    High Temperature Resistance (°C) 121
    Low Temperature Resistance (°C) -54
    Other Resistance Outstanding thermal cycling resistance
    Key Specifications USP (United States Pharmacopeia): Class VI: USP Class VI certified
  • Technical Data

    Overview
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    Specifications
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  • Best Practices

    *See Terms of Use Below

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  • Comparable Materials

    *See Terms of Use Below

Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
Shear Strength Test Methods
Shear Strength Type Substrate Test Temperature
>2,800 psi Bond shear strength Aluminum to Aluminum 24°C
Tensile Strength Test Methods
Tensile Strength Test Temperature
>7,500 psi 24°C
Volume Resistivity Test Methods
Volume Resistivity Temp (°C)
>10(15) (ohm-cm) 24°C
Dielectric Constant Test Methods
Dielectric Constant Temperature Test Method
2.79 24°C 60Hz
Dielectric Strength Test Methods
Dielectric Strength Temperature Test Method
440 V/mil 24°C 1/8 inch thick test specimen
Good electrical insulation properties
Modulus Test Methods
Modulus Temperature Test Method
300,000 to 350,000 psi 24°C Tensile
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Temperature (°C)
50 to 55e-6 (in/in °C) 24°C