• Description for Masterbond EP30AN-1

    Masterbond EP30AN-1 is a 2 Part Part A/Part B Epoxy Liquid used to Adhere Aluminum and A wide variety of substrates

    *See Terms of Use Below

    Application Type Bonding, Coating, Potting, Sealing
    1 Part or 2 Part 2 Part
    Material Form Liquid
    Substrate Aluminum
    Industry Widely used in applications where electrical isolation properties are required
    Manufacturer Masterbond
    Chemistry Epoxy
    Cure Method Part A/Part B, Elevated temperature cure, Room temperature cure
    Cure Temperature (°C) 20 to 25 Room temperature, 24, 93, Elevated temperature
    Cure Time (min) 2,880 to 4,320, 120 to 180, Fast
    Viscosity (cPs) Low, 5,000 to 6,000, Excellent flow, Smoothly
    Chemical Resistance Outstanding Chemical Resistance, Water resistance, Oils resistance
    High Temperature Resistance (°C) 121
    Low Temperature Resistance (°C) -51
    Other Resistance Resist to Thermal cycling
    Key Specifications RoHS Compliant
  • Technical Data

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  • Best Practices

    *See Terms of Use Below

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Viscosity Test Methods
Viscosity Temperature
5,000 to 6,000 cPs 24°C
Excellent flow
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
30 to 45 min After mixing, 100 gram batch 24°C
Compressive Strength Test Methods
Compressive Strength Cure Temperature Test Temperature
24,000 to 26,000 psi 24°C 24°C
Tensile Strength Test Methods
Tensile Strength Type Cure Temperature Substrate Test Temperature
700 to 900 psi Lap shear 24°C Aluminum to aluminum 24°C
5,000 to 6,000 psi 24°C
Shear Strength Test Methods
Shear Strength Type Cure Time Cure Temperature Substrate
700 to 900 psi Tensile lap shear strength 24°C Aluminum to Aluminum
>800 psi Tensile lap shear strength >43,200 min 24°C Aluminum to Aluminum
High Temperature Resistance Test Methods
High Temperature Resistance Test Method
121°C Service temperature
Low Temperature Resistance Test Methods
Low Temperature Resistance Test Method
-51°C Service temperature
Dielectric Constant Test Methods
Dielectric Constant Temperature Test Method
4.70 24°C 60 Hz
6.20 25°C 1 KHz
5.90 25°C 1 MHz
0.02 % 24°C CVCM
0.82 % 24°C TML
Dielectric Strength Test Methods
Dielectric Strength Temperature Test Method
Excellent electrical insulation properties
>400 V/mil 24°C 1/8" thick test specimen
Thermal Conductivity Test Methods
Thermal Conductivity Temperature
3.31 to 3.61 W/m°K 24°C
Volume Resistivity Test Methods
Volume Resistivity Temp (°C)
4.8e14 (ohm-cm) 24°C
1.0e12 (ohm-cm) 93°C
Shore D Hardness Test Methods
Shore D Hardness Hardness Temperature
85 to 90 24°C
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Temperature (°C)
20 to 22e-6 (in/in/°C) 24°C