Parker Chomerics Cho-bond 1029

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Description for Parker Chomerics Cho-bond 1029

A silver plated copper filled, two-component conductive silicone designed for applications where a flexible, strong, conductive electrical bond must be achieved.

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Application Type	Bonding, Sealing, Repair
1 Part or 2 Part	2-Part
Material Form	Thick Paste
Substrate	EMI gaskets to metal substrates, Metal
Manufacturer	Parker Chomerics
Chemistry	Silicone
Cure Method	Heat, 2-Part Cure
Cure Temperature (°C)	121, 25
Cure Time (min)	30, 10,080
Color	Brownish Red
High Temperature Resistance (°C)	125
Low Temperature Resistance (°C)	-55
Silver (Ag)-Filled	Filler: Silver-Plated Copper filled
Volume Resistivity (O)	0.060 (ohm-cm)

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Technical Data for Parker Chomerics Cho-bond 1029

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Overview

Application Type
- Adhesive - Bonding
- Repair & Maintenance - Repair
- Sealant - Sealing
1 Part or 2 Part
- 2-Part
Material Form
- Paste - Thick Paste
Substrate
- Metal - EMI gaskets to metal substrates
- Other - Overhead surfaces, Vertical surfaces
Chemistry
- Silicone
Cure Method
- Heat
- 2-Part Cure
Color
- Red - Brownish Red

Specifications

Cure Specs

Cure Temperature (°C)	121, 25
Cure Time (min)	30, 10,080
Fixture or Handling Strength Time (min)	1,440	Test Method
Linear Shrinkage (%)	Minimal
Work / Pot Time (min)	120
Mix Ratio	1.0:2.5 (by weight)

Bond Strength

Peel Strength (piw)	Minimum 700 (N/m)	Test Method
Shear Strength (psi)	>450	Test Method

Material Resistance

High Temperature Resistance (°C)	125
Low Temperature Resistance (°C)	-55

Conductivity

Electrical Conductivity (mhos/cm)	Electrically Conductive
Volume Resistivity (O)	0.060 (ohm-cm)	Test Method

Hardness

Shore A Hardness	80	Test Method
Flexibility	Flexible, Strong

Other Properties

Specific Gravity	3.100	Test Method

Business Information

Shelf Life Temperature (°F)	77
Shelf Life (mon)	6

Best Practices for Parker Chomerics Cho-bond 1029

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