Resinlab Armstrong A-661 Datasheet Resinlab Armstrong A-661

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  • Description for Resinlab Armstrong A-661

    A two-part, smooth, brushable, non-sag, room temperature curing adhesive that produces bonds with excellent shear strength. Easy to apply paste that cures to handling strength overnight at room temperature.

    *See Terms of Use Below

    Brand Armstrong
    Application Type Bond
    1 Part or 2 Part 2-Part
    Material Form Paste
    Substrate Aluminium, Ceramic, Metal, Plastic, Steel, Wood
    Industry General Purpose
    Manufacturer Resinlab
    Chemistry Epoxy
    Cure Method 2-Part Cure, Heat Cure, Room temperature curing
    Cure Temperature (°C) 75, 25, 150
    Cure Time (min) 1,440, 10
    Viscosity (cPs) Non-sag, 185,000, Smooth
    High Temperature Resistance (°C) 205
    Low Temperature Resistance (°C) -40
  • Technical Data for Resinlab Armstrong A-661

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 2-Part
    • Material Form
      • Paste
    • Substrate
    • Industry
      • General Purpose
    • Chemistry
    • Application Method
      • Brush - Brushable
    • Cure Method
      • Room Temperature / Air Dry - Room temperature curing
      • Heat - Heat Cure
      • 2-Part Cure
    • Brand
      • Armstrong
    Specifications
    Cure Specs
    Cure Temperature (°C) 75, 25, 150 Test Method
    Cure Time (min) 1,440, 10 Test Method
    Viscosity (cPs) Non-sag, 185,000, Smooth Test Method
    Fixture or Handling Strength Time (min) Overnight Test Method
    Work / Pot Time (min) 180, 81 Test Method
    Thixotropic Thixotropic
    Mix Ratio 4:1 (by weight), 2.5:1 (by volume)
    Bond Strength
    General Bond Strength (psi) 5,300 Test Method
    Shear Strength (psi) Excellent, 3,300, 3,460, 760, 430 Test Method
    Tensile Strength (psi) 2,800 Test Method
    Material Resistance
    High Temperature Resistance (°C) 205 Test Method
    Low Temperature Resistance (°C) -40 Test Method
    Hardness
    Elongation (%) 2 Test Method
    Other Properties
    Specific Gravity 1.410 Test Method
    Business Information
    Shelf Life Details Store below 25°C out of sunlight and in original unopened containers. Refer to packaging specific quote for shelf life information., 12 months at 25 °C in bulk packages; Storage at 25 +/- 10 °C is optimum for most products., 9 months DOP at 25 °C in C-kit.; Storage at 25 +/- 10 °C is optimum for most products.
    Shelf Life Temperature (°F) <77, 77, 77
    Shelf Life Type Shelf Life Type, DOP
    Shelf Life (mon) 12, 9
  • Best Practices for Resinlab Armstrong A-661

    *See Terms of Use Below

    1. Application

      Easy to apply

    2. Mixing

      Bring both components to room temperature prior to mixing.

      Cartridge format: Mixer should be attached keeping the cartridge vertical and any air pocket purged this way. After the mixer contains material, the mixer tip can be dropped to dispense pre-bleed amount. Attach a new static mixer with each cartridge, then pre-bleed the first 3 inches of dispensed material or until a uniform color is obtained. Maintain adequate velocity during dispensing to ensure complete mixing.

      Bulk format: weigh and mix parts A and B accurately and thoroughly, scraping sides of container often. Do not pour from mixing container, transfer to a new container as residual unmixed material may cause a tacky spot on the surface of the casting. Maintain adequate velocity during dispensing to ensure complete mixing.

    3. Curing

      Allow to cure undisturbed until product is fully gelled or tack-free to the touch.

    4. Clean-Up

      Clean up uncured resin with suitable organic solvent such as MEK, acetone or other organic solvent.

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    *See Terms of Use Below

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
75°C Elevated cure
25°C
150°C
Cure Time Test Methods
Cure Time Test Method
1,440 min
10 min
Fixture or Handling Strength Time Test Methods
Fixture or Handling Strength Time Fixture-Handling Strength Time Temperature
Overnight 20 to 25°C Room Temperature
Viscosity Test Methods
Viscosity Test Method Temperature
Non-sag
185,000 cPs Mixed, @1/s, Rheometer parallel plate 25mm 455300006291 25°C
Smooth
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
180 min Work Life, 100g sample, Extrapolated from Henkel LDS 25°C
81 min Pot Life, defined as the time it takes for initial mixed viscosity to double, Rheometer parallel plate 25mm@1/s 455300006291 25°C
General Bond Strength Test Methods
General Bond Strength Type Cure Time Cure Temperature
5,300 psi Tensile Bond Strength 10 min 149°C
Tensile Strength Test Methods
Tensile Strength Cure Time Cure Temperature Test Temperature
2,800 psi 10 min 149°C 25°C
Shear Strength Test Methods
Shear Strength Type Cure Time Cure Temperature Substrate
Excellent
3,300 psi Lap Shear Strength 25°C 0.005” bond line Al to Al
3,460 psi Lap Shear Strength 82°C 0.005” bond line Al to Al
760 psi Lap Shear Strength 10 min 149°C 0.005” bond line Al to Al
430 psi Lap Shear Strength 204°C 0.005” bond line Al to Al
High Temperature Resistance Test Methods
High Temperature Resistance Test Method
205°C Operating Temperature Range is based on average design requirements and is not intended as a guarantee of suitability for all
Low Temperature Resistance Test Methods
Low Temperature Resistance Test Method
-40°C Operating Temperature Range is based on average design requirements and is not intended as a guarantee of suitability for all
Elongation Test Methods
Elongation Test Method
2 % Tensile Elongation, Extrapolated from Henkel LDS Cured 10 minutes @ 149 °C
Specific Gravity Test Methods
Specific Gravity Test Method
1.410 Mixed, Calculated