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Description for Resinlab Armstrong A-661
A two-part, smooth, brushable, non-sag, room temperature curing adhesive that produces bonds with excellent shear strength. Easy to apply paste that cures to handling strength overnight at room temperature.Brand Armstrong Application Type Bond 1 Part or 2 Part 2-Part Material Form Paste Substrate Aluminium, Ceramic, Metal, Plastic, Steel, Wood Industry General Purpose Manufacturer Resinlab Chemistry Epoxy Cure Method 2-Part Cure, Heat Cure, Room temperature curing Cure Temperature (°C) 75, 25, 150 Cure Time (min) 1,440, 10 Viscosity (cPs) Non-sag, 185,000, Smooth High Temperature Resistance (°C) 205 Low Temperature Resistance (°C) -40 -
Technical Data for Resinlab Armstrong A-661
Overview
Specifications
Cure Specs
Cure Temperature (°C) 75, 25, 150 Test Method Cure Time (min) 1,440, 10 Test Method Viscosity (cPs) Non-sag, 185,000, Smooth Test Method Fixture or Handling Strength Time (min) Overnight Test Method Work / Pot Time (min) 180, 81 Test Method Thixotropic Thixotropic Mix Ratio 4:1 (by weight), 2.5:1 (by volume) Bond Strength
General Bond Strength (psi) 5,300 Test Method Shear Strength (psi) Excellent, 3,300, 3,460, 760, 430 Test Method Tensile Strength (psi) 2,800 Test Method Material Resistance
High Temperature Resistance (°C) 205 Test Method Low Temperature Resistance (°C) -40 Test Method Hardness
Elongation (%) 2 Test Method Other Properties
Specific Gravity 1.410 Test Method Business Information
Shelf Life Details Store below 25°C out of sunlight and in original unopened containers. Refer to packaging specific quote for shelf life information., 12 months at 25 °C in bulk packages; Storage at 25 +/- 10 °C is optimum for most products., 9 months DOP at 25 °C in C-kit.; Storage at 25 +/- 10 °C is optimum for most products. Shelf Life Temperature (°F) <77, 77, 77 Shelf Life Type Shelf Life Type, DOP Shelf Life (mon) 12, 9 -
Best Practices for Resinlab Armstrong A-661
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Application
Easy to apply
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Mixing
Bring both components to room temperature prior to mixing.
Cartridge format: Mixer should be attached keeping the cartridge vertical and any air pocket purged this way. After the mixer contains material, the mixer tip can be dropped to dispense pre-bleed amount. Attach a new static mixer with each cartridge, then pre-bleed the first 3 inches of dispensed material or until a uniform color is obtained. Maintain adequate velocity during dispensing to ensure complete mixing.
Bulk format: weigh and mix parts A and B accurately and thoroughly, scraping sides of container often. Do not pour from mixing container, transfer to a new container as residual unmixed material may cause a tacky spot on the surface of the casting. Maintain adequate velocity during dispensing to ensure complete mixing.
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Curing
Allow to cure undisturbed until product is fully gelled or tack-free to the touch.
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Clean-Up
Clean up uncured resin with suitable organic solvent such as MEK, acetone or other organic solvent.
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Comparable Materials for Resinlab Armstrong A-661
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Cure Temperature Test Methods
Cure Temperature | Cure Time Test Method |
---|---|
75°C | Elevated cure |
25°C | |
150°C |
Cure Time Test Methods
Cure Time | Test Method |
---|---|
1,440 min | |
10 min |
Fixture or Handling Strength Time Test Methods
Fixture or Handling Strength Time | Fixture-Handling Strength Time Temperature |
---|---|
Overnight | 20 to 25°C Room Temperature |
Viscosity Test Methods
Viscosity | Test Method | Temperature |
---|---|---|
Non-sag | ||
185,000 cPs | Mixed, @1/s, Rheometer parallel plate 25mm 455300006291 | 25°C |
Smooth |
Work / Pot Time Test Methods
Work / Pot Time | Test Method | Temperature |
---|---|---|
180 min | Work Life, 100g sample, Extrapolated from Henkel LDS | 25°C |
81 min | Pot Life, defined as the time it takes for initial mixed viscosity to double, Rheometer parallel plate 25mm@1/s 455300006291 | 25°C |
General Bond Strength Test Methods
General Bond Strength | Type | Cure Time | Cure Temperature |
---|---|---|---|
5,300 psi | Tensile Bond Strength | 10 min | 149°C |
Tensile Strength Test Methods
Tensile Strength | Cure Time | Cure Temperature | Test Temperature |
---|---|---|---|
2,800 psi | 10 min | 149°C | 25°C |
Shear Strength Test Methods
Shear Strength | Type | Cure Time | Cure Temperature | Substrate |
---|---|---|---|---|
Excellent | ||||
3,300 psi | Lap Shear Strength | 25°C | 0.005” bond line Al to Al | |
3,460 psi | Lap Shear Strength | 82°C | 0.005” bond line Al to Al | |
760 psi | Lap Shear Strength | 10 min | 149°C | 0.005” bond line Al to Al |
430 psi | Lap Shear Strength | 204°C | 0.005” bond line Al to Al |
High Temperature Resistance Test Methods
High Temperature Resistance | Test Method |
---|---|
205°C | Operating Temperature Range is based on average design requirements and is not intended as a guarantee of suitability for all |
Low Temperature Resistance Test Methods
Low Temperature Resistance | Test Method |
---|---|
-40°C | Operating Temperature Range is based on average design requirements and is not intended as a guarantee of suitability for all |
Elongation Test Methods
Elongation | Test Method |
---|---|
2 % | Tensile Elongation, Extrapolated from Henkel LDS Cured 10 minutes @ 149 °C |
Specific Gravity Test Methods
Specific Gravity | Test Method |
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1.410 | Mixed, Calculated |