• Description for Resinlab EP11HT

    A two part filled epoxy adhesive, room temperature to a tough, semi-rigid material, good wetting to most surfaces and is very thixotropic to resist running and sagging, very good vibration and impact resistance.

    *See Terms of Use Below

    Application Type Bond
    1 Part or 2 Part 2 Part
    Material Form Thixotropic paste
    Substrate Aluminum, Ceramic, Copper, Fabric, Glass, Metal, Rubber: Neoprene, Nylon, Plastic, Polycarbonate, Polyester, Polyvinyl chloride (PVC), Rubber, Steel, Stone, Wood, 2024 T3 Aluminum Abraded/Mek wipe
    Industry Electronics, Military, Transportation
    Manufacturer Resinlab
    Chemistry Epoxy
    Application Method Trowel
    Cure Method Part A/Part B
    Cure Temperature (°C) 20 to 25, 20 to 25, 25, 65, 20 to 25
    Cure Time (min) 1,440 to 2,880, 1,440 to 4,320, 120, 120 to 240
    Viscosity (cPs) 700,000, Non-sag
    Color Gray, Red
    Chemical Resistance Inorganic acids & bases, Salt spray, Water
    Relative Solvent Resistance Chemical Resistance: Organic solvents
    High Temperature Resistance (°C) 150
    Low Temperature Resistance (°C) -40
  • Technical Data

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  • Best Practices

    *See Terms of Use Below

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Viscosity Test Methods
Viscosity Test Method Temperature
700,000 cPs TM R050-12 25°C
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
>120 min TM R050-19, 50 gram mass 25°C
Tensile Strength Test Methods
Tensile Strength Type Substrate Test Temperature Test Method
9,300 psi 25°C
3,500 psi Tensile lap shear strength Al to Al 25°C TM R050-36
8,200 psi 25°C
3,200 psi Tensile Lap shear strength 2024 T3 Aluminum Abraded/Mek wipe 25°C
Shear Strength Test Methods
Shear Strength Type Substrate Test Temperature Test Method
2,300 psi Lap shear strength 2024 T3 Al Abraded / MEK Wipe 25°C TM R050-37
2,350 psi Lap shear strength 2024 T3 Al Abraded / MEK Wipe 25°C
Dielectric Constant Test Methods
Dielectric Constant Temperature Test Method
4.50 25°C Dielectric constant, 100 Hz, Values considered typical to associated resin systems or extrapolated from other test results.
Dielectric Strength Test Methods
Dielectric Strength Temperature Test Method
410 V/mil 25°C Values considered typical to associated resin systems or extrapolated from other test results.
Thermal Conductivity Test Methods
Thermal Conductivity Temperature
0.49 W/m°K 25°C
Volume Resistivity Test Methods
Volume Resistivity Temp (°C) Test Method
8e14 (ohms/cm) 25°C Values considered typical to associated resin systems or extrapolated from other test results.
Elongation Test Methods
Elongation Test Method
1 to 2 % Tensile elongation At Break, TM R050-36
Shore D Hardness Test Methods
Shore D Hardness Shore Hardness Test Method Hardness Temperature
80 TM R050-17 25°C
Modulus Test Methods
Modulus Test Method
500,000 psi TM R050-36, Tensile Modulus
400,000 psi TM R050-38, Compressive Modulus
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Temperature (°C) CTE Test Method
53 (ppm/°C) 25°C Values considered typical to associated resin systems or extrapolated from other test results, Below Tg
135 (ppm/°C) Values considered typical to associated resin systems or extrapolated from other test results, Above Tg
Glass Transition Temp (Tg) Test Methods
Glass Transition Temp (Tg) Glass Transition Temperature (Tg) Test Method
77°C TM R050-25, by DSC
85°C by DSC
Specific Gravity Test Methods
Specific Gravity Temperature Test Method
1.250 25°C TM R050-16