Resinlab EP750

Resinlab EP750 Datasheet
  • Description for Resinlab EP750

    A two part unfilled epoxy structural adhesive, room temperature to a tough, semi-rigid polymer, good wetting and adhesion to most surfaces and has a free flowing viscosity, very good resistance, ASTM E-595 for outgassing.

    *See Terms of Use Below

    Application Type Bond
    1 Part or 2 Part 2 Part
    Material Form Liquid
    Substrate Aluminum, Ceramic, Copper, Fabric, Glass, Metal, Rubber: Neoprene, Nylon, Plastic, Polycarbonate, Polyester, Polyvinyl chloride (PVC), Rubber, Steel, Stone, Wood
    Industry Electronics, Military, Transportation
    Manufacturer Resinlab
    Chemistry Epoxy
    Cure Method Part A/Part B
    Cure Temperature (°C) 25, 25, 110, 65
    Cure Time (min) 1,440 to 2,880, 1,440 to 4,320, 10, 120
    Viscosity (cPs) Free flowing, 12,500
    Color Clear, Black
    Chemical Resistance Inorganic acids & bases, Salt spray, Good Water
    Relative Solvent Resistance Chemical Resistance: Organic solvents
    High Temperature Resistance (°C) 150
    Low Temperature Resistance (°C) -40
    Key Specifications FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency): CFR 21 175.105; CFR 21 175.300
  • Technical Data

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Viscosity Test Methods
Viscosity Test Method Temperature
Free flowing Brookfield Viscosity, R050-12
12,500 cPs Brookfield Viscosity, R050-12 25°C
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
>120 min TM R050-19, 50 grams mass 25°C
Tensile Strength Test Methods
Tensile Strength Test Temperature Test Method
3,000 psi 25°C R050-36/ASTM D638
7,500 psi 25°C Tensile strength, Lap shear (Al to Al)
2,500 psi 25°C
Compressive Strength Test Methods
Compressive Strength Test Temperature Test Method
75,000 psi 25°C R050-38/ASTM D695
Shear Strength Test Methods
Shear Strength Type Substrate Test Method
2,500 psi Lap shear strength 0.010” bond line Al to Al R050-37/ASTM D1002
Dielectric Constant Test Methods
Dielectric Constant Temperature Test Method
3.50 25°C 100Hz
Dielectric Strength Test Methods
Dielectric Strength Temperature
410 V/mil 25°C
Thermal Conductivity Test Methods
Thermal Conductivity Temperature
0.16 W/m°K 25°C
Volume Resistivity Test Methods
Volume Resistivity Temp (°C)
8.3e14 (ohms/cm) 25°C
Elongation Test Methods
Elongation Test Method
4 to 10 % TM R050-36, Tensile elongation, At Break
5 to 7 % Tensile, R050-36/ASTM D638
Shore D Hardness Test Methods
Shore D Hardness Shore Hardness Test Method Hardness Temperature
80 R050-17/ASTM D2240 25°C
Modulus Test Methods
Modulus Test Method
400,000 psi R050-36/ASTM D638
350,000 psi R050-38/ASTM D695
400 (KSI) Tensile modulus
350 (KSI) Compressive modulus
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Temperature (°C) CTE Test Method
62 (ppm/°C) 25°C below Tg
150 (ppm/°C) 25°C above Tg
60 (ppm/°C) 25°C CTE Test Method
Glass Transition Temp (Tg) Test Methods
Glass Transition Temp (Tg) Glass Transition Temperature (Tg) Test Method
70°C R050-61 by DSCfG
Specific Gravity Test Methods
Specific Gravity Temperature Test Method
1.070 25°C TM R050-16