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Description for Resinlab SEC1222
A silver filled, two component, room temperature curing epoxy adhesive. It is designed to cure completely at room temperature.Chemical Resistance Inorganic bases, Chemical Resistance: Organic solvents, Chemical Resistance: Inorganic acids, Chemical Resistance: Fluid Resistance: Water, Salt spray Application Type Bond 1 Part or 2 Part 2-Part Material Form Paste Substrate 2024 T3 Al Abraded, Various metals Industry Many electronic applications Manufacturer Resinlab Chemistry Epoxy Cure Method 2-Part Cure Cure Temperature (°C) 20 to 25 Room Temperature, 25, 25, 60, 25 Cure Time (min) 480, 1,440, 60, 1,440 to 4,320 Viscosity (cPs) 318,500, 560,000 Color Silver High Temperature Resistance (°C) 150 Low Temperature Resistance (°C) -40 Silver (Ag)-Filled Filler: Silver Filled Volume Resistivity (O) 0.003 (ohms/cm), 0.0014 (ohms/cm), 0.00089 (ohms/cm) -
Technical Data for Resinlab SEC1222
Overview
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Chemical Resistance
- Chemical Resistance : Fluid Resistance : Water Resistance - Water
- Chemical Resistance - Inorganic bases, Salt spray
- Chemical Resistance : Relative Solvent Resistance - Organic solvents
- Chemical Resistance : Acid Resistance - Inorganic acids
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Application Type
- Adhesive - Bond
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1 Part or 2 Part
- 2-Part
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Material Form
- Paste
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Industry
- Control Module
- Electronics - Many electronic applications
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Chemistry
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Application Method
- Dispenser - Manual syringes
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Cure Method
- 2-Part Cure
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Color
- Gray - Silver
Specifications
Cure Specs
Cure Temperature (°C) 20 to 25 Room Temperature, 25, 25, 60, 25 Cure Time (min) 480, 1,440, 60, 1,440 to 4,320 Viscosity (cPs) 318,500, 560,000 Test Method Fixture or Handling Strength Time (min) Several hours Linear Shrinkage (%) Low Work / Pot Time (min) 45, 0.75 Test Method Thixotropic Thixotropic Mix Ratio 1:1 (by volume), 1:1 (by weight) Bond Strength
Shear Strength (psi) 850, 850 Test Method Compressive Strength (psi) 1,500, 10,000, 1,300, 9,900 Test Method Tensile Strength (psi) 1,000, 1,000, 1,000 Test Method Material Resistance
Environmental Resistance Good High Temperature Resistance (°C) 150 Test Method Impact Resistance Impact, Good to Fair Low Temperature Resistance (°C) -40 Test Method Moisture/Humidity Resistance Excellent Vibration Resistance/Shock Resistance Vibration Conductivity
Dielectric Strength (V/mil) High Electrical Conductivity (mhos/cm) Excellent Thermal Conductivity (W/m°K) Very high, 1.60, 3.90 Test Method Volume Resistivity (O) 0.003 (ohms/cm), 0.0014 (ohms/cm), 0.00089 (ohms/cm) Test Method Hardness
Shore D Hardness 80, 70 Test Method Elongation (%) 3 to 5 Test Method Modulus (psi) 50,000, 65,000 Test Method Other Properties
Glass Transition Temp (Tg) (°C) 34, 17 Test Method Specific Gravity 3.900, 3.910 Test Method Coefficient of Thermal Expansion (CTE) 53 (ppm/°C), 110 (ppm/°C), 66 (ppm/ °C), 160 (ppm/ °C) Test Method % Solids (%) 100 Business Information
Shelf Life Details 180 days at –40C as pre-mix frozen.;It is best to store part A between 15° and 35°C to prevent crystallization or separation. In the event of crystallization, warm part A to 40 to 50°C and stir until uniform., 180 days at –40C as pre-mix frozen.;It is best to store part A between 15° and 35°C to prevent crystallization or separation. In the event of crystallization, warm part A to 40 to 50°C and stir until uniform., 6 months at 25 °C; As one-part pre-mixed and frozen: 6 months DOP @ -40 °C; Specialty packaging may be less.; NOTE: When supplied in non-PMF two-part packaging, Part A should be stored between 15 and 35 °C to prevent crystallization or separation. In the event of crystallization, warm Part A to 40-50 °C and stir until uniform., 6 months at 25 °C; As one-part pre-mixed and frozen: 6 months DOP @ -40 °C; Specialty packaging may be less.; NOTE: When supplied in non-PMF two-part packaging, Part A should be stored between 15 and 35 °C to prevent crystallization or separation. In the event of crystallization, warm Part A to 40-50 °C and stir until uniform. Shelf Life Temperature (°F) 77, -40 Shelf Life Type Shelf Life Type, DOP Shelf Life (mon) 6, 6, 6, 6 -
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Best Practices for Resinlab SEC1222
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Mixing
Bring both components to room temperature before use. Stir to assure homogenous consistency.
Weigh and mix parts A and B accurately and thoroughly, scraping sides of container. Often small amounts are mixed by laying out equal length beads on a glass slide and using a metal spatula to mix.
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Curing
Allow to cure undisturbed.
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Clean-Up
Clean up uncured resin with suitable organic solvent such as MEK, acetone or other organic solvent.
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Comparable Materials for Resinlab SEC1222
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Viscosity Test Methods
Viscosity | Test Method | Temperature |
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318,500 cPs | 25°C | |
560,000 cPs | Rheometer parallel plate 25mm@1/s 455300006291, Mixed | 25°C |
Work / Pot Time Test Methods
Work / Pot Time | Test Method | Temperature |
---|---|---|
45 min | Mass 5 grams, TM R050-19, Pot Life | 25°C |
0.75 min | Pot Life, 453560822627 | 25°C |
Compressive Strength Test Methods
Compressive Strength | Test Temperature | Test Method |
---|---|---|
1,500 psi | Yield strength, TM R050-38 | |
10,000 psi | Ultimate strength, TM R050-38 | |
1,300 psi | 25°C | Yield Strength, ASTM D695 |
9,900 psi | 25°C | ASTM D695 |
Tensile Strength Test Methods
Tensile Strength | Test Temperature | Test Method |
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1,000 psi | Yield strength, TM R050-36 | |
1,000 psi | Ultimate strength, TM R050-36 | |
1,000 psi | 25°C | ASTM D638 |
Shear Strength Test Methods
Shear Strength | Type | Substrate | Test Temperature | Test Method |
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850 psi | Lap shear strength | 2024 T3 Al Abraded / MEK Wipe | 25°C | TM R050-37 |
850 psi | Lap Shear Strength | Al to Al | 25°C | ASTM D1002, 0.010” bond line Al to Al |
High Temperature Resistance Test Methods
High Temperature Resistance | Test Method |
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150°C | Temperature Rating is based on average design requirements and is not intended as a guarantee of suitability for all applications operating at that temperature. |
Low Temperature Resistance Test Methods
Low Temperature Resistance | Test Method |
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-40°C | Temperature Rating is based on average design requirements and is not intended as a guarantee of suitability for all applications operating at that temperature. |
Thermal Conductivity Test Methods
Thermal Conductivity | Temperature | Test Method |
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Very high | 25°C | Thermal Conductivity Test Method |
1.60 W/m°K | ASTM C-177, Values considered typical to associated resin systems or extrapolated from other test results. | |
3.90 W/m°K | 25°C | 453560822409/ASTM E1461, by LFA |
Volume Resistivity Test Methods
Volume Resistivity | Temp (°C) | Test Method |
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0.003 (ohms/cm) | 25°C | 8 hours @ 25°C, 455300006612/ASTM D257, Estimated |
0.0014 (ohms/cm) | 25°C | 24 hours @ 25°C |
0.00089 (ohms/cm) | 25°C | 1 hour @ 60°C |
Elongation Test Methods
Elongation | Test Method |
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3 to 5 % | Tensile elongation, 455300006285/ASTM D638 |
Modulus Test Methods
Modulus | Test Method |
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50,000 psi | Tensile modulus, 455300006285/ASTM D638 |
65,000 psi | Compressive modulus, 455300006265/ASTM D695 |
Shore D Hardness Test Methods
Shore D Hardness | Shore Hardness Test Method |
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80 | TM R050-17 |
70 | 455300006287/ASTM D2240 |
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) | CTE Temperature (°C) | CTE Test Method |
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53 (ppm/°C) | 25°C | Below Tg, Values considered typical to associated resin systems or extrapolated from other test results. |
110 (ppm/°C) | 25°C | Above Tg, Values considered typical to associated resin systems or extrapolated from other test results. |
66 (ppm/ °C) | 25°C | Below Tg, by TMA, 455300005340 /ASTM E831, TMA, 5 °C/min |
160 (ppm/ °C) | 25°C | Above Tg, by TMA, 455300005340 /ASTM E831, TMA, 5 °C/min |
Glass Transition Temp (Tg) Test Methods
Glass Transition Temp (Tg) | Glass Transition Temperature (Tg) Test Method |
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34°C | by DSC, TM R050-25 |
17°C | 453560822409 by DSC |
Specific Gravity Test Methods
Specific Gravity | Temperature | Test Method |
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3.900 | 25°C | TM R050-16 |
3.910 | 25°C | Mixed, Calculated |