Resinlab SEC1222 Datasheet Resinlab SEC1222

Information provided by Gluespec
  • Description for Resinlab SEC1222

    A silver filled, two component, room temperature curing epoxy adhesive. It is designed to cure completely at room temperature.

    *See Terms of Use Below

    Chemical Resistance Inorganic bases, Chemical Resistance: Organic solvents, Chemical Resistance: Inorganic acids, Chemical Resistance: Fluid Resistance: Water, Salt spray
    Application Type Bond
    1 Part or 2 Part 2-Part
    Material Form Paste
    Substrate 2024 T3 Al Abraded, Various metals
    Industry Many electronic applications
    Manufacturer Resinlab
    Chemistry Epoxy
    Cure Method 2-Part Cure
    Cure Temperature (°C) 20 to 25 Room Temperature, 25, 25, 60, 25
    Cure Time (min) 480, 1,440, 60, 1,440 to 4,320
    Viscosity (cPs) 318,500, 560,000
    Color Silver
    High Temperature Resistance (°C) 150
    Low Temperature Resistance (°C) -40
    Silver (Ag)-Filled Filler: Silver Filled
    Volume Resistivity (O) 0.003 (ohms/cm), 0.0014 (ohms/cm), 0.00089 (ohms/cm)
  • Technical Data for Resinlab SEC1222

    Overview
    • Chemical Resistance
      • Chemical Resistance : Fluid Resistance : Water Resistance - Water
      • Chemical Resistance - Inorganic bases, Salt spray
      • Chemical Resistance : Relative Solvent Resistance - Organic solvents
      • Chemical Resistance : Acid Resistance - Inorganic acids
    • Application Type
    • 1 Part or 2 Part
      • 2-Part
    • Material Form
      • Paste
    • Substrate
      • Metal - Various metals
      • Aluminum - 2024 T3 Al Abraded
      • Other - Other common assembly materials
    • Industry
      • Control Module
      • Electronics - Many electronic applications
    • Chemistry
    • Application Method
      • Dispenser - Manual syringes
    • Cure Method
      • 2-Part Cure
    • Color
      • Gray - Silver
    Specifications
    Cure Specs
    Cure Temperature (°C) 20 to 25 Room Temperature, 25, 25, 60, 25
    Cure Time (min) 480, 1,440, 60, 1,440 to 4,320
    Viscosity (cPs) 318,500, 560,000 Test Method
    Fixture or Handling Strength Time (min) Several hours
    Linear Shrinkage (%) Low
    Work / Pot Time (min) 45, 0.75 Test Method
    Thixotropic Thixotropic
    Mix Ratio 1:1 (by volume), 1:1 (by weight)
    Bond Strength
    Shear Strength (psi) 850, 850 Test Method
    Compressive Strength (psi) 1,500, 10,000, 1,300, 9,900 Test Method
    Tensile Strength (psi) 1,000, 1,000, 1,000 Test Method
    Material Resistance
    Environmental Resistance Good
    High Temperature Resistance (°C) 150 Test Method
    Impact Resistance Impact, Good to Fair
    Low Temperature Resistance (°C) -40 Test Method
    Moisture/Humidity Resistance Excellent
    Vibration Resistance/Shock Resistance Vibration
    Conductivity
    Dielectric Strength (V/mil) High
    Electrical Conductivity (mhos/cm) Excellent
    Thermal Conductivity (W/m°K) Very high, 1.60, 3.90 Test Method
    Volume Resistivity (O) 0.003 (ohms/cm), 0.0014 (ohms/cm), 0.00089 (ohms/cm) Test Method
    Hardness
    Shore D Hardness 80, 70 Test Method
    Elongation (%) 3 to 5 Test Method
    Modulus (psi) 50,000, 65,000 Test Method
    Other Properties
    Glass Transition Temp (Tg) (°C) 34, 17 Test Method
    Specific Gravity 3.900, 3.910 Test Method
    Coefficient of Thermal Expansion (CTE) 53 (ppm/°C), 110 (ppm/°C), 66 (ppm/ °C), 160 (ppm/ °C) Test Method
    % Solids (%) 100
    Business Information
    Shelf Life Details 180 days at –40C as pre-mix frozen.;It is best to store part A between 15° and 35°C to prevent crystallization or separation. In the event of crystallization, warm part A to 40 to 50°C and stir until uniform., 180 days at –40C as pre-mix frozen.;It is best to store part A between 15° and 35°C to prevent crystallization or separation. In the event of crystallization, warm part A to 40 to 50°C and stir until uniform., 6 months at 25 °C; As one-part pre-mixed and frozen: 6 months DOP @ -40 °C; Specialty packaging may be less.; NOTE: When supplied in non-PMF two-part packaging, Part A should be stored between 15 and 35 °C to prevent crystallization or separation. In the event of crystallization, warm Part A to 40-50 °C and stir until uniform., 6 months at 25 °C; As one-part pre-mixed and frozen: 6 months DOP @ -40 °C; Specialty packaging may be less.; NOTE: When supplied in non-PMF two-part packaging, Part A should be stored between 15 and 35 °C to prevent crystallization or separation. In the event of crystallization, warm Part A to 40-50 °C and stir until uniform.
    Shelf Life Temperature (°F) 77, -40
    Shelf Life Type Shelf Life Type, DOP
    Shelf Life (mon) 6, 6, 6, 6
  • Best Practices for Resinlab SEC1222

    *See Terms of Use Below

    1. Mixing

      Bring both components to room temperature before use. Stir to assure homogenous consistency.

      Weigh and mix parts A and B accurately and thoroughly, scraping sides of container. Often small amounts are mixed by laying out equal length beads on a glass slide and using a metal spatula to mix.

    2. Curing

      Allow to cure undisturbed.

    3. Clean-Up

      Clean up uncured resin with suitable organic solvent such as MEK, acetone or other organic solvent.

  • Comparable Materials for Resinlab SEC1222

    *See Terms of Use Below

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Viscosity Test Methods
Viscosity Test Method Temperature
318,500 cPs 25°C
560,000 cPs Rheometer parallel plate 25mm@1/s 455300006291, Mixed 25°C
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
45 min Mass 5 grams, TM R050-19, Pot Life 25°C
0.75 min Pot Life, 453560822627 25°C
Compressive Strength Test Methods
Compressive Strength Test Temperature Test Method
1,500 psi Yield strength, TM R050-38
10,000 psi Ultimate strength, TM R050-38
1,300 psi 25°C Yield Strength, ASTM D695
9,900 psi 25°C ASTM D695
Tensile Strength Test Methods
Tensile Strength Test Temperature Test Method
1,000 psi Yield strength, TM R050-36
1,000 psi Ultimate strength, TM R050-36
1,000 psi 25°C ASTM D638
Shear Strength Test Methods
Shear Strength Type Substrate Test Temperature Test Method
850 psi Lap shear strength 2024 T3 Al Abraded / MEK Wipe 25°C TM R050-37
850 psi Lap Shear Strength Al to Al 25°C ASTM D1002, 0.010” bond line Al to Al
High Temperature Resistance Test Methods
High Temperature Resistance Test Method
150°C Temperature Rating is based on average design requirements and is not intended as a guarantee of suitability for all applications operating at that temperature.
Low Temperature Resistance Test Methods
Low Temperature Resistance Test Method
-40°C Temperature Rating is based on average design requirements and is not intended as a guarantee of suitability for all applications operating at that temperature.
Thermal Conductivity Test Methods
Thermal Conductivity Temperature Test Method
Very high 25°C Thermal Conductivity Test Method
1.60 W/m°K ASTM C-177, Values considered typical to associated resin systems or extrapolated from other test results.
3.90 W/m°K 25°C 453560822409/ASTM E1461, by LFA
Volume Resistivity Test Methods
Volume Resistivity Temp (°C) Test Method
0.003 (ohms/cm) 25°C 8 hours @ 25°C, 455300006612/ASTM D257, Estimated
0.0014 (ohms/cm) 25°C 24 hours @ 25°C
0.00089 (ohms/cm) 25°C 1 hour @ 60°C
Elongation Test Methods
Elongation Test Method
3 to 5 % Tensile elongation, 455300006285/ASTM D638
Modulus Test Methods
Modulus Test Method
50,000 psi Tensile modulus, 455300006285/ASTM D638
65,000 psi Compressive modulus, 455300006265/ASTM D695
Shore D Hardness Test Methods
Shore D Hardness Shore Hardness Test Method
80 TM R050-17
70 455300006287/ASTM D2240
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Temperature (°C) CTE Test Method
53 (ppm/°C) 25°C Below Tg, Values considered typical to associated resin systems or extrapolated from other test results.
110 (ppm/°C) 25°C Above Tg, Values considered typical to associated resin systems or extrapolated from other test results.
66 (ppm/ °C) 25°C Below Tg, by TMA, 455300005340 /ASTM E831, TMA, 5 °C/min
160 (ppm/ °C) 25°C Above Tg, by TMA, 455300005340 /ASTM E831, TMA, 5 °C/min
Glass Transition Temp (Tg) Test Methods
Glass Transition Temp (Tg) Glass Transition Temperature (Tg) Test Method
34°C by DSC, TM R050-25
17°C 453560822409 by DSC
Specific Gravity Test Methods
Specific Gravity Temperature Test Method
3.900 25°C TM R050-16
3.910 25°C Mixed, Calculated