Dow Silastic 160-60 Datasheet Dow Silastic 160-60

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  • Description for Dow Silastic 160-60

    Semi-conductive; no post cure required; serviceable over a wide temperature range; accepts extending fillers.

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    Brand Silastic
    Application Type Mold-Making
    1 Part or 2 Part 2-Part
    Material Form Liquid
    Manufacturer Dow
    Chemistry Silicone
    Cure Method 2-Part Cure, Heat
    Low Temperature Resistance (°C) >-73
  • Technical Data for Dow Silastic 160-60

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 2-Part
    • Material Form
      • Liquid
    • Chemistry
    • Cure Method
      • Heat
      • 2-Part Cure
    • Brand
      • Silastic
    Specifications
    Cure Specs
    Mix Ratio 100:1 (by volume)
    Bond Strength
    Tear Strength (piw) 50
    Material Resistance
    Low Temperature Resistance (°C) >-73
    Hardness
    Shore A Hardness 59
  • Best Practices for Dow Silastic 160-60

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  • Comparable Materials for Dow Silastic 160-60

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    Spec Engine® Results

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