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Description for Dow Silastic 160-60
Semi-conductive; no post cure required; serviceable over a wide temperature range; accepts extending fillers.Brand Silastic Application Type Mold-Making 1 Part or 2 Part 2-Part Material Form Liquid Manufacturer Dow Chemistry Silicone Cure Method 2-Part Cure, Heat Low Temperature Resistance (°C) >-73 -
Technical Data for Dow Silastic 160-60
Overview
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Application Type
- Casting / Moldmaking - Mold-Making
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1 Part or 2 Part
- 2-Part
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Material Form
- Liquid
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Chemistry
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Cure Method
- Heat
- 2-Part Cure
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Brand
- Silastic
Specifications
Cure Specs
Mix Ratio 100:1 (by volume) Bond Strength
Tear Strength (piw) 50 Material Resistance
Low Temperature Resistance (°C) >-73 Hardness
Shore A Hardness 59 -
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Best Practices for Dow Silastic 160-60
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Comparable Materials for Dow Silastic 160-60
Spec Engine® Results
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