Dow Silastic 160-70 Datasheet Dow Silastic 160-70

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  • Description for Dow Silastic 160-70

    Semi-conductive; no post cure required; serviceable over a wide temperature range; accepts extending fillers.

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    Brand Silastic
    Application Type Mold-Making
    1 Part or 2 Part 2-Part
    Material Form Liquid
    Manufacturer Dow
    Chemistry Silicone
    Cure Method Heat, 2-Part Cure

  • Technical Data for Dow Silastic 160-70

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    Overview
    • Application Type
    • 1 Part or 2 Part
      • 2-Part
    • Material Form
      • Liquid
    • Chemistry
    • Cure Method
      • Heat
      • 2-Part Cure
    • Brand
      • Silastic
    Specifications
    Cure Specs
    Mix Ratio 100:1 (by volume)
    Bond Strength
    Tear Strength (piw) 60
    Hardness
    Shore A Hardness 67
    Elongation (%) 2

  • Best Practices for Dow Silastic 160-70

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  • Comparable Materials for Dow Silastic 160-70

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    Spec Engine® Results

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