

-
Description for Dow Silastic 160-70
Semi-conductive; no post cure required; serviceable over a wide temperature range; accepts extending fillers.Brand Silastic Application Type Mold-Making 1 Part or 2 Part 2 Part Material Form Liquid Manufacturer Dow Chemistry Silicone Cure Method 2-Part Cure, Heat -
Technical Data for Dow Silastic 160-70
Overview
-
Application Type
- Casting / Moldmaking - Mold-Making
-
1 Part or 2 Part
- 1 Part or 2 Part - 2 Part
-
Material Form
- Liquid
-
Chemistry
-
Cure Method
- Heat
- 2-Part Cure
-
Brand
- Silastic
Specifications
Cure Specs
Mix Ratio 100:1 (by volume) Bond Strength
Tear Strength (piw) 60 Hardness
Shore A Hardness 67 Elongation (%) 2 -
-
Best Practices for Dow Silastic 160-70
-
Comparable Materials for Dow Silastic 160-70
Spec Engine® Results
Popular Articles
Infographic: ENSURING A STRONG BOND - 6 Basic Methods of Surface Preparation
Read ArticleElectrically Conductive Adhesives
Read Article6 objects held together by adhesives you probably can't live without
Read ArticleTesting the effectiveness of surface treatments
Read ArticleSponsored Articles
Unique Advantages of Contact Adhesives
Read ArticleUsing LOCTITE® 454™ is a Valid Option for Engineers Working with a Wide Variety of Materials
Read ArticleSylgard 184 by DOW is the Top Choice for a Transparent, Silicone Encapsulant. Read Why:
Read ArticleCase Study: Creating reliable, corrosion-free bonds with LORD® 406 acrylic adhesive
Read ArticleFeatured Ads
