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| Application Type | Cast, Pot, Encapsulate |
|---|---|
| 1 Part or 2 Part | 2 Part |
| Material Form | Liquid |
| Industry | Electronics: Coils, Electrical, Electronics: Transformers, Electronics, Modules, Strain sensitive devices |
| Manufacturer | Elantas (Altana) |
| Chemistry | Epoxy |
| Cure Method | Part A/Part B |
| Cure Temperature (°C) | 25, 60 |
| Cure Time (min) | 2,880 to 4,320, 120 to 240 |
| Viscosity (cPs) | 8,500 |
| High Temperature Resistance (°C) | Excellent thermal shock resistance |
| Key Specifications | UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL-94 V0 |
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| Set Time | Set Temperature |
|---|---|
| 120 min | 25°C |
| Viscosity | Temperature |
|---|---|
| 8,500 cPs | 25°C |
| Work / Pot Time | Test Method | Temperature |
|---|---|---|
| Long | ||
| 90 min | @ 25°C, 200 gm mass | 25°C |
| Dielectric Constant | Temperature | Test Method |
|---|---|---|
| 4.78 | 25°C | Dielectric Constant @ 100 Hz |
| 4.51 | 25°C | Dielectric Constant @ 1 KHz |
| 4.01 | 25°C | Dielectric Constant @ 1 MHz |
| Dielectric Strength | Temperature | Test Method |
|---|---|---|
| >400 (vpm) | 25°C | 0.125” thick |
| Dissipation Factor | Temperature | Test Method |
|---|---|---|
| 0.05400 | 25°C | Dissipation Factor @ 100 Hz |
| 0.03100 | 25°C | Dissipation Factor @ 1 KHz |
| 0.02000 | 25°C | Dissipation Factor @ 1 MHz |
| Volume Resistivity | Temp (°C) |
|---|---|
| 4.1e13 (ohms/cm) | 25°C |
| Surface Resistivity | Temperature |
|---|---|
| 7.2e14 (ohm) | 25°C |
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