Elantas (Altana) Conathane EN-11 w/ Conathane EN-4 Datasheet Elantas (Altana) Conathane EN-11 w/ Conathane EN-4

CONTACT REP
Information provided by Gluespec

  • Description for Elantas (Altana) Conathane EN-11 w/ Conathane EN-4

    A two-component, highly flexible liquid polyurethane molding and encapsulating system, that ensures the performance of electrical/electronic assemblies exposed to severe environmental extremes. Adhere to a wide variety of substrates.

    *See Terms of Use Below

    Brand Conathane, Cytec
    Application Type Molding, Potting, Casting, Encapsulate
    1 Part or 2 Part 2-Part
    Material Form Liquid
    Substrate Neoprene primed, PVC primed, Stainless Steel primed, Aluminum primed
    Industry Connector potting and molding, Wire wound devices, Cable potting and molding, Military, Watertight electrical connectors, Electrical, Cables, Electronic, Potting and encapsulation of modules and components, Coating for Printed circuitry, Strain sensitive components, Harness breakouts
    Manufacturer Elantas (Altana)
    Chemistry Non-MbOCA, Polyurethane
    Cure Method 2-Part Cure
    Demolding Time (min) 480 to 600, 120 to 180
    Cure Temperature (°C) 60, 80
    Cure Time (min) 1,440, 960
    Viscosity (cPs) Low, 5,750, 12,000, 75,000
    Arc Resistance (sec) Arc Resistance
    Fungus Resistance Fungus resistance
    High Temperature Resistance (°C) 130, 97, Thermal shock resistant
    Low Temperature Resistance (°C) -65, -70
    Volume Resistivity (O) >4.3e15 (ohms/cm), 4.8e11 (ohms/cm)

  • Technical Data for Elantas (Altana) Conathane EN-11 w/ Conathane EN-4

    *See Terms of Use Below

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 2-Part
    • Material Form
      • Liquid
    • Substrate
    • Industry
      • Military
      • Electronics - Electrical, Electronic, Potting and encapsulation of modules and components, Coating for Printed circuitry, Strain sensitive components, Wire wound devices, Harness breakouts
      • Connectors - Connector potting and molding, Watertight electrical connectors
      • Cable - Cable potting and molding, Cables
      • Other - Commercial
    • Chemistry
    • Application Method
      • Spray
      • Dip
      • Other - Hand-mix Bench Potting / Casting, Meter-mix Bench Potting / Casting, Meter-mix Vacuum Potting / Casting
    • Cure Method
      • 2-Part Cure
    • Brand
      • Conathane
      • Cytec
    Specifications
    Cure Specs
    Demolding Time (min) 480 to 600, 120 to 180
    Cure Temperature (°C) 60, 80
    Cure Time (min) 1,440, 960
    Viscosity (cPs) Low, 5,750, 12,000, 75,000 Test Method
    Linear Shrinkage (%) 1.15, 1.20 Test Method
    Mix Ratio 100:59 (by volume), 100:55 (by weight)
    Bond Strength
    Peel Strength (piw) >20, >20, >20, >20 Test Method
    Tear Strength (piw) 100 (pli) Test Method
    Tensile Strength (psi) 750 Test Method
    Material Resistance
    Arc Resistance (sec) Arc Resistance Test Method
    Flame Resistance Flame resistance no Ignition
    Fungus Resistance Fungus resistance Test Method
    High Temperature Resistance (°C) 130, 97, Thermal shock resistant
    Low Temperature Resistance (°C) -65, -70
    Moisture/Humidity Resistance Excellent, Superior hydrolytic stability
    Conductivity
    Dissipation Factor Exceptionally low, 0.02700, 0.03000, 0.02800, 0.03600, 0.00900, 0.02300, 0.03000, 0.03000, 0.01000, 0.03000, 0.04000, 0.02000 Test Method
    Insulation Resistance (O) >2.5e13 (ohms), 6.3e10 (ohms), >2.5e13 (ohms), 6.3e10 (ohms) Test Method
    Dielectric Strength (V/mil) Exceptionally high, 610 Test Method
    Dielectric Constant Exceptionally low, 3.30, 3.40, 3.10, 3.40, 2.90, 3.20 Test Method
    Volume Resistivity (O) >4.3e15 (ohms/cm), 4.8e11 (ohms/cm) Test Method
    Surface Resistivity (O) >1.0e15 (ohms / sq.), 5.3e12 (ohms / sq.) Test Method
    Hardness
    Shore A Hardness 60 Test Method
    Elongation (%) 350 Test Method
    Flexibility Highly flexible, Excellent
    Modulus (psi) 300, 425 Test Method
    Other Properties
    Specific Gravity 0.980 Test Method
    Flash Point (°F) >201.2 Test Method
    % Solids (%) 100
    Business Information
    Shelf Life Details The component parts of these systems are storage stable for 15 months from date of manufacture in the original, unopened containers when stored at temperatures of 70°F-85°F. If containers are opened and the contents only partially used, containers should be flushed with dry nitrogen (see CONAP® Dri-Purge) or dry air before resealing to prevent waste of material.
    Shelf Life Temperature (°F) 70 to 85
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 15

  • Best Practices for Elantas (Altana) Conathane EN-11 w/ Conathane EN-4

    *See Terms of Use Below

    1. Mixing

      Thoroughly mix the EN-4 Part A with either the EN-11 Part B or EN-12 Part B at 25°C to 40°C using metal, plastic, or glass stirrers and containers. Degas the mixed material at 1-5 mm of mercury and pour into molds at 25°C-80°C. Containers should be large enough to allow for volume expansion during the degassing cycle. Any material or container that could introduce moisture in the system should be avoided.

  • Comparable Materials for Elantas (Altana) Conathane EN-11 w/ Conathane EN-4

    *See Terms of Use Below

    Spec Engine® Results

    • Elantas (Altana)
      EN-4 w/ EN-8(Elantas (Altana))

      A two-component, non-MbOCA-based high, strength liquid polyurethane resin systems designed to ensure the performance of electrical/electronic assemblies exposed to severe environmental extremes. Used with EN-4 (Part A).

    • Parker Lord
      Circalok 6402 Urethane Encapsulant(Parker Lord)

      A general purpose, two-component urethane system which cures to a flexible material ideal for use as a coating, laminating adhesive or encapsulating compound. It can also be used as an excellent adhesive for many non-polar substrates, including rubber, metal and vinyl.

    • Elantas (Altana)
      DPEN-30597(Elantas (Altana))

      A two-component, highly flexible liquid polyurethane molding and encapsulating system suitable for Cytec`s new patented Flood Coat technology which is based on the optimization of rheology, reactivity and custom processing, resulting in the lower consumption of potting material as compared to the conventional potting application without compromising the performance.

    • Compare All
  Download Technical Data Sheet   Save This Material   Compare View Saved Items

Popular Articles

Testing the effectiveness of surface treatments

Read Article

Infographic: ENSURING A STRONG BOND - 6 Basic Methods of Surface Preparation

Read Article

The effectiveness of adhesives in the wind power industry

Read Article

Characteristics of MMAs

Read Article

Sponsored Articles

Unique Advantages of Contact Adhesives

Read Article

Using LOCTITE® 454™ is a Valid Option for Engineers Working with a Wide Variety of Materials

Read Article

Sylgard 184 by DOW is the Top Choice for a Transparent, Silicone Encapsulant. Read Why:

Read Article

Case Study: Creating reliable, corrosion-free bonds with LORD® 406 acrylic adhesive

Read Article

Featured Ads

Top Catalog Pages for Elantas (Altana) Conathane EN-11 w/ Conathane EN-4

All Elantas (Altana) Materials
View Now
Polyurethane Pottants and Encapsulants
View Now
Cable
View Now

Gluespec Poll

Which answer best describes a project you are currently working on?
Linear Shrinkage Test Methods
Linear Shrinkage Test Method
1.15 %
1.20 % MIL-M-24041C
Viscosity Test Methods
Viscosity Temperature
Low
5,750 cPs 25°C
12,000 cPs 25°C
75,000 cPs 25°C
Tensile Strength Test Methods
Tensile Strength Test Method
750 psi ASTM D-412
Peel Strength Test Methods
Peel Strength Substrate Test Method
>20 piw Aluminum primed with AD-1147-C MIL-M-24041
>20 piw Stainless Steel primed with AD-1146-C MIL-M-24041
>20 piw Neoprene primed with CONAP® PR-1167 MIL-M-24041
>20 piw PVC primed with CONAP®AD-1161 MIL-M-24041
Tear Strength Test Methods
Tear Strength Cure Temperature Test Method
100 (pli) 25°C ASTM D-624
Arc Resistance Test Methods
Arc Resistance Test Method
Arc Resistance MIL-M-24041
Fungus Resistance Test Methods
Fungus Resistance Test Method
Fungus resistance MIL-E-5272C
Dielectric Constant Test Methods
Dielectric Constant Temperature Test Method
Exceptionally low
3.30 25°C ASTM D-150, 100 Hz
3.40 130°C ASTM D-150, 100 Hz
3.10 25°C ASTM D-150, 1 KHz
3.40 130°C ASTM D-150, 1 KHz
2.90 25°C ASTM D-150, 1 MHz
3.20 130°C ASTM D-150, 1 MHz
Dielectric Strength Test Methods
Dielectric Strength Test Method
Exceptionally high
610 V/mil ASTM D-149, (1/16")
Dissipation Factor Test Methods
Dissipation Factor Temperature Test Method
Exceptionally low
0.02700 25°C ASTM D-150, 100 Hz
0.03000 130°C ASTM D-150, 100 Hz
0.02800 25°C ASTM D-150, 1 KHz
0.03600 130°C ASTM D-150, 1 KHz
0.00900 25°C ASTM D-150, 1 MHz
0.02300 130°C ASTM D-150, 1 MHz
0.03000 25°C ASTM D150, 100 Hz
0.03000 25°C ASTM D150, 1 kHz
0.01000 25°C ASTM D150, 1 MHz
0.03000 130°C ASTM D150, 100 Hz
0.04000 130°C ASTM D150, 1 kHz
0.02000 130°C ASTM D150, 1 MHz
Insulation Resistance Test Methods
Insulation Resistance Temperature Test Method
>2.5e13 (ohms) 25°C MIL-M-24041
6.3e10 (ohms) 130°C MIL-M-24041
>2.5e13 (ohms) 25°C MIL-M-24041C
6.3e10 (ohms) 130°C MIL-M-24041C
Volume Resistivity Test Methods
Volume Resistivity Temp (°C) Test Method
>4.3e15 (ohms/cm) 25°C ASTM D-257
4.8e11 (ohms/cm) 130°C ASTM D-257
Surface Resistivity Test Methods
Surface Resistivity Temperature Test Method
>1.0e15 (ohms / sq.) 25°C ASTM D-257
5.3e12 (ohms / sq.) 130°C ASTM D-257
Elongation Test Methods
Elongation Test Method
350 % ASTM D-412, Ultimate elongation
Modulus Test Methods
Modulus Test Method
300 psi 100% Modulus
425 psi 300% Modulus
Shore A Hardness Test Methods
Shore A Hardness Shore Hardness Test Method
60 ASTM D-2240
Specific Gravity Test Methods
Specific Gravity Test Method
0.980 ASTM D-792
Flash Point Test Methods
Flash Point Test Method
>94.0°C ASTM D93