Elantas (Altana) Conathane EN-11 w/ Conathane EN-4

Overview

• Application Type

  • Casting / Moldmaking - Molding, Casting
  • Pottant / Encapsulant - Potting, Encapsulate

• 1 Part or 2 Part

  • 1 Part or 2 Part - 2 Part

• Material Form

  • Liquid

• Substrate

  • Aluminum - Aluminum primed
  • Polyvinyl chloride (PVC) - PVC primed
  • Neoprene - Neoprene primed
  • Stainless Steel - Stainless Steel primed

• Industry

  • Electronics - Electrical, Electronic, Potting and encapsulation of modules and components, Coating for Printed circuitry, Strain sensitive components, Wire wound devices, Harness breakouts
  • Connectors - Connector potting and molding, Watertight electrical connectors
  • Cable - Cable potting and molding, Cables
  • Other - Commercial

• Chemistry

  • Other - Non-MbOCA
  • Polyurethane

• Application Method

  • Spray
  • Dip
  • Other - Hand-mix Bench Potting / Casting, Meter-mix Bench Potting / Casting, Meter-mix Vacuum Potting / Casting

• Cure Method

  • 2-Part Cure

• Brand

  • Conathane
  • Cytec

Specifications

Cure Specs

Demolding Time (min)	480 to 600
Demolding Temperature (°C)	60, 2 to 3, 80
Demolding Time Test Method	Demold, Demold
Cure Temperature (°C)	60, 80
Cure Time (min)	1,440, 960
Viscosity (cPs)	Low, 5,750, 12,000, 75,000	Test Method
Linear Shrinkage (%)	1.15, 1.20	Test Method
Mix Ratio	100:59 (by volume), 100:55 (by weight)

Bond Strength

Peel Strength (piw)	>20, >20, >20, >20	Test Method
Tear Strength (piw)	100 (pli)	Test Method
Tensile Strength (psi)	750	Test Method

Material Resistance

Arc Resistance (sec)	Arc Resistance
Flame Resistance	Flame resistance no Ignition
Fungus Resistance	Fungus resistance
High Temperature Resistance (°C)	130, 97, Thermal shock resistant
Low Temperature Resistance (°C)	-65, -70
Moisture/Humidity Resistance	Excellent, Superior hydrolytic stability

Conductivity

Dissipation Factor	Exceptionally low, 0.02700, 0.03000, 0.02800, 0.03600, 0.00900, 0.02300, 0.03000, 0.03000, 0.01000, 0.03000, 0.04000, 0.02000	Test Method
Insulation Resistance (O)	>2.5e13 (ohms), 6.3e10 (ohms), >2.5e13 (ohms), 6.3e10 (ohms)	Test Method
Dielectric Strength (V/mil)	Exceptionally high, 610	Test Method
Dielectric Constant	Exceptionally low, 3.30, 3.40, 3.10, 3.40, 2.90, 3.20	Test Method
Volume Resistivity (O)	>4.3e15 (ohms/cm), 4.8e11 (ohms/cm)	Test Method
Surface Resistivity (O)	>1.0e15 (ohms / sq.), 5.3e12 (ohms / sq.)	Test Method

Hardness

Shore A Hardness	60	Test Method
Elongation (%)	350	Test Method
Flexibility	Highly flexible, Excellent
Modulus (psi)	300, 425	Test Method

Other Properties

Specific Gravity	0.980	Test Method
Flash Point (°F)	>201.2	Test Method
% Solids (%)	100

Business Information

Shelf Life Details	The component parts of these systems are storage stable for 15 months from date of manufacture in the original, unopened containers when stored at temperatures of 70°F-85°F. If containers are opened and the contents only partially used, containers should be flushed with dry nitrogen (see CONAP® Dri-Purge) or dry air before resealing to prevent waste of material.
Shelf Life Temperature (°F)	70 to 85
Shelf Life Type	From date of manufacture
Shelf Life (mon)	15