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Description for Elantas (Altana) Conathane EN-21
CONATHANE® EN-20 Series are two-component, liquid, low viscosity, low toxicity, room temperature curing polyurethane resin systems. These systems were formulated specifically for the potting, casting, embedding, and encapsulation of electronic circuits, components, and power devices.Brand Cytec Application Type Casting, Potting , Encapsulation 1 Part or 2 Part 2-Part Material Form Liquid Industry Coils, Components, Printed circuit assemblies, Transformers, Electrical, Electronic circuits, Inductors, Micro-circuits, Power devices, Solid state ignition systems, Voltage regulators Manufacturer Elantas (Altana) Chemistry Non-MBOCA, Low Toxicity, Polyurethane Cure Method Part A/Part B Cure Temperature (°C) 25, 80 Cure Time (min) 10,080, 240 Viscosity (cPs) Low, 2,000, 320 High Temperature Resistance (°C) 130 Low Temperature Resistance (°C) -65 Other Resistance Reversion Resistance Volume Resistivity (O) 7.2e14 (ohms/cm), 1.8e11 (ohms/cm) Key Specifications UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94 HB certified -
Technical Data for Elantas (Altana) Conathane EN-21
Overview
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Application Type
- Casting / Moldmaking - Casting
- Pottant / Encapsulant - Potting , Encapsulation
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1 Part or 2 Part
- 2-Part
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Material Form
- Liquid
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Industry
- Electronics - Components, Electrical, Electronic circuits, Inductors, Micro-circuits, Power devices, Solid state ignition systems, Voltage regulators
- Coils
- Printed Circuit Board (PCB) - Printed circuit assemblies
- Transformers
- Industrial - Ballasts, Mercury switches, Rectifiers, Reed
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Chemistry
- Other - Non-MBOCA, Low Toxicity
- Polyurethane
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Application Method
- Dispenser - Hand Mixed, Machine Dispensed
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Cure Method
- 2-Part Cure - Part A/Part B
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Key Specifications
- UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) : UL 94 HB - UL 94 HB certified
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Brand
- Cytec
Specifications
Cure Specs
Cure Temperature (°C) 25, 80 Cure Time (min) 10,080, 240 Viscosity (cPs) Low, 2,000, 320 Test Method Fixture or Handling Strength Time (min) Easy Set Time (min) 90, 20 Test Method Linear Shrinkage (%) 0.014 (in./in.), Low Work / Pot Time (min) 40, 8 Test Method Mix Ratio 116:100 (by weight) Bond Strength
Tear Strength (piw) 119 (psi) Tensile Strength (psi) 2,000 Material Resistance
High Temperature Resistance (°C) 130 Test Method Low Temperature Resistance (°C) -65 Test Method Moisture/Humidity Resistance Excellent Other Resistance Reversion Resistance Conductivity
Dissipation Factor 0.01700, 0.03000 Test Method Insulation Resistance (O) >2.5e13 (ohms), 1.4e9 (ohms) , Insulation resistance Test Method Dielectric Strength (V/mil) 650 (Vpm), Excellent Test Method Dielectric Constant 3.40, 6.10 Test Method Thermal Conductivity (W/m°K) 7.1e-4 (cal/sec/cm2/°C/cm) Volume Resistivity (O) 7.2e14 (ohms/cm), 1.8e11 (ohms/cm) Test Method Surface Resistivity (O) >1.0e15 (ohms), 6.9e12 (ohms) Test Method Hardness
Shore A Hardness 80 Elongation (%) 155 Other Properties
Specific Gravity 1.070 Test Method Coefficient of Thermal Expansion (CTE) 2.10e-4 (in./ in/°C) Test Method Business Information
Shelf Life Details CONATHANE EN-21 Part A and Part B components are storage stable in their original, unopened containers for 18 months from date of manufacture when stored at 65°F-85°F. Shelf Life Temperature (°F) 65 to 85 Shelf Life Type From date of manufacture Shelf Life (mon) 18 -
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Best Practices for Elantas (Altana) Conathane EN-21
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Mixing
Mix the two components together thoroughly at room temperature in metal, plastic, or glass containers, using a metal spatula. DO NOT use paper containers or wooden sticks. Any moisture introduced into the system will cause bubbling and/or foaming during curing.
Pour into dry preheated units. Best results are generally obtained when the unit is at least 10°C warmer than the mixed material. Pour down the side of the unit to be potted to avoid air entrapment.
If the potted device is to be heat cured, it is best to allow the device to sit at room temperature for 1-2 hours to permit air bubbles, entrapped during pouring, to dissipate.
When containers are opened and the contents only partially used, be certain to flush them with dry nitrogen or CONAP® Dri-Purge (Request Technical Bulletin AC-105) to prevent moisture contamination and subsequent waste of material.
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Deairing/Degassing
If void-free castings are required for the particular application, degas the mixed system at 1-5 mm of mercury vacuum. Allow froth to rise and collapse
continue vacuum for 2-5 minutes. Containers should generally have twice the volume of mixed material to allow for frothing.
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Set Time Test Methods
Set Time | Set Temperature | Test Method |
---|---|---|
90 min | 25°C | 250 gms |
20 min | 60°C | 250 gms |
Viscosity Test Methods
Viscosity | Temperature |
---|---|
Low | |
2,000 cPs | 25°C |
320 cPs | 60°C |
Work / Pot Time Test Methods
Work / Pot Time | Test Method | Temperature |
---|---|---|
40 min | 250 gms | 25°C |
8 min | 250 gms | 60°C |
High Temperature Resistance Test Methods
High Temperature Resistance | Test Method |
---|---|
130°C | Thermal shock, Passed Olyphant Washer Test per MIL-I-16923E (-65°C to +130°C) |
Low Temperature Resistance Test Methods
Low Temperature Resistance | Test Method |
---|---|
-65°C | Thermal shock, Passed Olyphant Washer Test per MIL-I-16923E (-65°C to +130°C) |
Dielectric Constant Test Methods
Dielectric Constant | Temperature | Test Method |
---|---|---|
3.40 | 25°C | Dielectric constant @ 1 kHz |
6.10 | 105°C | Dielectric constant @ 1 kHz |
Dielectric Strength Test Methods
Dielectric Strength | Test Method |
---|---|
650 (Vpm) | Dielectric Strength, vpm (1/16”) |
Excellent |
Dissipation Factor Test Methods
Dissipation Factor | Temperature | Test Method |
---|---|---|
0.01700 | 25°C | Dissipation Factor @ 1 kHz |
0.03000 | 105°C | Dissipation Factor @ 1 kHz |
Insulation Resistance Test Methods
Insulation Resistance | Temperature |
---|---|
>2.5e13 (ohms) | 25°C |
1.4e9 (ohms) | 130°C |
Insulation resistance |
Volume Resistivity Test Methods
Volume Resistivity | Temp (°C) |
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7.2e14 (ohms/cm) | 25°C |
1.8e11 (ohms/cm) | 130°C |
Surface Resistivity Test Methods
Surface Resistivity | Temperature |
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>1.0e15 (ohms) | 25°C |
6.9e12 (ohms) | 130°C |
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) | CTE Test Method |
---|---|
2.10e-4 (in./ in/°C) | Linear Thermal Expansion |
Specific Gravity Test Methods
Specific Gravity | Temperature |
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1.070 | 25°C |