Elantas (Altana) Conathane EN-21

Elantas (Altana) Conathane EN-21 Datasheet
  • Description for Elantas (Altana) Conathane EN-21

    CONATHANE® EN-20 Series are two-component, liquid, low viscosity, low toxicity, room temperature curing polyurethane resin systems. These systems were formulated specifically for the potting, casting, embedding, and encapsulation of electronic circuits, components, and power devices.

    *See Terms of Use Below

    Brand Cytec
    Application Type Casting, Potting , Encapsulation
    1 Part or 2 Part 2 Part
    Material Form Liquid
    Industry Coils, Components, Printed circuit assemblies, Transformers, Electrical, Electronic circuits, Inductors, Micro-circuits, Power devices, Solid state ignition systems, Voltage regulators
    Manufacturer Elantas (Altana)
    Chemistry Non-MBOCA, Low Toxicity, Polyurethane
    Cure Method Part A/Part B
    Cure Temperature (°C) 25, 80
    Cure Time (min) 10,080, 240
    Viscosity (cPs) Low, 2,000, 320
    High Temperature Resistance (°C) 130
    Low Temperature Resistance (°C) -65
    Other Resistance Reversion Resistance
    Key Specifications UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94 HB certified, UL RTI Rating Elec/Mech - 120°C/120°C
  • Technical Data for Elantas (Altana) Conathane EN-21

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 2 Part
      • Part A Name - Part A
      • Part B Name - Part B
    • Material Form
      • Liquid
    • Industry
      • Electronics - Components, Electrical, Electronic circuits, Inductors, Micro-circuits, Power devices, Solid state ignition systems, Voltage regulators
      • Coils
      • Printed Circuit Board (PCB) - Printed circuit assemblies
      • Transformers
      • Industrial - Ballasts, Mercury switches, Rectifiers, Reed
    • Chemistry
    • Application Method
      • Dispenser - Hand Mixed, Machine Dispensed
    • Cure Method
      • 2-Part Cure - Part A/Part B
    • Key Specifications
      • Key Specifications Test Method - UL RTI Rating Elec/Mech - 120°C/120°C
      • UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94 HB - UL 94 HB certified
    • Brand
      • Cytec
    Specifications
    Cure Specs
    Cure Temperature (°C) 25, 80
    Cure Time (min) 10,080, 240
    Viscosity (cPs) Low, 2,000, 320 Test Method
    Fixture or Handling Strength Time (min) Easy
    Set Time (min) 90, 20 Test Method
    Linear Shrinkage (%) 0.014 (in./in.), Low
    Work / Pot Time (min) 40, 8 Test Method
    Mix Ratio 116:100 (by weight)
    Bond Strength
    Tear Strength (piw) 119 (psi)
    Tensile Strength (psi) 2,000
    Material Resistance
    High Temperature Resistance (°C) 130 Test Method
    Low Temperature Resistance (°C) -65 Test Method
    Moisture/Humidity Resistance Excellent
    Other Resistance Reversion Resistance
    Conductivity
    Dissipation Factor 0.01700, 0.03000 Test Method
    Insulation Resistance (O) >2.5e13 (ohms), 1.4e9 (ohms) , Insulation resistance Test Method
    Dielectric Strength (V/mil) 650 (Vpm), Excellent Test Method
    Dielectric Constant 3.40, 6.10 Test Method
    Thermal Conductivity (W/m°K) 7.1e-4 (cal/sec/cm2/°C/cm)
    Volume Resistivity (O) 7.2e14 (ohms/cm), 1.8e11 (ohms/cm) Test Method
    Surface Resistivity (O) >1.0e15 (ohms), 6.9e12 (ohms) Test Method
    Hardness
    Shore A Hardness 80
    Elongation (%) 155
    Other Properties
    Specific Gravity 1.070 Test Method
    Coefficient of Thermal Expansion (CTE) 2.10e-4 (in./ in/°C) Test Method
    Business Information
    Shelf Life Details CONATHANE EN-21 Part A and Part B components are storage stable in their original, unopened containers for 18 months from date of manufacture when stored at 65°F-85°F.
    Shelf Life Temperature (°F) 65 to 85
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 18
  • Best Practices for Elantas (Altana) Conathane EN-21

    *See Terms of Use Below

    1. Mixing

      Mix the two components together thoroughly at room temperature in metal, plastic, or glass containers, using a metal spatula. DO NOT use paper containers or wooden sticks. Any moisture introduced into the system will cause bubbling and/or foaming during curing.

      Pour into dry preheated units. Best results are generally obtained when the unit is at least 10°C warmer than the mixed material. Pour down the side of the unit to be potted to avoid air entrapment.

      If the potted device is to be heat cured, it is best to allow the device to sit at room temperature for 1-2 hours to permit air bubbles, entrapped during pouring, to dissipate.

      When containers are opened and the contents only partially used, be certain to flush them with dry nitrogen or CONAP® Dri-Purge (Request Technical Bulletin AC-105) to prevent moisture contamination and subsequent waste of material.

    2. Deairing/Degassing

      If void-free castings are required for the particular application, degas the mixed system at 1-5 mm of mercury vacuum. Allow froth to rise and collapse

      continue vacuum for 2-5 minutes. Containers should generally have twice the volume of mixed material to allow for frothing.

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    *See Terms of Use Below

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Set Time Test Methods
Set Time Set Temperature Test Method
90 min 25°C 250 gms
20 min 60°C 250 gms
Viscosity Test Methods
Viscosity Temperature
Low
2,000 cPs 25°C
320 cPs 60°C
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
40 min 250 gms 25°C
8 min 250 gms 60°C
High Temperature Resistance Test Methods
High Temperature Resistance Test Method
130°C Thermal shock, Passed Olyphant Washer Test per MIL-I-16923E (-65°C to +130°C)
Low Temperature Resistance Test Methods
Low Temperature Resistance Test Method
-65°C Thermal shock, Passed Olyphant Washer Test per MIL-I-16923E (-65°C to +130°C)
Dielectric Constant Test Methods
Dielectric Constant Temperature Test Method
3.40 25°C Dielectric constant @ 1 kHz
6.10 105°C Dielectric constant @ 1 kHz
Dielectric Strength Test Methods
Dielectric Strength Test Method
650 (Vpm) Dielectric Strength, vpm (1/16”)
Excellent
Dissipation Factor Test Methods
Dissipation Factor Temperature Test Method
0.01700 25°C Dissipation Factor @ 1 kHz
0.03000 105°C Dissipation Factor @ 1 kHz
Insulation Resistance Test Methods
Insulation Resistance Temperature
>2.5e13 (ohms) 25°C
1.4e9 (ohms) 130°C
Insulation resistance
Volume Resistivity Test Methods
Volume Resistivity Temp (°C)
7.2e14 (ohms/cm) 25°C
1.8e11 (ohms/cm) 130°C
Surface Resistivity Test Methods
Surface Resistivity Temperature
>1.0e15 (ohms) 25°C
6.9e12 (ohms) 130°C
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Test Method
2.10e-4 (in./ in/°C) Linear Thermal Expansion
Specific Gravity Test Methods
Specific Gravity Temperature
1.070 25°C