Hexion Bakelite X 22

Hexion Bakelite X 22 Datasheet
  • Description for Hexion Bakelite X 22

    Hexion Bakelite X 22 is a 1 Part Heat Phenolic used to Moulding compound

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    Brand Bakelite
    Application Type Moulding compound
    1 Part or 2 Part 1 Part
    Industry Power Supplies: Battery Modules: Housing parts, Industrial: General purpose, Power Supplies: Battery Modules: MCB housings
    Manufacturer Hexion
    Chemistry Phenolic
    Cure Method Heat, Pressure Sensitive
    Cure Time (min) 0.33 to 0.67, 0.17 to 0.33
  • Technical Data

    Overview
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    Specifications
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  • Best Practices

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Cure Time Test Methods
Cure Time Test Method
0.33 to 0.67 min Per mm of wall thickness
0.17 to 0.33 min Per mm of wall thickness
Impact Strength Test Methods
Impact Strength Cure Temperature Test Method
6.5 (kJ/m²) 23°C Charpy Impact Strength, ISO179-1 eU
1.5 (kJ/m²) 23°C Charpy Notched Impact Strength, ISO179-1 eA
Compressive Strength Test Methods
Compressive Strength Test Method
250 (MPa) Test specimen flat tested, ISO604
Flexural Strength Test Methods
Flexural Strength Test Method
90 (MPa) 2 (mm/min), ISO178
Tensile Strength Test Methods
Tensile Strength Test Method
55 (MPa) 5 (mm/min), ISO527 - 1/2
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.30000 100 Hz, Following IEC60250
Dielectric Strength Test Methods
Dielectric Strength Test Method
27.5 (kV/mm) 1mm Thickness, Short Term, Electrode Layout P25mm/P25mm in Transformer Oil Equivalent to IEC 60296, IEC 60243-P1
Surface Resistivity Test Methods
Surface Resistivity Test Method
1E+10 (Ohm) IEC 60093
Modulus Test Methods
Modulus Test Method
7500 (MPa) Flexural Modulus, ISO178
7500 (MPa) Tensile Modulus 1mm/min, Elongation e1 0,05%; e2 0,25%, ISO 527 - 1/2
Density Test Methods
Density Temperature Test Method
0.64 g/cm³ 23°C Apparent Density, ISO60
1.40 g/cm³ 23°C Apparent Density, ISO60