• Description for Resinlab EP1200 Black

    A highly filled, medium viscosity, casting resin, high thermal conductivity, high flexibility and low CTE.

    *See Terms of Use Below

    Application Type Casting Resin, Bond, Potting
    1 Part or 2 Part 2 Part
    Material Form Liquid
    Substrate Aluminum, Ceramic, Copper, Fabric, Glass, Metal, Neoprene, Nylon, Plastic, Polycarbonate, Polyester, Polyvinyl chloride (PVC), Rubber, Steel, Stone, Wood
    Industry Electronics, Military, Transportation
    Manufacturer Resinlab
    Chemistry Epoxy
    Cure Method Part A/Part B
    Cure Temperature (°C) 65, 25, 100, 65
    Cure Time (min) <120, 1,440 to 4,320, 30, 180
    Viscosity (cPs) Medium, 39,000, 30,000
    Color Black
    Chemical Resistance Inorganic acids & bases, Organic solvents, Salt spray, Water
    High Temperature Resistance (°C) 150
    Low Temperature Resistance (°C) -40
    Key Specifications Meets the requirements of UL Standard 94 for a horizontal burn rating at 1/4" thickness
  • Technical Data

    Overview
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    Specifications
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  • Best Practices

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Viscosity Test Methods
Viscosity Test Method Temperature
Medium 25°C
39,000 cPs TM R050-12, Low Shear
30,000 cPs TM R050-12, High Shear 25°C
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
120 min TM R050-19, Mass 200 grams 25°C
Shear Strength Test Methods
Shear Strength Cure Time Cure Temperature Substrate Test Temperature Test Method
1,500 psi 86400 (Seconds), 3600 (Seconds) 25 (C), 100 (C) Aluminum/Aluminum 25°C TM R050-37, 2024 T3 Al Abraded / MEK Wipe
Tensile Strength Test Methods
Tensile Strength Cure Time Cure Temperature Test Temperature Test Method
900 psi 86400 (Seconds), 3600 (Seconds) 25 (C), 100 (C) 25°C Cured properties used a cure schedule of 24 hours at 25°C + 1 hour at 100°C
Dielectric Constant Test Methods
Dielectric Constant Temperature Test Method
5.00 25°C Values considered typical to associated resin systems or extrapolated from other test results., 100 Hz
Dielectric Strength Test Methods
Dielectric Strength Test Method
400 V/mil Values considered typical to associated resin systems or extrapolated from other test results.
Volume Resistivity Test Methods
Volume Resistivity Test Method
7.6e13 (ohm-cm) Values considered typical to associated resin systems or extrapolated from other test results.
Elongation Test Methods
Elongation Test Method
15 % TM R050-36, Tensile, At Break
Modulus Test Methods
Modulus Test Method
40,000 psi TM R050-36, Tensile Modulus
24,000 psi TM R050-38, Compressive Modulus
Shore D Hardness Test Methods
Shore D Hardness Shore Hardness Test Method
75 TM R050-17
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Test Method
Low
45 (ppm/C) Below Tg, Values considered typical to associated resin systems or extrapolated from other test results.
149 (ppm/C) Above Tg, Values considered typical to associated resin systems or extrapolated from other test results.
Specific Gravity Test Methods
Specific Gravity Temperature Test Method
1.950 25°C 24 hours at 25oC + 1 hour at 100 oC
Glass Transition Temp (Tg) Test Methods
Glass Transition Temp (Tg) Glass Transition Temperature (Tg) Test Method
26°C TM R050-25