Resinlab EP1200 Black

Resinlab EP1200 Black Datasheet
  • Description for Resinlab EP1200 Black

    A highly filled, medium viscosity, casting resin, high thermal conductivity, high flexibility and low CTE.

    *See Terms of Use Below

    Application Type Casting Resin, Bond, Potting
    1 Part or 2 Part 2 Part
    Material Form Liquid
    Substrate Aluminum, Ceramic, Copper, Fabric, Glass, Metal, Rubber: Neoprene, Nylon, Plastic, Polycarbonate, Polyester, Polyvinyl chloride (PVC), Rubber, Steel, Stone, Wood
    Industry Electronics, Military, Transportation
    Manufacturer Resinlab
    Chemistry Epoxy
    Cure Method Part A/Part B
    Cure Temperature (°C) 65, 25, 100, 65
    Cure Time (min) <120, 1,440 to 4,320, 30, 180
    Viscosity (cPs) Medium, 39,000, 30,000
    Color Black
    Chemical Resistance Inorganic acids & bases, Salt spray, Water
    Relative Solvent Resistance Chemical Resistance: Organic solvents
    High Temperature Resistance (°C) 150
    Low Temperature Resistance (°C) -40
    Key Specifications Meets the requirements of UL Standard 94 for a horizontal burn rating at 1/4" thickness
  • Technical Data

    Overview
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    Specifications
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  • Best Practices

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Viscosity Test Methods
Viscosity Test Method Temperature
Medium 25°C
39,000 cPs TM R050-12, Low Shear
30,000 cPs TM R050-12, High Shear 25°C
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
120 min TM R050-19, Mass 200 grams 25°C
Shear Strength Test Methods
Shear Strength Cure Time Cure Temperature Substrate Test Temperature Test Method
1,500 psi 86400 (Seconds), 3600 (Seconds) 25 (C), 100 (C) Aluminum/Aluminum 25°C TM R050-37, 2024 T3 Al Abraded / MEK Wipe
Tensile Strength Test Methods
Tensile Strength Cure Time Cure Temperature Test Temperature Test Method
900 psi 86400 (Seconds), 3600 (Seconds) 25 (C), 100 (C) 25°C Cured properties used a cure schedule of 24 hours at 25°C + 1 hour at 100°C
Dielectric Constant Test Methods
Dielectric Constant Temperature Test Method
5.00 25°C Values considered typical to associated resin systems or extrapolated from other test results., 100 Hz
Dielectric Strength Test Methods
Dielectric Strength Test Method
400 V/mil Values considered typical to associated resin systems or extrapolated from other test results.
Volume Resistivity Test Methods
Volume Resistivity Test Method
7.6e13 (ohm-cm) Values considered typical to associated resin systems or extrapolated from other test results.
Elongation Test Methods
Elongation Test Method
15 % TM R050-36, Tensile, At Break
Modulus Test Methods
Modulus Test Method
40,000 psi TM R050-36, Tensile Modulus
24,000 psi TM R050-38, Compressive Modulus
Shore D Hardness Test Methods
Shore D Hardness Shore Hardness Test Method
75 TM R050-17
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Test Method
Low
45 (ppm/C) Below Tg, Values considered typical to associated resin systems or extrapolated from other test results.
149 (ppm/C) Above Tg, Values considered typical to associated resin systems or extrapolated from other test results.
Specific Gravity Test Methods
Specific Gravity Temperature Test Method
1.950 25°C 24 hours at 25oC + 1 hour at 100 oC
Glass Transition Temp (Tg) Test Methods
Glass Transition Temp (Tg) Glass Transition Temperature (Tg) Test Method
26°C TM R050-25