Dow Dowsil 3-4133 Dielectric Gel

Dow Dowsil 3-4133 Dielectric Gel Datasheet
  • Description for Dow Dowsil 3-4133 Dielectric Gel

    Long working time at RT and low viscosity provide processing flexibility and Fast heat cure for increased processing speeds.

    *See Terms of Use Below

    Brand Dowsil
    Application Type Coating, Encapsulating, Potting
    1 Part or 2 Part 2 Part
    Material Form Gel
    Industry Circuits, Various PCB system assemblies, Optoelectronics
    Manufacturer Dow
    Chemistry Silicone
    Cure Method 2-Part Cure, Heat, Room temperature
    Cure Temperature (°C) 100, 125, 150
    Cure Time (min) 4.00, 2.20, 1.60, Fast
    Viscosity (cPs) 450, Low
    Color Clear
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Light Refractive Index (RI) High
  • Technical Data

    Overview
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    Specifications
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  • Best Practices

    *See Terms of Use Below

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
100°C Heat Cure
125°C Heat Cure
150°C Heat Cure
Cure Time Test Methods
Cure Time Test Method
4.00 min Heat Cure
2.20 min Heat Cure
1.60 min Heat Cure
Fast
Viscosity Test Methods
Viscosity Test Method
Low
450 cPs Mixed
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
Long
360 min Time to double initial viscosity initial mixed viscosity for two-part products at room temperature. This property is sometimes referred to as pot life. 25°C
Dielectric Constant Test Methods
Dielectric Constant Test Method
2.87 Dielectric Constant at 100 Hz
2.86 Dielectric Constant at 100 kHz
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00040 100 hz
0.00007 100 kHz
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Test Method
350 (ppm/°C) Linear CTE (by TMA)