Dow Dowsil 3-4154 Dielectric Gel

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Description for Dow Dowsil 3-4154 Dielectric Gel

Extremely soft or firm, thermal/mechanical shock and vibration damping, excellent dielectric properties, flexible cure schedule, reversion resistant, thick section cure, compatible with automated dispensing equipment, and physical and electrical stability over a wide temperature range.

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Brand	Dowsil
Application Type	Coating, Potting , Encapsulating
1 Part or 2 Part	2-Part
Material Form	Gel
Industry	Optoelectronics, Various PCB systems assemblies, E-Mobility Solutions, Smart Meters, Insulation, Smart Home Devices, Headlamp assemblies
Manufacturer	Dow
Chemistry	Silicone
Cure Method	2- Part Cure, Heat cure, Room Temperature
Cure Temperature (°C)	100, 80
Cure Time (min)	105, 180, Fast
Viscosity (cPs)	550
Color	Clear
High Temperature Resistance (°C)	200
Low Temperature Resistance (°C)	-45, -55
Volume Resistivity (O)	1E+15 (ohms/cm)
Light Refractive Index (RI)	High

Best Practices for Dow Dowsil 3-4154 Dielectric Gel

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Technical Data for Dow Dowsil 3-4154 Dielectric Gel

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Overview

Application Type
- Coating
- Pottant / Encapsulant - Encapsulating , Potting
1 Part or 2 Part
- 2-Part
Material Form
- Gel
Industry
- Smart Meters
- Smart Home Devices
- E-Mobility Solutions
- Headlamp - Headlamp assemblies
- Electronics - Optoelectronics
- Printed Circuit Board (PCB) - Various PCB systems assemblies
- Insulation
Chemistry
- Silicone
Application Method
- Dispenser - Automated dispensing equipment
Cure Method
- Room Temperature / Air Dry - Room Temperature
- Heat - Heat cure
- 2-Part Cure - 2- Part Cure
Color
- Clear / Transparent - Clear
Brand
- Dowsil

Specifications

Cure Specs

Cure Temperature (°C)	100, 80	Test Method
Cure Time (min)	105, 180, Fast	Test Method
Viscosity (cPs)	550	Test Method
Work / Pot Time (min)	30	Test Method
Mix Ratio	1:1

Material Resistance

High Temperature Resistance (°C)	200
Low Temperature Resistance (°C)	-45, -55
Moisture/Humidity Resistance	Moisture/humidity resistance

Conductivity

Dissipation Factor	0.00300, 0.00010	Test Method
Dielectric Strength (V/mil)	Excellent, 450
Dielectric Constant	2.87, 2.87	Test Method
Volume Resistivity (O)	1E+15 (ohms/cm)

Hardness

Flexibility	Flexible, Resilient

Other Properties

Light Refractive Index (RI)	High
Specific Gravity	0.970	Test Method
Coefficient of Thermal Expansion (CTE)	350 (Linear (micron/m °C or ppm ))

Business Information

Shelf Life Details	Storage conditions and shelf life (“Use By” date) are indicated on the product label.
Shelf Life Temperature (°F)	77
Shelf Life (mon)	12

Not Good For

Don't Use For	Some solder flux residues, Organotin compounds, Unsaturated hydrocarbon plasitcizers, Organometallic compounds, Silicone rubber containing organotin catalyst, Sulfur, Polysulfides, Polysulfones, Other sulfur containing materials

Best Practices for Dow Dowsil 3-4154 Dielectric Gel

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1. Mixing
  
  Some gels are supplied in bladder packs that avoid direct air contact with the liquid gel components, allowing use of air pressure over the pack in a pressure pot for dispensing. Do not apply air pressure directly to the liquid gel surface (without the bladder pack) as the gel can become supersaturated with air and bubbling can occur when the material is dispensed and cured. Use of bladder packs prevents bubbling, maintains cleanliness and avoids gel contamination. Gels can be dispensed manually or by using one of the available types of meter mix equipment. Typically, the two components are of matched viscosities and are readily mixed with static or dynamic mixers, with automated meter-mix normally used for high volume processes. For low volume applications, manual weighing and simple hand mixing may be appropriate. Inaccurate proportioning or inadequate mixing may cause localized or widespread problems affecting the gel properties or cure characteristics.
2. Deairing/Degassing
  
  If possible, the potential for entrapment and incorporation of gas (typically air) should be considered during design of the part and selection of a process to mix and dispense the gel. This is especially important with higher viscosity and faster-curing gels. Degassing at > 28 inches (10–20 mm) Hg vacuum may be necessary to ensure a void-free, protective layer.
3. Curing
  
  Working time (or pot life) is the time required for the initial mixed viscosity to double at room temperature (RT). The cure reaction begins when Parts A and B are mixed. As the cure progresses, viscosity increases until the material becomes a soft gel. Cure conditions are shown in the typical properties table. Cure is defined as the time required for a specific gel to reach 90% of its final properties. Gels will reach a no-flow state prior to full cure. Additioncure silicone gels may be RT and heat cure or exclusively heat cure. Adding heat accelerates the cure reaction. Additional time should be allowed for heating the part to near oven temperature. Cure schedules should be verified.
  
  Certain materials, chemicals, curing agents and plasticizers can inhibit the cure of addition cure adhesives. Most notable of these include: organotin and other organometallic compounds, silicone rubber containing organotin catalyst, sulfur, polysulfides, polysulfones or other sulfur containing materials, unsaturated hydrocarbon plasitcizers, and some solder flux residues. If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.
4. Testing
  
  If a substrate or material is questionable with respect to potentially causing inhibition of cure, a small-scale compatibility test should be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure. In certain situations, toughened gels may appear fully cured but have reduced or no adhesion. This may result from slight inhibition at the interface.
Comparable Materials for Dow Dowsil 3-4154 Dielectric Gel

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Spec Engine^® Results
- Dowsil 3-4237 Dielectric Firm Gel(Dow)
  Firm or tough, thermal/mechanical shock and vibration damping, primerless chemical adhesion at room temperature (except 3-4237 Dielectric Firm Gel, which requires heat to develop chemical adhesion), excellent dielectric properties, flexible cure schedule, reversion resistant, thick section cure, compatible with automated dispensing equipment, and physical and electrical stability over a wide temperature range.
- Dowsil 3-4133 Dielectric Gel(Dow)
  Long working time at RT and low viscosity provide processing flexibility and Fast heat cure for increased processing speeds.
- Dowsil 3-4118 Gel(Dow)
  A two-part, soft, clear gel, 1:1 mix ratio, high viscosity to limit flow out. These gels have been used extensively to seal and protect by coating, encapsulating or potting various PCB system assemblies, especially those with delicate components.
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