Dow Dowsil 3-4154 Dielectric Gel

Dow Dowsil 3-4154 Dielectric Gel Datasheet
  • Description for Dow Dowsil 3-4154 Dielectric Gel

    Extremely soft or firm, thermal/mechanical shock and vibration damping, excellent dielectric properties, flexible cure schedule, reversion resistant, thick section cure, compatible with automated dispensing equipment, and physical and electrical stability over a wide temperature range.

    *See Terms of Use Below

    Brand Dowsil
    Application Type Coating, Potting , Encapsulating
    1 Part or 2 Part 2 Part
    Material Form Gel
    Industry Optoelectronics, Various PCB systems assemblies, Smart Meters, E-Mobility Solutions, Smart Home Devices, Insulation, Headlamp assemblies
    Manufacturer Dow
    Chemistry Silicone
    Cure Method 2- Part Cure, Heat cure, Room Temperature
    Cure Temperature (°C) 100, 80
    Cure Time (min) 105, 180, Fast
    Viscosity (cPs) 550
    Color Clear
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Light Refractive Index (RI) High
  • Technical Data for Dow Dowsil 3-4154 Dielectric Gel

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 2 Part
    • Material Form
      • Gel
    • Industry
      • E-Mobility Solutions
      • Headlamp - Headlamp assemblies
      • Electronics - Optoelectronics
      • Printed Circuit Board (PCB) - Various PCB systems assemblies
      • Smart Meters
      • Smart Home Devices
      • Insulation
    • Chemistry
    • Application Method
      • Dispenser - Automated dispensing equipment
    • Cure Method
      • Room Temperature / Air Dry - Room Temperature
      • Heat - Heat cure
      • 2-Part Cure - 2- Part Cure
    • Color
      • Clear / Transparent - Clear
    • Brand
      • Dowsil
    Specifications
    Cure Specs
    Cure Temperature (°C) 100, 80 Test Method
    Cure Time (min) 105, 180, Fast Test Method
    Viscosity (cPs) 550 Test Method
    Work / Pot Time (min) 30 Test Method
    Mix Ratio 1:1
    Material Resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Moisture/Humidity Resistance Moisture/humidity resistance
    Conductivity
    Dissipation Factor 0.00300, 0.00010 Test Method
    Dielectric Strength (V/mil) Excellent, 450
    Dielectric Constant 2.87, 2.87 Test Method
    Volume Resistivity (O) 1E+15 (ohms/cm)
    Hardness
    Flexibility Flexible, Resilient
    Other Properties
    Light Refractive Index (RI) High
    Specific Gravity 0.970 Test Method
    Coefficient of Thermal Expansion (CTE) 350 (Linear (micron/m °C or ppm ))
    Business Information
    Shelf Life Details Storage conditions and shelf life (“Use By” date) are indicated on the product label.
    Shelf Life Temperature (°F) 77
    Shelf Life (mon) 12
    Not Good For
    Don't Use For Some solder flux residues, Organotin compounds, Unsaturated hydrocarbon plasitcizers, Organometallic compounds, Silicone rubber containing organotin catalyst, Sulfur, Polysulfides, Polysulfones, Other sulfur containing materials
  • Best Practices for Dow Dowsil 3-4154 Dielectric Gel

    *See Terms of Use Below

    1. Mixing

      Some gels are supplied in bladder packs that avoid direct air contact with the liquid gel components, allowing use of air pressure over the pack in a pressure pot for dispensing. Do not apply air pressure directly to the liquid gel surface (without the bladder pack) as the gel can become supersaturated with air and bubbling can occur when the material is dispensed and cured. Use of bladder packs prevents bubbling, maintains cleanliness and avoids gel contamination. Gels can be dispensed manually or by using one of the available types of meter mix equipment. Typically, the two components are of matched viscosities and are readily mixed with static or dynamic mixers, with automated meter-mix normally used for high volume processes. For low volume applications, manual weighing and simple hand mixing may be appropriate. Inaccurate proportioning or inadequate mixing may cause localized or widespread problems affecting the gel properties or cure characteristics.

    2. Deairing/Degassing

      If possible, the potential for entrapment and incorporation of gas (typically air) should be considered during design of the part and selection of a process to mix and dispense the gel. This is especially important with higher viscosity and faster-curing gels. Degassing at > 28 inches (10–20 mm) Hg vacuum may be necessary to ensure a void-free, protective layer.

    3. Curing

      Working time (or pot life) is the time required for the initial mixed viscosity to double at room temperature (RT). The cure reaction begins when Parts A and B are mixed. As the cure progresses, viscosity increases until the material becomes a soft gel. Cure conditions are shown in the typical properties table. Cure is defined as the time required for a specific gel to reach 90% of its final properties. Gels will reach a no-flow state prior to full cure. Additioncure silicone gels may be RT and heat cure or exclusively heat cure. Adding heat accelerates the cure reaction. Additional time should be allowed for heating the part to near oven temperature. Cure schedules should be verified.

      Certain materials, chemicals, curing agents and plasticizers can inhibit the cure of addition cure adhesives. Most notable of these include: organotin and other organometallic compounds, silicone rubber containing organotin catalyst, sulfur, polysulfides, polysulfones or other sulfur containing materials, unsaturated hydrocarbon plasitcizers, and some solder flux residues. If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.

    4. Testing

      If a substrate or material is questionable with respect to potentially causing inhibition of cure, a small-scale compatibility test should be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure. In certain situations, toughened gels may appear fully cured but have reduced or no adhesion. This may result from slight inhibition at the interface.

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
100°C Heat Cure
80°C Heat Cure
Cure Time Test Methods
Cure Time Test Method
105 min Heat Cure
180 min Heat Cure
Fast
Viscosity Test Methods
Viscosity Test Method
550 cPs Mixed
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
30 min (Pot Life - hours) 25°C
Dielectric Constant Test Methods
Dielectric Constant Test Method
2.87 Dielectric constant, 100 Hz
2.87 Dielectric constant, 100 KHz
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00300 Dissipation factor, 100 Hz
0.00010 Dissipation factor, 100 KHz
Specific Gravity Test Methods
Specific Gravity Test Method
0.970 Uncured