Dow Dowsil 3-4170 Dielectric Gel Datasheet Dow Dowsil 3-4170 Dielectric Gel

Information provided by Gluespec
  • Description for Dow Dowsil 3-4170 Dielectric Gel

    • Clear • Fast heat cure • Long working time and low viscosity aid process flexibility • Impregnation may be successful without vacuum

    *See Terms of Use Below

    Brand Dowsil
    Application Type Coating, Encapsulating , Seal, Potting
    1 Part or 2 Part 2-Part
    Material Form Gel
    Industry Circuits, PCB system assemblies, Smart Meters, E-Mobility Solutions, Smart Home Devices, Electronics, Optoelectronics
    Manufacturer Dow
    Chemistry Silicone, Solvent-free
    Cure Method Addition Cure, Heat
    Cure Temperature (°C) 100, 125, 150
    Cure Time (min) 9, 5.00, 3.00
    Viscosity (cPs) 475, Low
    Color Soft Clear
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Volume Resistivity (O) 9.5E+14 (ohms/cm)
    Light Refractive Index (RI) High
  • Technical Data for Dow Dowsil 3-4170 Dielectric Gel

    • Application Type
    • 1 Part or 2 Part
      • 2-Part
    • Material Form
      • Gel
    • Industry
      • Smart Meters
      • Smart Home Devices
      • E-Mobility Solutions
      • Electronics - Circuits, Optoelectronics
      • Printed Circuit Board (PCB) - PCB system assemblies
      • Industrial - Delicate components
    • Application Method
      • Dispenser - Automated dispensing equipment
    • Cure Method
      • Heat
      • 2-Part Cure - Addition Cure
    • Color
      • Clear / Transparent - Soft Clear
    • Brand
      • Dowsil
    Cure Specs
    Cure Temperature (°C) 100, 125, 150 Test Method
    Cure Time (min) 9, 5.00, 3.00 Test Method
    Viscosity (cPs) 475, Low Test Method
    Work / Pot Time (min) Long, >1,440 Test Method
    Mix Ratio 1:1 (by volume)
    Material Resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Moisture/Humidity Resistance Moisture/humidity resistance
    Dissipation Factor 0.00160, 0.00007 Test Method
    Dielectric Strength (V/mil) Excellent, 500, Electrical insulation
    Dielectric Constant 2.85, 2.85 Test Method
    Volume Resistivity (O) 9.5E+14 (ohms/cm)
    Flexibility Flexible, Resilient
    Other Properties
    Light Refractive Index (RI) High
    Coefficient of Thermal Expansion (CTE) 425 (ppm/ºC) Test Method
    Business Information
    Shelf Life Details Storage conditions and shelf life (“Use By” date) are indicated on the product label.
    Shelf Life Temperature (°F) 77
    Shelf Life (mon) 12
  • Best Practices for Dow Dowsil 3-4170 Dielectric Gel

    *See Terms of Use Below

    1. Mixing

      Some gels are supplied in bladder packs that avoid direct air contact with the liquid gel components, allowing use of air pressure over the pack in a pressure pot for dispensing. Do not apply air pressure directly to the liquid gel surface (without the bladder pack) as the gel can become supersaturated with air and bubbling can occur when the material is dispensed and cured. Use of bladder packs prevents bubbling, maintains cleanliness and avoids gel contamination. In general, gels are supplied as two-part products that are mixed in a 1:1 ratio (Parts A and B)

      one-part gels are available that eliminate the need for mixing. Gels can be dispensed manually or by using one of the available types of meter mix equipment. Typically, the two components are of matched viscosities and are readily mixed with static or dynamic mixers, with automated meter-mix normally used for high volume processes. For low-volume applications, manual weighing and simple hand mixing may be appropriate. Inaccurate proportioning or inadequate mixing may cause localized or widespread problems affecting the gel properties or cure characteristics. If possible, the potential for entrapment and incorporation of gas (typically air) should be considered during design of the part and selection of a process to mix and dispense the gel. This is especially important with higher-viscosity and faster-curing gels. Degassing at >28 inches (10-20 mm) Hg vacuum may be necessary to ensure a void-free, protective layer.

    2. Testing

      If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.

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    *See Terms of Use Below

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
100°C Heat
125°C Heat
150°C Heat
Cure Time Test Methods
Cure Time Test Method
9 min Heat
5.00 min Heat
3.00 min Heat
Viscosity Test Methods
Viscosity Test Method
475 cPs Mixed
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
>1,440 min Pot Life 25°C
Dielectric Constant Test Methods
Dielectric Constant Test Method
2.85 At 100 Hz
2.85 At 100 Hz
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00160 At 100 hz
0.00007 At 100 kHz
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Test Method
425 (ppm/ºC) By TMA