Dow Dowsil 3-4237 Dielectric Firm Gel Datasheet Dow Dowsil 3-4237 Dielectric Firm Gel

Information provided by Gluespec
  • Description for Dow Dowsil 3-4237 Dielectric Firm Gel

    Firm or tough, thermal/mechanical shock and vibration damping, primerless chemical adhesion at room temperature (except 3-4237 Dielectric Firm Gel, which requires heat to develop chemical adhesion), excellent dielectric properties, flexible cure schedule, reversion resistant, thick section cure, compatible with automated dispensing equipment, and physical and electrical stability over a wide temperature range.

    *See Terms of Use Below

    Brand Dowsil
    Application Type Coating, Potting, Encapsulating
    1 Part or 2 Part 2 Part
    Material Form Gel
    Industry Optoelectronics, Automotive application, Various PCB system assembly application, Smart Meters, E-Mobility Solutions, Smart Home Devices
    Manufacturer Dow
    Chemistry Silicone
    Cure Method 2-Part Cure, Heat, Room Temperature
    Cure Temperature (°C) 100, 125, 150
    Cure Time (min) 35, 12, 7
    Color Translucent green, Translucent green
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Durability Tough
    Light Refractive Index (RI) High

Popular Articles

Silicones in LED Lighting | Gluespec

Read Article

Infographic: ENSURING A STRONG BOND - 6 Basic Methods of Surface Preparation

Read Article

Electrically Conductive Adhesives

Read Article

Testing the effectiveness of surface treatments

Read Article

Sponsored Articles

Unique Advantages of Contact Adhesives

Read Article

Using LOCTITE® 454™ is a Valid Option for Engineers Working with a Wide Variety of Materials

Read Article

Sylgard 184 by DOW is the Top Choice for a Transparent, Silicone Encapsulant. Read Why:

Read Article

Case Study: Creating reliable, corrosion-free bonds with LORD® 406 acrylic adhesive

Read Article

Featured Ads

Top Catalog Pages for Dow Dowsil 3-4237 Dielectric Firm Gel

Gluespec Poll

Who do you read or follow for engineering news and entertainment?
Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
100°C Heat Cure
125°C Heat Cure
150°C Heat Cure
Cure Time Test Methods
Cure Time Test Method
35 min Heat Cure
12 min Heat Cure
7 min Heat Cure
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
Long
12,960 min Time to double initial viscosity initial mixed viscosity for two-part products at room temperature. This property is sometimes referred to as pot life. 20 to 25°C
Peel Strength Test Methods
Peel Strength Type Test Method
3 (ppi) 180 Degree Peel Strength Unprimed Adhesion
Dielectric Constant Test Methods
Dielectric Constant Test Method
2.96 100 Hz
2.96 100 kHz
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00200 100 Hz
0.00007 100 kHz
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Test Method
325 (ppm/°C) Linear CTE (by TMA)
Specific Gravity Test Methods
Specific Gravity Test Method
0.980 Cured