Dow Fox-14 Flowable Oxide Datasheet Dow Fox-14 Flowable Oxide

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  • Description for Dow Fox-14 Flowable Oxide

    State of the art planarization; low dielectric constant; controlled film thickness; excellent gap fill; very low defect density; uses methyl isobutyl ketone as a carrier solvent.

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    Application Type Coat
    1 Part or 2 Part 1 Part
    Material Form Liquid
    Manufacturer Dow
    Chemistry Oxide, Hydrogen, Silsesquioxane
    Cure Method Nitrogen Ambient, Heat
    Cure Temperature (°C) 400
    Viscosity (cPs) 1
  • Technical Data for Dow Fox-14 Flowable Oxide

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Liquid
    • Chemistry
      • Other - Oxide, Hydrogen, Silsesquioxane
    • Application Method
      • Spin-On
    • Cure Method
      • Heat
      • Other - Nitrogen Ambient
    Specifications
    Cure Specs
    Cure Temperature (°C) 400
    Viscosity (cPs) 1
    Conductivity
    Dielectric Constant 3.00, Low
    Other Properties
    Flash Point (°F) 62.6
    Business Information
    Shelf Life Type from date of manufacture
    Shelf Life (mon) 6
  • Best Practices for Dow Fox-14 Flowable Oxide

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    1. Application

      FOx Flowable Oxide is applied using standard spin-on glass equipment. It can be spin-coated under a wide range of conditions, which will optimize uniformity on complex geometries. After spin-coating, hot plates are used not only to remove solvent as with conventional SOGs, but also to melt and flow the film. The melt and flow properties of the material help to provide superior smoothing and gap fill. After flow, the film is cured in a standard quartz diffusion furnace. At this point, the material is ready for the next processing step. No etchback is required.

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