Dow Hipec Q3-6646 SemiconDuctor Protective Coating

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Description for Dow Hipec Q3-6646 SemiconDuctor Protective Coating

Transparent, low-modulus LED gel encapsulant; low viscosity; long working time.

Application Type	Protective Coating, Encapsulant
1 Part or 2 Part	2-Part
Material Form	Liquid
Industry	Light Emitting Diodes (LEDs)
Manufacturer	Dow
Chemistry	Silicone, Solvent-free
Cure Method	2-Part Cure, Heat
Cure Temperature (°C)	150
Cure Time (min)	60
Viscosity (cPs)	Low
Color	Transparent
High Temperature Resistance (°C)	200
Low Temperature Resistance (°C)	-45
Light Refractive Index (RI)	1.4020, 1.3940, 1.3930

Best Practices for Dow Hipec Q3-6646 SemiconDuctor Protective Coating

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Technical Data for Dow Hipec Q3-6646 SemiconDuctor Protective Coating

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Overview

Application Type
- Coating - Protective Coating
- Pottant / Encapsulant - Encapsulant
1 Part or 2 Part
- 2-Part
Material Form
- Liquid
Industry
- LED (Light-Emitting Diodes) - Light Emitting Diodes (LEDs)
Chemistry
- Solvent-Free
- Silicone
Cure Method
- Heat
- 2-Part Cure
Color
- Clear / Transparent - Transparent

Specifications

Cure Specs

Cure Temperature (°C)	150
Cure Time (min)	60
Viscosity (cPs)	Low
Work / Pot Time (min)	Very long
Mix Ratio	1:1 (by volume)

Material Resistance

High Temperature Resistance (°C)	200
Low Temperature Resistance (°C)	-45

Conductivity

Dielectric Strength (V/mil)	Durable

Hardness

Flexibility	Flexible
Modulus (psi)	Low

Other Properties

Light Refractive Index (RI)	1.4020, 1.3940, 1.3930	Test Method
Flash Point (°F)	213.8
% Solids (%)	100

Business Information

Shelf Life Details	Shelf life is indicated by the “Use Before” date found on the product label., Dow Corning two-part products should be stored at or below 25°C (77°F). Containers should be kept tightly closed at all times to extend shelf life., Check the product label for specific storage conditions.
Shelf Life Type	From date of manufacture
Shelf Life (mon)	12

Best Practices for Dow Hipec Q3-6646 SemiconDuctor Protective Coating

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1. Surface Preparation
  
  Surfaces should be clean and dry. Recommended cleaning methods include Dow Corning® brand OS Fluids, naphtha, mineral spirits, methyl ethyl ketone (MEK) or other suitable solvent. Rougher surfaces tend to promote adhesion of silicones to other surfaces.
2. Application
  
  These products are also compatible with commercially available equipment and industry standard processes. These materials can be dispensed or molded depending on the product and application.
3. Clean-Up
  
  Dow Corning OS Fluids are recommended to clean cured or uncured silicone residue from application equipment.
4. Testing
  
  If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured silicone indicates incompatibility and inhibition of cure.
Comparable Materials for Dow Hipec Q3-6646 SemiconDuctor Protective Coating

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Spec Engine^® Results
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  Shinetsu X-32-2337 A/B is a 2-Part 2-Part Cure Silicone Liquid used to Coat Flat fabric coating
- Elastosil LR 3153 A/B(Wacker)
  Wacker Elastosil LR 3153 A/B is a 2-Part 2-Part Cure Liquid silicone rubber Liquid used to Coat Other substrates, Glass fiber and PEX surfaces
- Sylgard 1-4128 Conformal Coating(Dow)
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