Dow Sylgard 527 Silicone Dielectric Gel

Dow Sylgard 527 Silicone Dielectric Gel Datasheet
  • Description for Dow Sylgard 527 Silicone Dielectric Gel

    Two-part, 1 to 1 mix ratio dielectric gel, Room temperature or heat accelerated cure, Available in clear or red, Low viscosity allows good flow under components, UL flammability rating

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    Brand Sylgard
    Application Type Coating, Encapsulating, Sealing, Potting
    1 Part or 2 Part 2 Part
    Material Form Gel
    Industry Sealing various electronic devices, Protecting various electronic devices, Delicate components, Protect circuits from thermal and mechanical stresses, Protect interconnections from thermal and mechanical stresses, Isolate circuits from the harmful effects of moisture, Isolate circuits from the harmful effects of other contaminants, Optoelectronics
    Manufacturer Dow
    Chemistry Silicone, Solvent-free
    Cure Method 2-Part Cure, Heat cure, Room Temperature Cure
    Cure Temperature (°C) 20 to 25 Room Temperature, 100, 125, 150
    Cure Time (min) 210, 75, 35
    Viscosity (cPs) 465, Low, Good flow under components
    Color Red, Clear
    High Temperature Resistance (°C) 150
    Low Temperature Resistance (°C) -45, -55
    Stress Relief Stress relief
    Light Refractive Index (RI) High
  • Technical Data

    Overview
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    Specifications
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  • Best Practices

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
20 to 25°C Room Temperature
100°C Heat Cure, (T90)
125°C Heat Cure, (T90)
150°C Heat Cure, (T90)
Cure Time Test Methods
Cure Time Test Method
210 min Heat Cure, (T90)
75 min Heat Cure, (T90)
35 min Heat Cure, (T90)
Viscosity Test Methods
Viscosity Test Method
465 cPs Mixed
Low
Good flow under components
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
Dielectric Constant Test Methods
Dielectric Constant Test Method
2.85 At 100 Hz
2.85 At 100 kHz
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00200 At 100 Hz
0.00010 At 100 kHz
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Test Method
335 (ppm/ºC) By TMA
Specific Gravity Test Methods
Specific Gravity Test Method
0.950 Uncured