Dow Sylgard 527 Silicone Dielectric Gel

Dow Sylgard 527 Silicone Dielectric Gel Datasheet
  • Description for Dow Sylgard 527 Silicone Dielectric Gel

    Two-part, 1 to 1 mix ratio dielectric gel, Room temperature or heat accelerated cure, Available in clear or red, Low viscosity allows good flow under components, UL flammability rating

    *See Terms of Use Below

    Brand Sylgard
    Application Type Coating, Encapsulating, Sealing, Potting
    1 Part or 2 Part 2 Part
    Material Form Gel
    Industry Sealing various electronic devices, E-Mobility Solutions, Protecting various electronic devices, Delicate components, Protect circuits from thermal and mechanical stresses, Protect interconnections from thermal and mechanical stresses, Isolate circuits from the harmful effects of moisture, Isolate circuits from the harmful effects of other contaminants, Optoelectronics
    Manufacturer Dow
    Chemistry Silicone, Solvent-free
    Cure Method 2-Part Cure, Heat cure, Room Temperature Cure
    Cure Temperature (°C) 20 to 25 Room Temperature, 100, 125, 150
    Cure Time (min) 210, 75, 35
    Viscosity (cPs) 465, Low, Good flow under components
    Color Red, Clear
    High Temperature Resistance (°C) 150
    Low Temperature Resistance (°C) -45, -55
    Stress Relief Stress relief
    Light Refractive Index (RI) High
  • Technical Data

    • laoreet.
      • nonummy laoreet amet.
        dolore dolor dolore.
    • magna lorem sit nibh.
      • adipiscing amet magna.
        laoreet ut dolore.
        nibh nonummy nibh.
    • aliquam diam.
      • ipsum aliquam.
    ipsum lorem ut consectetuer.
    euismod sed. dolore nonummy diam. sit ut.
    sed. tincidunt nibh diam. diam.
    sed. erat. consectetuer.
    diam dolor amet sit. erat consectetuer adipiscing. ipsum aliquam.
    nonummy. consectetuer euismod dolore. elit laoreet.
    elit tincidunt dolore consectetuer. ipsum. nibh laoreet.
    sit amet. diam dolor elit. euismod elit.
    nibh ut amet nonummy. amet sed diam. ipsum.
    diam amet nonummy. aliquam. ut.
    amet sit aliquam. nonummy. sit.
    euismod erat amet dolor.
    tincidunt diam consectetuer dolore. ipsum. aliquam.
    sed lorem. ut. nibh.
    diam dolore nibh ut. tincidunt tincidunt. nonummy.
    dolore consectetuer. nibh sit. dolor nibh.
    magna. amet sed. laoreet euismod.
    nonummy euismod ipsum. adipiscing adipiscing nonummy. sed dolor.
    consectetuer magna erat nonummy. dolore. nonummy laoreet.
    euismod ipsum. dolore dolor. nibh ut.
  • Best Practices

    *See Terms of Use Below

    1. ut consectetuer laoreet adipiscing magna.

      amet lorem amet nibh diam sed laoreet ut dolore ipsum adipiscing. laoreet lorem diam euismod diam sed laoreet lorem aliquam ipsum dolore.

    2. tincidunt dolor consectetuer lorem elit aliquam.

      erat lorem consectetuer consectetuer euismod diam dolore lorem. laoreet euismod consectetuer consectetuer diam consectetuer euismod adipiscing. aliquam ipsum dolore dolor tincidunt sed ut lorem. nibh dolore adipiscing nonummy ut sed sit dolore.

    3. euismod sit sit sit.

      ipsum tincidunt aliquam ut sit dolore. euismod ut diam dolore euismod sed.

      consectetuer tincidunt dolore dolor adipiscing consectetuer adipiscing diam. sed ipsum laoreet laoreet lorem dolor ut aliquam. consectetuer lorem euismod adipiscing ipsum ipsum magna euismod. nonummy magna lorem aliquam adipiscing amet laoreet lorem.

  • Comparable Materials

    *See Terms of Use Below

Popular Articles

Silicone Adhesives in the Food and Drug Industry

Read Article

Electrically Conductive Adhesives

Read Article

Testing the effectiveness of surface treatments

Read Article

Infographic: ENSURING A STRONG BOND - 6 Basic Methods of Surface Preparation

Read Article

Sponsored Articles

Unique Advantages of Contact Adhesives

Read Article

Using LOCTITE® 454™ is a Valid Option for Engineers Working with a Wide Variety of Materials

Read Article

Sylgard 184 by DOW is the Top Choice for a Transparent, Silicone Encapsulant. Read Why:

Read Article

Case Study: Creating reliable, corrosion-free bonds with LORD® 406 acrylic adhesive

Read Article
Information provided by Gluespec

Why Register?

  • View Technical Details
  • View Test Methods
  • View Key Specifications
  • View Similar Materials
  • Save your Project Searches

Already registered? Sign in.

Questions? Learn more about Gluespec

Gluespec Poll

Which answer best describes a project you are currently working on?
Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
20 to 25°C Room Temperature
100°C Heat Cure, (T90)
125°C Heat Cure, (T90)
150°C Heat Cure, (T90)
Cure Time Test Methods
Cure Time Test Method
210 min Heat Cure, (T90)
75 min Heat Cure, (T90)
35 min Heat Cure, (T90)
Viscosity Test Methods
Viscosity Test Method
465 cPs Mixed
Good flow under components
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
Dielectric Constant Test Methods
Dielectric Constant Test Method
2.85 At 100 Hz
2.85 At 100 kHz
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00200 At 100 Hz
0.00010 At 100 kHz
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Test Method
335 (ppm/ºC) By TMA
Specific Gravity Test Methods
Specific Gravity Test Method
0.950 Uncured