Dow Sylgard 527 Silicone Dielectric Gel

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Description for Dow Sylgard 527 Silicone Dielectric Gel

Two-part, 1 to 1 mix ratio dielectric gel, Room temperature or heat accelerated cure, Available in clear or red, Low viscosity allows good flow under components, UL flammability rating

*See Terms of Use Below

Brand	Sylgard
Application Type	Coating, Encapsulating, Sealing, Potting
1 Part or 2 Part	2-Part
Material Form	Gel
Industry	Sealing various electronic devices, Smart Meters, E-Mobility Solutions, Smart Home Devices, Insulation, Headlamp assemblies, Protecting various electronic devices, Delicate components, Protect circuits from thermal and mechanical stresses, Protect interconnections from thermal and mechanical stresses, Isolate circuits from the harmful effects of moisture, Isolate circuits from the harmful effects of other contaminants, Optoelectronics
Manufacturer	Dow
Chemistry	Silicone, Solvent-free
Cure Method	2-Part Cure, Heat cure, Room Temperature Cure
Cure Temperature (°C)	20 to 25 Room Temperature, 100, 125, 150
Cure Time (min)	210, 75, 35
Viscosity (cPs)	465, Low, Good flow under components
Color	Red, Clear
High Temperature Resistance (°C)	150
Low Temperature Resistance (°C)	-45, -55
Volume Resistivity (O)	2.75 E+15 (ohms/cm)
Stress Relief	Stress relief
Light Refractive Index (RI)	High

Best Practices for Dow Sylgard 527 Silicone Dielectric Gel

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Technical Data for Dow Sylgard 527 Silicone Dielectric Gel

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Overview

Application Type
- Coating
- Pottant / Encapsulant - Encapsulating, Potting
- Sealant - Sealing
1 Part or 2 Part
- 2-Part
Material Form
- Gel
Industry
- Smart Meters
- Smart Home Devices
- E-Mobility Solutions
- Headlamp - Headlamp assemblies
- Electronics - Sealing various electronic devices, Protecting various electronic devices, Delicate components, Protect circuits from thermal and mechanical stresses, Protect interconnections from thermal and mechanical stresses, Isolate circuits from the harmful effects of moisture, Isolate circuits from the harmful effects of other contaminants, Optoelectronics
- Industrial - Delicate components
- Insulation
Chemistry
- Solvent-Free
- Silicone
Application Method
- Dispenser - Automated dispensing equipment
Cure Method
- Room Temperature / Air Dry - Room Temperature Cure
- Heat - Heat cure
- 2-Part Cure
Color
- Clear / Transparent - Clear
- Red
Brand
- Sylgard

Specifications

Cure Specs

Cure Temperature (°C)	20 to 25 Room Temperature, 100, 125, 150	Test Method
Cure Time (min)	210, 75, 35	Test Method
Viscosity (cPs)	465, Low, Good flow under components	Test Method
Mix Ratio	1:1

Material Resistance

High Temperature Resistance (°C)	150
Low Temperature Resistance (°C)	-45, -55
Moisture/Humidity Resistance	Moisture/humidity resistance

Conductivity

Dissipation Factor	0.00200, 0.00010	Test Method
Dielectric Strength (V/mil)	Excellent, 425, Provide electrical insulation for high voltages
Dielectric Constant	2.85, 2.85	Test Method
Volume Resistivity (O)	2.75 E+15 (ohms/cm)

Hardness

Stress Relief	Stress relief
Flexibility	Flexibility, Resilient

Other Properties

Light Refractive Index (RI)	High
Specific Gravity	0.950	Test Method
Coefficient of Thermal Expansion (CTE)	335 (ppm/ºC)	Test Method
Flash Point (°F)	212.0

Business Information

Shelf Life Details	Shelf life from date of manufacture for material in the original, unopened container, stored at less than 35°C, unless otherwise noted.;Storage conditions and shelf life (“Use By” date) are indicated on the product label., Shelf life is indicated by the “Use Before” date found on the product label. Refer to the product label for storage temperature requirements.
Shelf Life Temperature (°F)	<95
Shelf Life Type	From date of manufacture, Shelf Life Type
Shelf Life (mon)	12

Not Good For

Don't Use For	Organotin compounds, Unsaturated hydrocarbon plasitcizers, Organometallic compounds, Silicone rubber containing organotin catalyst, Sulfur, Some solder flux residues, Polysulfides, Polysulfones, Other sulfur containing materials
Don't Use With	Plastic, Rubber, Non-reactive metal substrates, Teflon®, Non-reactive plastic surfaces, Polyethylene, Polypropylene, Plastic or Rubber Substrates that are Highly Plasticized

Best Practices for Dow Sylgard 527 Silicone Dielectric Gel

*See Terms of Use Below
1. Mixing
  
  Some gels are supplied in bladder packs that avoid direct air contact with the liquid gel components, allowing use of air pressure over the pack in a pressure pot for dispensing. Do not apply air pressure directly to the liquid gel surface (without the bladder pack) as the gel can become supersaturated with air and bubbling can occur when the material is dispensed and cured. Use of bladder packs prevents bubbling, maintains cleanliness and avoids gel contamination. In general, gels are supplied as two-part products that are mixed in a 1:1 ratio (Parts A and B)
  
  one-part gels are available that eliminate the need for mixing. Gels can be dispensed manually or by using one of the available types of meter mix equipment. Typically, the two components are of matched viscosities and are readily mixed with static or dynamic mixers, with automated meter-mix normally used for high volume processes. For low-volume applications, manual weighing and simple hand mixing may be appropriate. Inaccurate proportioning or inadequate mixing may cause localized or widespread problems affecting the gel properties or cure characteristics. If possible, the potential for entrapment and incorporation of gas (typically air) should be considered during design of the part and selection of a process to mix and dispense the gel. This is especially important with higher-viscosity and faster-curing gels. Degassing at >28 inches (10-20 mm) Hg vacuum may be necessary to ensure a void-free, protective layer.
2. Curing
  
  Working time (or pot life) is the time required for the initial mixed viscosity to double at room temperature (RT). The cure reaction begins when Parts A and B are mixed. As the cure progresses, viscosity increases until the material becomes a soft gel. Cure is defined as the time required for a specific gel to reach 90% of its final properties Gels will reach a no-flow state prior to full cure. Addition-cure silicone gels may be room temperature and heat cure or exclusively heat cure. Adding heat accelerates the cure reaction. Additional time should be allowed for heating the part to near oven temperature. Cure schedules should be verified in each new application.
3. Testing
  
  If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.
Comparable Materials for Dow Sylgard 527 Silicone Dielectric Gel

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