Dow Sylgard 537 One Part Dielectric Gel

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Description for Dow Sylgard 537 One Part Dielectric Gel

Extremely soft or firm, thermal/mechanical shock and vibration damping, excellent dielectric properties, flexible cure schedule, reversion resistant, thick section cure, compatible with automated dispensing equipment, and physical and electrical stability over a wide temperature range.

*See Terms of Use Below

Brand	Sylgard
Application Type	Coating, Encapsulating, Potting
1 Part or 2 Part	1-Part
Material Form	Gel
Industry	Optoelectronics, Smart Meters, E-Mobility Solutions, Smart Home Devices, Various electronic devices
Manufacturer	Dow
Chemistry	Silicone
Cure Method	Heat
Cure Temperature (°C)	20 to 25, 120
Cure Time (min)	60
Viscosity (cPs)	Low, 375
Color	Clear
High Temperature Resistance (°C)	200
Low Temperature Resistance (°C)	-45, -55
Volume Resistivity (O)	1.9E+15 (ohms/cm)
Light Refractive Index (RI)	High

Best Practices for Dow Sylgard 537 One Part Dielectric Gel

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Technical Data for Dow Sylgard 537 One Part Dielectric Gel

*See Terms of Use Below

Overview

Application Type
- Coating
- Pottant / Encapsulant - Potting, Encapsulating
1 Part or 2 Part
- 1-Part
Material Form
- Gel
Industry
- Smart Meters
- Smart Home Devices
- E-Mobility Solutions
- Electronics - Various electronic devices, Optoelectronics
Chemistry
- Silicone
Application Method
- Dispenser - Automated dispensing equipment
Cure Method
- Heat
Color
- Clear / Transparent - Clear
Brand
- Sylgard

Specifications

Cure Specs

Cure Temperature (°C)	20 to 25, 120	Test Method
Cure Time (min)	60	Test Method
Viscosity (cPs)	Low, 375

Material Resistance

High Temperature Resistance (°C)	200
Low Temperature Resistance (°C)	-45, -55
Moisture/Humidity Resistance	Moisture/humidity resistance

Conductivity

Dielectric Strength (V/mil)	Excellent, 559
Volume Resistivity (O)	1.9E+15 (ohms/cm)

Hardness

Flexibility	Flexible, Resilient

Other Properties

Light Refractive Index (RI)	High
Specific Gravity	0.980	Test Method

Business Information

Shelf Life Details	Storage conditions and shelf life (“Use By” date) are indicated on the product label.
Shelf Life Temperature (°F)	41
Shelf Life (mon)	9

Not Good For

Don't Use For	Other sulfur containing materials, Polysulfones, Polysulfides, Sulfur, Silicone rubber containing organotin catalyst, Organometallic compounds, Unsaturated hydrocarbon plasitcizers, Organotin compounds, Some solder flux residues

Best Practices for Dow Sylgard 537 One Part Dielectric Gel

*See Terms of Use Below
1. Mixing
  
  Some gels are supplied in bladder packs that avoid direct air contact with the liquid gel components, allowing use of air pressure over the pack in a pressure pot for dispensing. Do not apply air pressure directly to the liquid gel surface (without the bladder pack) as the gel can become supersaturated with air and bubbling can occur when the material is dispensed and cured. Use of bladder packs prevents bubbling, maintains cleanliness and avoids gel contamination. Gels can be dispensed manually or by using one of the available types of meter mix equipment.
2. Deairing/Degassing
  
  If possible, the potential for entrapment and incorporation of gas (typically air) should be considered during design of the part and selection of a process to dispense the gel. This is especially important with higher-viscosity and faster curing gels. Degassing at > 28 inches (10–20 mm) Hg vacuum may be necessary to ensure a void-free, protective layer.
3. Curing
  
  Working time (or pot life) is the time required for the initial mixed viscosity to double at room temperature (RT). For one-part products the viscosity either increases at a much lower rate or does not change significantly at RT. Cure conditions are shown in the typical properties table. Cure is defined as the time required for a specific gel to reach 90% of its final properties. Gels will reach a no-flow state prior to full cure. Additional time should be allowed for heating the part to near oven temperature. Cure schedules should be verified in each new application.
  
  Certain materials, chemicals, curing agents and plasticizers can inhibit the cure of addition cure adhesives. Most notable of these include: organotin and other organometallic compounds, silicone rubber containing organotin catalyst, sulfur, polysulfides, polysulfones or other sulfur containing materials, unsaturated hydrocarbon plasitcizers, and some solder flux residues. If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.
4. Testing
  
  If a substrate or material is questionable with respect to potentially causing inhibition of cure, a small-scale compatibility test should be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure. In certain situations, toughened gels may appear fully cured but have reduced or no adhesion. This may result from slight inhibition at the interface.
Comparable Materials for Dow Sylgard 537 One Part Dielectric Gel

*See Terms of Use Below

Spec Engine^® Results
- Dowsil 3-6635 Dielectric Gel(Dow)
  Extremely soft to medium hardness, thermal/mechanical shock and vibration damping, excellent dielectric properties, flexible cure schedule, reversion resistant, thick section cure, compatible with automated dispensing equipment, and physical and electrical stability over a wider temperature range than the other types of gels.
- Dowsil EG-3810 Dielectric Gel(Dow)
  A One-Part; Heat-Cure; Very Soft; Excellent Thermally Stable Silicone Gel.
- KE-1062(Shinetsu)
  Shinetsu KE-1062 is a 1-Part Heat cure Phenyl-based polysiloxane Gel used to Pot and Encapsulate Ceramics, Glass and Plastics
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