• Description for Dow 3-1953 Conformal Coating

    A fast room-temperature vulcanizing (RTV) or heat accelerated cure, solventless, medium viscosity silicone elastomer.

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    Application Type Conformal Coat
    1 Part or 2 Part 1 Part
    Material Form Liquid
    Industry Electronic Printed Wiring Board (PWB), Flexible circuit boards, Rigid circuit boards, Electric Vehicles
    Manufacturer Dow
    Chemistry Silicone elastomer, Solvent-free
    Cure Method Moisture, RTV
    Cure Temperature (°C) 20 to 25, 60
    Cure Time (min) Fast, 30, 2.00
    Viscosity (cPs) Medium, 350
    Color Translucent, Light Straw
    Ozone Resistance Ozone resistance
    Chemical Resistance Good
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Light Refractive Index (RI) Good
    Key Specifications IPC (Association Connecting Electronics Industries): IPC-CC-830B, UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL 94 V-0, Mil-Spec (United States Military Standard): I-46058C: Mil I-46058C Amend 7, UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 746E
  • Technical Data

    Overview
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    Specifications
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  • Best Practices

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
20 to 25°C Typical for a 5-mil thickness sample in 180° peel.;Time to cohesive failure on a 180° peel strip. Coating strength may continue to improve with time. Thicker samples require additional cure time., To prevent bubbles or voids from forming, applications thicker than 5 mils may require a 5- to 10-minute hold time at room temperature to allow solvents to evaporate before the material is exposed to higher temperatures, 15% RH
60°C Typical for a 5-mil thickness sample in 180° peel.;Time to cohesive failure on a 180° peel strip. Coating strength may continue to improve with time. Thicker samples require additional cure time., To prevent bubbles or voids from forming, applications thicker than 5 mils may require a 5- to 10-minute hold time at room temperature to allow solvents to evaporate before the material is exposed to higher temperatures, 15% RH
Cure Time Test Methods
Cure Time Test Method
Fast
30 min Typical for a 5-mil thickness sample in 180° peel.;Time to cohesive failure on a 180° peel strip. Coating strength may continue to improve with time. Thicker samples require additional cure time., To prevent bubbles or voids from forming, applications thicker than 5 mils may require a 5- to 10-minute hold time at room temperature to allow solvents to evaporate before the material is exposed to higher temperatures, 15% RH
2.00 min Typical for a 5-mil thickness sample in 180° peel.;Time to cohesive failure on a 180° peel strip. Coating strength may continue to improve with time. Thicker samples require additional cure time., To prevent bubbles or voids from forming, applications thicker than 5 mils may require a 5- to 10-minute hold time at room temperature to allow solvents to evaporate before the material is exposed to higher temperatures, 15% RH
Tack Free Time Test Methods
Tack Free Time Tack Free Temperature Test Method
8 min 25°C
0.50 min 60°C 15% RH
Work / Pot Time Test Methods
Work / Pot Time Temperature
>86,400 min <29°C
Dielectric Constant Test Methods
Dielectric Constant Test Method
2.49 Dielectric constant, 100 Hz
2.52 Dielectric constant, 100 KHz
Dielectric Strength Test Methods
Dielectric Strength Test Method
Durable
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00070 Dissipation factor, 100 Hz
<0.00020 Dissipation factor, 100 KHz
Volume Resistivity Test Methods
Volume Resistivity Test Method
5.5 E15 (ohms/cm) JIS K 6249