• Description for Dow 3-1965 Conformal Coating

    A fast room-temperature vulcanizing (RTV) or heat accelerated cure, solventless, low viscosity silicone elastomer.

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    Application Type Conformal Coat
    1 Part or 2 Part 1 Part
    Material Form Liquid
    Industry Electronic Printed Wiring Board (PWB), Flexible circuit boards, Rigid circuit boards
    Manufacturer Dow
    Chemistry Silicone elastomer, Solvent-free, Polydimethylsiloxane
    Cure Method Moisture, RTV
    Cure Temperature (°C) 20 to 25, 60, 25
    Cure Time (min) Fast, 30, 2.00
    Viscosity (cPs) Low, 115
    Color Translucent, Light Straw
    Ozone Resistance Ozone resistance
    Chemical Resistance Good
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Key Specifications IPC (Association Connecting Electronics Industries): IPC-CC-830, Amendment 1 , IPC (Association Connecting Electronics Industries): IPC-CC-830B, UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL 94 V-0, Mil-Spec (United States Military Standard): I-46058C: Mil I-46058C Amend 7
  • Technical Data

    Overview
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    Specifications
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  • Best Practices

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
20 to 25°C Typical for a 5-mil thickness sample in 180° peel.
60°C Time to cohesive failure on a 180° peel strip. Coating strength may continue to improve with time. Thicker samples require additional cure time., To prevent bubbles or voids from forming, applications thicker than 5 mils may require a 5- to 10-minute hold time at room temperature to allow solvents to evaporate before the material is exposed to higher temperatures, 15% RH
25°C
Cure Time Test Methods
Cure Time Test Method
Fast
30 min Typical for a 5-mil thickness sample in 180° peel.
2.00 min Time to cohesive failure on a 180° peel strip. Coating strength may continue to improve with time. Thicker samples require additional cure time., To prevent bubbles or voids from forming, applications thicker than 5 mils may require a 5- to 10-minute hold time at room temperature to allow solvents to evaporate before the material is exposed to higher temperatures, 15% RH
Tack Free Time Test Methods
Tack Free Time Tack Free Temperature Test Method
Work / Pot Time Test Methods
Work / Pot Time Temperature
>86,400 min <29°C
Dielectric Constant Test Methods
Dielectric Constant Test Method
2.50 Dielectric constant, 100 Hz
2.53 Dielectric constant, 100 KHz
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00100 Dissipation factor, 100 Hz
<0.00020 Dissipation factor, 100 KHz
Specific Gravity Test Methods
Specific Gravity Test Method
0.990 Cured