Dow Dowsil 1-2620 Dispersion RTV Elastoplastic Conformal Coating

Dow Dowsil 1-2620 Dispersion RTV Elastoplastic Conformal Coating Datasheet
  • Description for Dow Dowsil 1-2620 Dispersion RTV Elastoplastic Conformal Coating

    It is one-part, transparent low viscosity conformal coating with firm, abrasion resistant surface after cure, for flexible circuit boards, Ideally suited for printed circuit boards (PCB) applications.

    *See Terms of Use Below

    Brand Dowsil
    Application Type Conformal Coat
    1 Part or 2 Part 1 Part
    Material Form Pre-Cure: Liquid, Post-Cure: Elastoplastic
    Substrate Low-surface energy surfaces
    Industry Electronic Printed Wiring Board (PWB), E-Mobility Solutions, Printed circuit boards (PCB) applications, Flexible circuit boards, Rigid circuit boards
    Manufacturer Dow
    Chemistry Silicone resin, Solvent, Flammable, Elastoplastic
    Application Method Flow: Flow coating
    Cure Method Moisture, RTV, Heat Cure, Room temperature cure
    Cure Temperature (°C) 20 to 25, 60, 20 to 25
    Cure Time (min) 10, 10, 4,320
    Viscosity (cPs) Low, 150, 150 Mpa-sec), 0.1 (Pa-sec)
    Color Transparent-Yellow, Transparent-Yellow
    Ozone Resistance Ozone resistance
    Chemical Resistance Good
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Key Specifications IPC (Association Connecting Electronics Industries): IPC-CC-830B, UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL 94 V-0, Mil-Spec (United States Military Standard): I-46058-C: MIL-I-46058C, Amend. 7, UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL746E
  • Technical Data for Dow Dowsil 1-2620 Dispersion RTV Elastoplastic Conformal Coating

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Elastomer - Post-Cure: Elastoplastic
      • Liquid - Pre-Cure: Liquid
    • Substrate
      • Low Surface Energy - Low-surface energy surfaces
      • Other - Certain difficult surfaces, Electronic materials, Electronic substrates, No-lead solders, Low-solid
    • Industry
      • E-Mobility Solutions
      • Electronics - Electronic Printed Wiring Board (PWB), Flexible circuit boards, Rigid circuit boards
      • Printed Circuit Board (PCB) - Printed circuit boards (PCB) applications
      • Other - Fill in narrow Spaces, Fill in narrow gaps
    • Chemistry
    • Application Method
      • Dispenser - Robotic dispensing, Select coating
      • Brush
      • Spray
      • Flow: Flow Coat - Flow coating
      • Dip
      • Screen Print - Automated pattern
    • Cure Method
      • Room Temperature / Air Dry - Room temperature cure
      • Moisture / Condensation Cure - Moisture
      • Heat - Heat Cure
      • RTV (Room Temperature Vulcanization) - RTV
    • Color
      • Clear / Transparent - Transparent-Yellow
      • Yellow - Transparent-Yellow
    • Key Specifications
      • IPC (Association Connecting Electronics Industries): CC-830B - IPC-CC-830B
      • UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: V0 - UL 94 V-0
      • Mil-Spec (United States Military Standard): I-46058-C: Amd. 7 - MIL-I-46058C, Amend. 7
      • UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): 746E - UL746E
    • Brand
      • Dowsil
    Specifications
    Cure Specs
    Cure Temperature (°C) 20 to 25, 60, 20 to 25 Test Method
    Cure Time (min) 10, 10, 4,320 Test Method
    Viscosity (cPs) Low, 150, 150 Mpa-sec), 0.1 (Pa-sec) Test Method
    Tack Free Time (min) 5.00, 2.00 Test Method
    Material Resistance
    Ozone Resistance Ozone resistance
    Abrasion Resistance Abrasion Resistant
    Chemical Resistance Good
    UV Resistance UV resistance
    Environmental Resistance Environmental resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Moisture/Humidity Resistance Moisture/humidity resistance
    Conductivity
    Dissipation Factor 0.00200, 0.00030 Test Method
    Dielectric Strength (V/mil) Durable, 550, 22 (KV/mm) Test Method
    Dielectric Constant 2.69, 2.68 Test Method
    Volume Resistivity (O) 4.6E13 (ohm*cm) Test Method
    Hardness
    Shore A Hardness 80 Test Method
    Flexibility Firm, Resilient, Flexible
    Other Properties
    Specific Gravity 1.000, 1.110 Test Method
    Business Information
    Shelf Life Details Shelf life is indicated by the “Use Before” date found on the product label.
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 12
  • Best Practices for Dow Dowsil 1-2620 Dispersion RTV Elastoplastic Conformal Coating

    *See Terms of Use Below

    1. Curing

      The time required to reach a tack-free state can be reduced with heat. When using heat for this purpose, allow adequate time for the solvent to evaporate prior to exposing to elevated temperatures in an air circulating oven. A typical cure schedule for 3 mil (75 micron) coatings is 10 minutes at room temperature, followed by 10 minutes at 60°C. If the coating blisters or contains bubbles, allow additional time at room temperature for the solvent to flash off prior to oven cure.

    2. Testing

      If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.

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    *See Terms of Use Below

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
20 to 25°C 3 mil (75 micron) coatings
60°C
20 to 25°C
Cure Time Test Methods
Cure Time Test Method
10 min 3 mil (75 micron) coatings
10 min
4,320 min
Tack Free Time Test Methods
Tack Free Time Tack Free Temperature Test Method
5.00 min 25°C These values are not intended for use in preparing specifications.
2.00 min 60°C These values are not intended for use in preparing specifications.
Viscosity Test Methods
Viscosity Test Method
Low These values are not intended for use in preparing specifications.
150 cPs These values are not intended for use in preparing specifications.
150 Mpa-sec) These values are not intended for use in preparing specifications.
0.1 (Pa-sec) These values are not intended for use in preparing specifications.
Dielectric Constant Test Methods
Dielectric Constant Test Method
2.69 At 100 Hz, These values are not intended for use in preparing specifications.
2.68 At 100 kHz, These values are not intended for use in preparing specifications.
Dielectric Strength Test Methods
Dielectric Strength Test Method
Durable
550 V/mil These values are not intended for use in preparing specifications.
22 (KV/mm) These values are not intended for use in preparing specifications.
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00200 At 100 hz, These values are not intended for use in preparing specifications.
0.00030 At 100 kHz, These values are not intended for use in preparing specifications.
Volume Resistivity Test Methods
Volume Resistivity Test Method
4.6E13 (ohm*cm) These values are not intended for use in preparing specifications.
Shore A Hardness Test Methods
Shore A Hardness Shore Hardness Test Method
80 These values are not intended for use in preparing specifications
Specific Gravity Test Methods
Specific Gravity Test Method
1.000 Uncured, These values are not intended for use in preparing specifications.
1.110 Cured, These values are not intended for use in preparing specifications.