Dow FOx-16 Flowable Oxide

Dow FOx-16 Flowable Oxide Datasheet
  • Description for Dow FOx-16 Flowable Oxide

    State of the art planarization; low dielectric constant; controlled film thickness; excellent gap fill; very low defect density; uses methyl isobutyl ketone as a carrier solvent.

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    Application Type Conformal Coat
    1 Part or 2 Part 1 Part
    Material Form Film
    Manufacturer Dow
    Chemistry Oxide, Methyl Isobutyl Ketone (MIBK), Volatile Methyl Siloxane (VMS)
    Cure Method Heat, Nitrogen Ambient
    Cure Temperature (°C) 400
    Viscosity (cPs) 1
  • Technical Data for Dow FOx-16 Flowable Oxide

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Film
    • Chemistry
      • Other - Oxide, Methyl Isobutyl Ketone (MIBK), Volatile Methyl Siloxane (VMS)
    • Application Method
      • Spin-On
    • Cure Method
      • Heat
      • Other - Nitrogen Ambient
    Specifications
    Cure Specs
    Cure Temperature (°C) 400
    Viscosity (cPs) 1
    Conductivity
    Dielectric Constant 3.00
    Other Properties
    Flash Point (°F) 62.6
  • Best Practices for Dow FOx-16 Flowable Oxide

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  • Comparable Materials for Dow FOx-16 Flowable Oxide

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