Dow FOx-24 Flowable Oxide

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Description for Dow FOx-24 Flowable Oxide

State of the art planarization; low dielectric constant; controlled film thickness; excellent gap fill; very low defect density; uses volatile methyl siloxane as a carrier solvent.

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Application Type	Conformal Coat
1 Part or 2 Part	1-Part
Material Form	Film
Manufacturer	Dow
Chemistry	Methyl Isobutyl Ketone (MIBK), Oxide
Cure Method	Nitrogen Ambient, Heat
Viscosity (cPs)	1.50

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Technical Data for Dow FOx-24 Flowable Oxide

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Overview

Application Type
- Conformal Coating - Conformal Coat
1 Part or 2 Part
- 1-Part
Material Form
- Film
Chemistry
- Other - Methyl Isobutyl Ketone (MIBK), Oxide
Application Method
- Spin-On
Cure Method
- Heat
- Other - Nitrogen Ambient

Specifications

Cure Specs

Viscosity (cPs)	1.50

Conductivity

Dielectric Constant	3.00

Other Properties

Flash Point (°F)	26.6

Best Practices for Dow FOx-24 Flowable Oxide

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Comparable Materials for Dow FOx-24 Flowable Oxide

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Spec Engine^® Results
- FOx-16 Flowable Oxide(Dow)
  State of the art planarization; low dielectric constant; controlled film thickness; excellent gap fill; very low defect density; uses methyl isobutyl ketone as a carrier solvent.
- FOx-15 Flowable Oxide(Dow)
  State of the art planarization; low dielectric constant; controlled film thickness; excellent gap fill; very low defect density; uses methyl isobutyl ketone as a carrier solvent.
- WL-3010 Printable Silicone(Dow)
  Good moisture resistance; high thermal stability; low shrinkage; good dielectric properties.
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Dow FOx-24 Flowable Oxide

Description for Dow FOx-24 Flowable Oxide