Dow FOx-25 Flowable Oxide

Dow FOx-25 Flowable Oxide Datasheet
  • Description for Dow FOx-25 Flowable Oxide

    State of the art planarization; low dielectric constant; controlled film thickness; excellent gap fill; very low defect density; uses volatile methyl siloxane as a carrier solvent.

    *See Terms of Use Below

    Application Type Conformal Coat
    1 Part or 2 Part 1 Part
    Material Form Liquid
    Substrate Broader range of plastic materials
    Industry Integrated circuit fabrication
    Manufacturer Dow
    Chemistry Hydrogen silsesquioxane solution, Volatile methyl siloxane (VMS) fluid blend
    Cure Method Heat
    Cure Temperature (°C) 400
    Odor Details Odor-free
    Gap Fill Excellent
    Viscosity (cPs) 2, Flowable
    Density (g/cm³) 1.400
  • Technical Data for Dow FOx-25 Flowable Oxide

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Liquid
    • Substrate
      • Plastic - Broader range of plastic materials
    • Industry
    • Chemistry
      • Other - Hydrogen silsesquioxane solution, Volatile methyl siloxane (VMS) fluid blend
    • Application Method
      • Spin-On
    • Cure Method
      • Heat
    Specifications
    Cure Specs
    Cure Temperature (°C) 400
    Odor Details Odor-free
    Gap Fill Excellent
    Viscosity (cPs) 2, Flowable
    Bond Strength
    Tensile Strength (psi) 80-100 (MPa) Test Method
    Conductivity
    Dielectric Constant 3.00, Low Test Method
    Other Properties
    Density (g/cm³) 1.400 Test Method
    Business Information
    Shelf Life Details Refer to the Sales Specifications and/or Product Label for these products. These products have a shelf life of 6 months from date of manufacture.
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 6
  • Best Practices for Dow FOx-25 Flowable Oxide

    *See Terms of Use Below

    1. Application

      FOx Flowable Oxide is applied using standard spin-on glass equipment. It can be spin-coated under a wide range of conditions, which will optimize uniformity on complex geometries. After spin-coating, hot plates are used not only to remove solvent as with conventional SOGs, but also to melt and flow the film. The melt and flow properties of the material help to provide superior smoothing and gap fill.

    2. Curing

      After flow, the film is cured in a standard quartz diffusion furnace. At this point, the material is ready for the next processing step. No etchback is required.

  • Comparable Materials for Dow FOx-25 Flowable Oxide

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Tensile Strength Test Methods
Tensile Strength Test Method
80-100 (MPa) Film Stress
Dielectric Constant Test Methods
Dielectric Constant Test Method
3.00 1 MHz
Low
Density Test Methods
Density Test Method
1.400 g/cm³ Film Density, Typical FOx Flowable Oxide converted film properties, processed at 400°C (752°F) in nitrogen ambient.