Dow FOx-25 Flowable Oxide

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Description for Dow FOx-25 Flowable Oxide

State of the art planarization; low dielectric constant; controlled film thickness; excellent gap fill; very low defect density; uses volatile methyl siloxane as a carrier solvent.

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Application Type	Conformal Coat
1 Part or 2 Part	1 Part
Material Form	Liquid
Substrate	Broader range of plastic materials
Industry	Integrated circuit fabrication
Manufacturer	Dow
Chemistry	Hydrogen silsesquioxane solution, Volatile methyl siloxane (VMS) fluid blend
Cure Method	Heat
Cure Temperature (°C)	400
Odor Details	Odor-free
Gap Fill	Excellent
Viscosity (cPs)	2, Flowable
Density (g/cm³)	1.400

Best Practices for Dow FOx-25 Flowable Oxide

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Technical Data for Dow FOx-25 Flowable Oxide

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Overview

Application Type
- Conformal Coating - Conformal Coat
1 Part or 2 Part
- 1 Part or 2 Part - 1 Part
Material Form
- Liquid
Substrate
- Plastic - Broader range of plastic materials
Industry
- Electronics - Integrated circuit fabrication
Chemistry
- Other - Hydrogen silsesquioxane solution, Volatile methyl siloxane (VMS) fluid blend
Application Method
- Spin-On
Cure Method
- Heat

Specifications

Cure Specs

Cure Temperature (°C)	400
Odor Details	Odor-free
Gap Fill	Excellent
Viscosity (cPs)	2, Flowable

Bond Strength

Tensile Strength (psi)	80-100 (MPa)	Test Method

Conductivity

Dielectric Constant	3.00, Low	Test Method

Other Properties

Density (g/cm³)	1.400	Test Method

Business Information

Shelf Life Details	Refer to the Sales Specifications and/or Product Label for these products. These products have a shelf life of 6 months from date of manufacture.
Shelf Life Type	From date of manufacture
Shelf Life (mon)	6

Best Practices for Dow FOx-25 Flowable Oxide

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1. Application
  
  FOx Flowable Oxide is applied using standard spin-on glass equipment. It can be spin-coated under a wide range of conditions, which will optimize uniformity on complex geometries. After spin-coating, hot plates are used not only to remove solvent as with conventional SOGs, but also to melt and flow the film. The melt and flow properties of the material help to provide superior smoothing and gap fill.
2. Curing
  
  After flow, the film is cured in a standard quartz diffusion furnace. At this point, the material is ready for the next processing step. No etchback is required.
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