Application Type Conformal Coat 1 Part or 2 Part 1 Part Material Form Liquid Substrate Broader range of plastic materials Industry Integrated circuit fabrication Manufacturer Dow Chemistry Hydrogen silsesquioxane solution, Volatile methyl siloxane (VMS) fluid blend Cure Method Heat Cure Temperature (°C) 400 Odor Details Odor-free Gap Fill Excellent Viscosity (cPs) 2, Flowable Density (g/cm³) 1.400
Technical Data for Dow FOx-25 Flowable Oxide
- Conformal Coating - Conformal Coat
1 Part or 2 Part
- 1 Part or 2 Part - 1 Part
- Plastic - Broader range of plastic materials
- Electronics - Integrated circuit fabrication
- Other - Hydrogen silsesquioxane solution, Volatile methyl siloxane (VMS) fluid blend
Cure Temperature (°C) 400 Odor Details Odor-free Gap Fill Excellent Viscosity (cPs) 2, Flowable
Tensile Strength (psi) 80-100 (MPa) Test Method
Dielectric Constant 3.00, Low Test Method
Density (g/cm³) 1.400 Test Method
Shelf Life Details Refer to the Sales Specifications and/or Product Label for these products. These products have a shelf life of 6 months from date of manufacture. Shelf Life Type From date of manufacture Shelf Life (mon) 6
Best Practices for Dow FOx-25 Flowable Oxide
FOx Flowable Oxide is applied using standard spin-on glass equipment. It can be spin-coated under a wide range of conditions, which will optimize uniformity on complex geometries. After spin-coating, hot plates are used not only to remove solvent as with conventional SOGs, but also to melt and flow the film. The melt and flow properties of the material help to provide superior smoothing and gap fill.
After flow, the film is cured in a standard quartz diffusion furnace. At this point, the material is ready for the next processing step. No etchback is required.
Comparable Materials for Dow FOx-25 Flowable Oxide
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Tensile Strength Test Methods
|Tensile Strength||Test Method|
|80-100 (MPa)||Film Stress|
Dielectric Constant Test Methods
|Dielectric Constant||Test Method|
Density Test Methods
|1.400 g/cm³||Film Density, Typical FOx Flowable Oxide converted film properties, processed at 400°C (752°F) in nitrogen ambient.|