Dow Q1-4010 Conformal Coating Datasheet Dow Q1-4010 Conformal Coating

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  • Description for Dow Q1-4010 Conformal Coating

    One part, solventless elastomer; heat curable; good dielectric properties; resists severe humidity and other harsh environments; self-priming.

    *See Terms of Use Below

    Brand Dowsil
    Application Type Conformal Coating
    1 Part or 2 Part 1 Part
    Material Form Liquid
    Substrate AL
    Industry Electronic Printed Wiring Board (PWB), Smart Meters, E-Mobility Solutions, Smart Home Devices, Flexible circuit boards, Rigid circuit boards
    Manufacturer Dow
    Chemistry Silicone, Solvent-free
    Cure Method Heat
    Cure Temperature (°C) 20 to 25, 100, <125
    Cure Time (min) 10, Rapid
    Viscosity (cPs) Medium, 825, Soft
    Color Transparent, Translucent
    Ozone Resistance Ozone resistance
    Chemical Resistance Good
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Stress Relief Low stress
    Key Specifications Mil-Spec (United States Military Standard): I-46058-C: Mil I-46058C Amend 7, IPC (Association Connecting Electronics Industries): IPC-CC-830B, UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL 94 V-1
  • Technical Data for Dow Q1-4010 Conformal Coating

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Liquid
    • Substrate
      • Aluminum - AL
      • Other - Most Common Electronic Substrates, Difficult Substrates, Low-Surface Energy Surface
    • Industry
      • Smart Meters
      • Smart Home Devices
      • E-Mobility Solutions
      • Electronics - Electronic Printed Wiring Board (PWB), Flexible circuit boards, Rigid circuit boards
      • Other - Mils or Microns, Boards with sensitive components and fine pitch designs, Use with many no-lead solders, Use with many low-solids (no clean)
    • Application Method
      • Dispenser - Robotic dispensing, Select coating
      • Brush
      • Spray
      • Flow
      • Dip
      • Screen Print - Automated pattern coating
    • Cure Method
      • Heat
    • Color
      • Translucent
      • Clear / Transparent - Transparent
    • Key Specifications
      • Mil-Spec (United States Military Standard): I-46058-C: Amd. 7 - Mil I-46058C Amend 7
      • IPC (Association Connecting Electronics Industries): CC-830B - IPC-CC-830B
      • UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: V-1 - UL 94 V-1
    • Brand
      • Dowsil
    Specifications
    Cure Specs
    Cure Temperature (°C) 20 to 25, 100, <125 Test Method
    Cure Time (min) 10, Rapid Test Method
    Viscosity (cPs) Medium, 825, Soft
    Work / Pot Time (min) >86,400 Test Method
    Bond Strength
    General Bond Strength (psi) Good
    Shear Strength (psi) 130 Test Method
    Material Resistance
    Ozone Resistance Ozone resistance
    Chemical Resistance Good
    UV Resistance UV resistance
    Environmental Resistance Environmental resistance
    High Temperature Resistance (°C) 200 Test Method
    Low Temperature Resistance (°C) -45, -55 Test Method
    Moisture/Humidity Resistance Moisture/humidity resistance
    Conductivity
    Dissipation Factor 0.00271, 0.00030 Test Method
    Dielectric Strength (V/mil) Good, Durable, 575
    Dielectric Constant 2.85, 2.63 Test Method
    Volume Resistivity (O) 2.11 E14 (ohms/cm)
    Hardness
    Stress Relief Low stress
    Shore A Hardness 33
    Flexibility Flexible
    Other Properties
    Specific Gravity 1.000 Test Method
    Business Information
    Shelf Life Details Shelf life is indicated by the “Use Before” date found on the product label.
    Shelf Life Temperature (°F) 41
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 12
  • Best Practices for Dow Q1-4010 Conformal Coating

    *See Terms of Use Below

    1. Curing

      Time to cure is dependent on film thickness, type of oven, and board population density. Heat cure time in the data table gives an indication of typical times after the coating is heated to the temperature indicated. Highly populated, large, heavy boards may take longer than the indicated times due to the large thermal mass taking extra time to warm up.

    2. Testing

      If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.

    3. Removal

      Dow Corning Conformal Coatings offer excellent repairability because they can be removed from substrates and circuitry by scraping or cutting, or by using solvents or stripping agents. If only one circuit component is to be replaced, a soldering iron may be applied directly through the coating to remove the component. After the circuit board has been repaired, the area should be cleaned by brushing or by using solvent, then dried and recoated. Heat cure coatings can be repaired with RTV coatings, but heat cure coatings may not work well when used to repair RTV coatings.

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
20 to 25°C Typical for a 5-mil thickness sample in 180° peel.
100°C Heat Cure, Time to cohesive failure on a 180° peel strip. Coating strength may continue to improve with time. Thicker samples require additional cure time.
<125°C
Cure Time Test Methods
Cure Time Test Method
10 min Heat Cure, Time to cohesive failure on a 180° peel strip. Coating strength may continue to improve with time. Thicker samples require additional cure time.
Rapid
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
>86,400 min Pot Life <29°C
Shear Strength Test Methods
Shear Strength Type Substrate Test Method
130 psi Lap Shear AL Unprimed Adhesion
High Temperature Resistance Test Methods
High Temperature Resistance Test Method
200°C Long periods
Low Temperature Resistance Test Methods
Low Temperature Resistance Test Method
-45°C Long periods
-55°C
Dielectric Constant Test Methods
Dielectric Constant Test Method
2.85 @100 Hz
2.63 @100 KHz
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00271 @100 Hz
0.00030 @100 KHz
Specific Gravity Test Methods
Specific Gravity Test Method
1.000 Cured