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Description for Dow Q1-4010 Conformal Coating
A one-part, transparent medium viscosity conformal coating. Heat, rapid, versatile cure processing controlled by temperature. Good adhesion allows use with many low-solids (no clean) and no-lead solders.Brand Dowsil Chemical Resistance Good Application Type Conformal coating 1 Part or 2 Part 1-Part Material Form Liquid Substrate Al Industry Printed wiring board (PWB), Boards with sensitive components, Flexible circuit boards, Rigid circuit boards Manufacturer Dow Chemistry Versatile, Silicone elastomers, Solventless Cure Method Heat cure, Room temperature Cure Temperature (°C) 20 to 25 Room temperature, 100, <125 Low temps Cure Time (min) 10, Rapid Viscosity (cPs) Medium, 825 Fluorescent UV indicator allows for automated inspection Color Transparent Ozone Resistance Ozone resistance High Temperature Resistance (°C) 200 Low Temperature Resistance (°C) -45, -55 Volume Resistivity (O) 2.11E14 (Ohm*cm) Stress Relief Low stress elastomer Durability Durable Key Specifications Mil-Spec (United States Military Standard): I-46058-C: Mil Spec 46058C tested, IPC (Association Connecting Electronics Industries): IPC-CC-830B, UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL 94 V-1 flammability rating, UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): Agency listing: UL746E -
Technical Data for Dow Q1-4010 Conformal Coating
Overview
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Chemical Resistance
- Chemical Resistance - Good
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Application Type
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1 Part or 2 Part
- 1-Part
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Material Form
- Liquid
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Substrate
- Aluminum - Al
- Other - Most common substrates, Certain difficult surfaces, Low-surface energy surface, Other substrates, Printed circuits, Most common materials, Many low-solids, No-lead solders
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Industry
- Electronics - Printed wiring board (PWB), Flexible circuit boards, Rigid circuit boards, Boards with sensitive components
- Other - Boards with fine pitch designs
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Chemistry
- Solvent-Free - Solventless
- Other - Versatile
- Silicone - Silicone elastomers
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Application Method
- Dispenser - Robotic dispensing, Select coating
- Brush
- Spray
- Flow
- Dip
- Screen Print - Automated pattern coating
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Cure Method
- Room Temperature / Air Dry - Room temperature
- Heat - Heat cure
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Color
- Clear / Transparent - Transparent
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Key Specifications
- Mil-Spec (United States Military Standard) : I-46058-C : Amd. 7 - Mil Spec 46058C tested
- IPC (Association Connecting Electronics Industries) : CC-830B - IPC-CC-830B
- UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) : UL 94 : V-1 - UL 94 V-1 flammability rating
- UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) : 746E - Agency listing: UL746E
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Brand
- Dowsil
Specifications
Cure Specs
Cure Temperature (°C) 20 to 25 Room temperature, 100, <125 Low temps Test Method Cure Time (min) 10, Rapid Test Method Viscosity (cPs) Medium, 825 Test Method Fluorescent UV indicator allows for automated inspection Work / Pot Time (min) >86,400 Test Method Bond Strength
General Bond Strength (psi) Good adhesion Shear Strength (psi) 130 Test Method Material Resistance
Ozone Resistance Ozone resistance UV Resistance UV resistance Environmental Resistance Environmental resistance High Temperature Resistance (°C) 200 Test Method Low Temperature Resistance (°C) -45, -55 Test Method Moisture/Humidity Resistance Moisture resistance, Humidity resistance Conductivity
Dissipation Factor 0.00271, 0.00030 Test Method Dielectric Strength (V/mil) Good, 575 Test Method Dielectric Constant 2.85, 2.63 Test Method Volume Resistivity (O) 2.11E14 (Ohm*cm) Test Method Hardness
Stress Relief Low stress elastomer Durability Durable Shore A Hardness 33 Test Method Flexibility Soft Other Properties
Specific Gravity 1.000 Test Method Business Information
Shelf Life Details Shelf life is indicated by the “Use Before” date found on the product label. Shelf Life Temperature (°F) 41 Shelf Life Type From date of manufacture Shelf Life (mon) 12 Not Good For
Don't Use For Certain materials, Certain chemicals, Certain curing agents, Certain plasticizers, Organotin, Other organometallic compounds, Silicone rubber containing organotin catalyst, Sulfur, Polysulfides, Polysulfones, Other sulfur containing materials, Unsaturated hydrocarbon plasticizers, Some solder flux residues, Medical uses, Pharmaceutical uses -
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Best Practices for Dow Q1-4010 Conformal Coating
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Application
If only one circuit component is to be replaced, a soldering iron may be applied directly through the coating to remove the component.
Heat cure coatings can be repaired with RTV coatings, but heat cure coatings may not work well when used to repair RTV coatings.
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Curing
Time to cure is dependent on film thickness, type of oven, and board population density. Heat cure time in the Typical Properties table gives an indication of typical times after the coating is heated to the temperature indicated. Highly populated, large, heavy boards may take longer than the indicated times due to the large thermal mass taking extra time to warm.
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Clean-Up
After the circuit board has been repaired, the area should be cleaned by brushing or by using solvent, then dried and recoated.
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Removal
Dow conformal coatings offer excellent repairability because they can be removed from substrates and circuitry by scraping or cutting, or by using solvents or stripping agents.
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Comparable Materials for Dow Q1-4010 Conformal Coating
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Cure Temperature Test Methods
Cure Temperature | Cure Time Test Method |
---|---|
20 to 25°C Room temperature | |
100°C | Heat cure, These values are not intended for use in preparing specifications. |
<125°C Low temps |
Cure Time Test Methods
Cure Time | Test Method |
---|---|
10 min | Heat cure, These values are not intended for use in preparing specifications. |
Rapid |
Viscosity Test Methods
Viscosity | Test Method |
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Medium | |
825 cPs | These values are not intended for use in preparing specifications |
Work / Pot Time Test Methods
Work / Pot Time | Test Method | Temperature |
---|---|---|
>86,400 min | Pot life | <29°C |
Shear Strength Test Methods
Shear Strength | Type | Substrate | Test Method |
---|---|---|---|
130 psi | Lap shear | Al | Unprimed adhesion, These values are not intended for use in preparing specifications. |
High Temperature Resistance Test Methods
High Temperature Resistance | Test Method |
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200°C | Long periods |
Low Temperature Resistance Test Methods
Low Temperature Resistance | Test Method |
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-45°C | Long periods |
-55°C | Thermal cycling |
Dielectric Constant Test Methods
Dielectric Constant | Test Method |
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2.85 | @100 Hz, These values are not intended for use in preparing specifications |
2.63 | @100 KHz, These values are not intended for use in preparing specifications |
Dielectric Strength Test Methods
Dielectric Strength | Test Method |
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Good | |
575 V/mil | These values are not intended for use in preparing specifications. |
Dissipation Factor Test Methods
Dissipation Factor | Test Method |
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0.00271 | @100 Hz, These values are not intended for use in preparing specifications |
0.00030 | @100 KHz, These values are not intended for use in preparing specifications |
Volume Resistivity Test Methods
Volume Resistivity | Test Method |
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2.11E14 (Ohm*cm) | These values are not intended for use in preparing specifications. |
Shore A Hardness Test Methods
Shore A Hardness | Shore Hardness Test Method |
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33 | These values are not intended for use in preparing specifications, Durometer |
Specific Gravity Test Methods
Specific Gravity | Test Method |
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1.000 | Cured, These values are not intended for use in preparing specifications. |