Dow Q1-4010 Conformal Coating Datasheet Dow Q1-4010 Conformal Coating

Information provided by Gluespec
  • Description for Dow Q1-4010 Conformal Coating

    A one-part, transparent medium viscosity conformal coating. Heat, rapid, versatile cure processing controlled by temperature. Good adhesion allows use with many low-solids (no clean) and no-lead solders.

    *See Terms of Use Below

    Brand Dowsil
    Chemical Resistance Good
    Application Type Conformal coating
    1 Part or 2 Part 1-Part
    Material Form Liquid
    Substrate Al
    Industry Printed wiring board (PWB), Boards with sensitive components, Flexible circuit boards, Rigid circuit boards
    Manufacturer Dow
    Chemistry Versatile, Silicone elastomers, Solventless
    Cure Method Heat cure, Room temperature
    Cure Temperature (°C) 20 to 25 Room temperature, 100, <125 Low temps
    Cure Time (min) 10, Rapid
    Viscosity (cPs) Medium, 825
    Fluorescent UV indicator allows for automated inspection
    Color Transparent
    Ozone Resistance Ozone resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Volume Resistivity (O) 2.11E14 (Ohm*cm)
    Stress Relief Low stress elastomer
    Durability Durable
    Key Specifications Mil-Spec (United States Military Standard): I-46058-C: Mil Spec 46058C tested, IPC (Association Connecting Electronics Industries): IPC-CC-830B, UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL 94 V-1 flammability rating, UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): Agency listing: UL746E
  • Technical Data for Dow Q1-4010 Conformal Coating

    Overview
    • Chemical Resistance
      • Chemical Resistance - Good
    • Application Type
    • 1 Part or 2 Part
      • 1-Part
    • Material Form
      • Liquid
    • Substrate
      • Aluminum - Al
      • Other - Most common substrates, Certain difficult surfaces, Low-surface energy surface, Other substrates, Printed circuits, Most common materials, Many low-solids, No-lead solders
    • Industry
      • Electronics - Printed wiring board (PWB), Flexible circuit boards, Rigid circuit boards, Boards with sensitive components
      • Other - Boards with fine pitch designs
    • Chemistry
    • Application Method
      • Dispenser - Robotic dispensing, Select coating
      • Brush
      • Spray
      • Flow
      • Dip
      • Screen Print - Automated pattern coating
    • Cure Method
      • Room Temperature / Air Dry - Room temperature
      • Heat - Heat cure
    • Color
      • Clear / Transparent - Transparent
    • Key Specifications
      • Mil-Spec (United States Military Standard) : I-46058-C : Amd. 7 - Mil Spec 46058C tested
      • IPC (Association Connecting Electronics Industries) : CC-830B - IPC-CC-830B
      • UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) : UL 94 : V-1 - UL 94 V-1 flammability rating
      • UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) : 746E - Agency listing: UL746E
    • Brand
      • Dowsil
    Specifications
    Cure Specs
    Cure Temperature (°C) 20 to 25 Room temperature, 100, <125 Low temps Test Method
    Cure Time (min) 10, Rapid Test Method
    Viscosity (cPs) Medium, 825 Test Method
    Fluorescent UV indicator allows for automated inspection
    Work / Pot Time (min) >86,400 Test Method
    Bond Strength
    General Bond Strength (psi) Good adhesion
    Shear Strength (psi) 130 Test Method
    Material Resistance
    Ozone Resistance Ozone resistance
    UV Resistance UV resistance
    Environmental Resistance Environmental resistance
    High Temperature Resistance (°C) 200 Test Method
    Low Temperature Resistance (°C) -45, -55 Test Method
    Moisture/Humidity Resistance Moisture resistance, Humidity resistance
    Conductivity
    Dissipation Factor 0.00271, 0.00030 Test Method
    Dielectric Strength (V/mil) Good, 575 Test Method
    Dielectric Constant 2.85, 2.63 Test Method
    Volume Resistivity (O) 2.11E14 (Ohm*cm) Test Method
    Hardness
    Stress Relief Low stress elastomer
    Durability Durable
    Shore A Hardness 33 Test Method
    Flexibility Soft
    Other Properties
    Specific Gravity 1.000 Test Method
    Business Information
    Shelf Life Details Shelf life is indicated by the “Use Before” date found on the product label.
    Shelf Life Temperature (°F) 41
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 12
    Not Good For
    Don't Use For Certain materials, Certain chemicals, Certain curing agents, Certain plasticizers, Organotin, Other organometallic compounds, Silicone rubber containing organotin catalyst, Sulfur, Polysulfides, Polysulfones, Other sulfur containing materials, Unsaturated hydrocarbon plasticizers, Some solder flux residues, Medical uses, Pharmaceutical uses
  • Best Practices for Dow Q1-4010 Conformal Coating

    *See Terms of Use Below

    1. Application

      If only one circuit component is to be replaced, a soldering iron may be applied directly through the coating to remove the component.

      Heat cure coatings can be repaired with RTV coatings, but heat cure coatings may not work well when used to repair RTV coatings.

    2. Curing

      Time to cure is dependent on film thickness, type of oven, and board population density. Heat cure time in the Typical Properties table gives an indication of typical times after the coating is heated to the temperature indicated. Highly populated, large, heavy boards may take longer than the indicated times due to the large thermal mass taking extra time to warm.

    3. Clean-Up

      After the circuit board has been repaired, the area should be cleaned by brushing or by using solvent, then dried and recoated.

    4. Removal

      Dow conformal coatings offer excellent repairability because they can be removed from substrates and circuitry by scraping or cutting, or by using solvents or stripping agents.

  • Comparable Materials for Dow Q1-4010 Conformal Coating

    *See Terms of Use Below

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
20 to 25°C Room temperature
100°C Heat cure, These values are not intended for use in preparing specifications.
<125°C Low temps
Cure Time Test Methods
Cure Time Test Method
10 min Heat cure, These values are not intended for use in preparing specifications.
Rapid
Viscosity Test Methods
Viscosity Test Method
Medium
825 cPs These values are not intended for use in preparing specifications
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
>86,400 min Pot life <29°C
Shear Strength Test Methods
Shear Strength Type Substrate Test Method
130 psi Lap shear Al Unprimed adhesion, These values are not intended for use in preparing specifications.
High Temperature Resistance Test Methods
High Temperature Resistance Test Method
200°C Long periods
Low Temperature Resistance Test Methods
Low Temperature Resistance Test Method
-45°C Long periods
-55°C Thermal cycling
Dielectric Constant Test Methods
Dielectric Constant Test Method
2.85 @100 Hz, These values are not intended for use in preparing specifications
2.63 @100 KHz, These values are not intended for use in preparing specifications
Dielectric Strength Test Methods
Dielectric Strength Test Method
Good
575 V/mil These values are not intended for use in preparing specifications.
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00271 @100 Hz, These values are not intended for use in preparing specifications
0.00030 @100 KHz, These values are not intended for use in preparing specifications
Volume Resistivity Test Methods
Volume Resistivity Test Method
2.11E14 (Ohm*cm) These values are not intended for use in preparing specifications.
Shore A Hardness Test Methods
Shore A Hardness Shore Hardness Test Method
33 These values are not intended for use in preparing specifications, Durometer
Specific Gravity Test Methods
Specific Gravity Test Method
1.000 Cured, These values are not intended for use in preparing specifications.