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Description for Dow WL-5351 Photopatternable Spin-On Silicone
Low temperature thermal cure; high thermal stability; low shrinkage; good moisture resistance; good dielectric properties; negative tone patternable to an aspect ratio less than 1.3 with sloping sidewalls; demonstrated device integration; easily reworkable.Note: This material has been discontinued. Please view the Comparable Materials tab or call us at (262) 293-7970 for additional help.
Application Type Conformal Coat 1 Part or 2 Part 1-Part Material Form Film Manufacturer Dow Chemistry Silicone Cure Method Thermal cure Cure Temperature (°C) Low-temperature Viscosity (cPs) 100 High Temperature Resistance (°C) 300 Low Temperature Resistance (°C) -30 -
Technical Data for Dow WL-5351 Photopatternable Spin-On Silicone
Overview
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Application Type
- Conformal Coating - Conformal Coat
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1 Part or 2 Part
- 1-Part
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Material Form
- Film
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Chemistry
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Application Method
- Screen Print - Patternable
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Cure Method
- Heat - Thermal cure
Specifications
Cure Specs
Cure Temperature (°C) Low-temperature Viscosity (cPs) 100 Linear Shrinkage (%) Low Material Resistance
High Temperature Resistance (°C) 300 Low Temperature Resistance (°C) -30 Moisture/Humidity Resistance Good moisture Conductivity
Dielectric Strength (V/mil) Good Dielectric Constant 3.30 Hardness
Elongation (%) 7 Other Properties
Flash Point (°F) 111.2 -
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Best Practices for Dow WL-5351 Photopatternable Spin-On Silicone
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Comparable Materials for Dow WL-5351 Photopatternable Spin-On Silicone
Spec Engine® Results
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