Dow WL-5351 Photopatternable Spin-On Silicone

Dow WL-5351 Photopatternable Spin-On Silicone Datasheet
  • Description for Dow WL-5351 Photopatternable Spin-On Silicone

    Low temperature thermal cure; high thermal stability; low shrinkage; good moisture resistance; good dielectric properties; negative tone patternable to an aspect ratio less than 1.3 with sloping sidewalls; demonstrated device integration; easily reworkable.

    Note: This material has been discontinued. Please view the Comparable Materials tab or call us at (262) 293-7970 for additional help.

    *See Terms of Use Below

    Application Type Conformal Coat
    1 Part or 2 Part 1 Part
    Material Form Film
    Manufacturer Dow
    Chemistry Silicone
    Cure Method Thermal cure
    Cure Temperature (°C) Low-temperature
    Viscosity (cPs) 100
    High Temperature Resistance (°C) 300
    Low Temperature Resistance (°C) -30
  • Technical Data for Dow WL-5351 Photopatternable Spin-On Silicone

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Film
    • Chemistry
    • Application Method
      • Screen Print - Patternable
    • Cure Method
      • Heat - Thermal cure
    Specifications
    Cure Specs
    Cure Temperature (°C) Low-temperature
    Viscosity (cPs) 100
    Linear Shrinkage (%) Low
    Material Resistance
    High Temperature Resistance (°C) 300
    Low Temperature Resistance (°C) -30
    Moisture/Humidity Resistance Good moisture
    Conductivity
    Dielectric Strength (V/mil) Good
    Dielectric Constant 3.30
    Hardness
    Elongation (%) 7
    Other Properties
    Flash Point (°F) 111.2
  • Best Practices for Dow WL-5351 Photopatternable Spin-On Silicone

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  • Comparable Materials for Dow WL-5351 Photopatternable Spin-On Silicone

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