

-
Description for Elantas (Altana) Conap CE-1170
A single-component air drying room temperature curing acrylic conformal coating. Cured films maintain excellent adhesion to phenolic and epoxy-glass laminates even in adverse environmental conditions.Brand Cytec, Conap Chemical Resistance Chemical Resistance: Fair solvent resistance Application Type Conformal coat 1 Part or 2 Part 1-Part Material Form Liquid Substrate Glass, Phenolic, Epoxy Industry components, Electrical, Electronics, Printed circuitry Manufacturer Elantas (Altana) Chemistry Acrylic, Solvent-based Cure Method Air dry Cure Temperature (°C) 20 to 25, 25, 60 Viscosity (cPs) 400 Color Amber, Slight Haze, Clear, colorless Fungus Resistance Fungus resistance High Temperature Resistance (°C) 125 Low Temperature Resistance (°C) -65 Volume Resistivity (O) 2e15 (ohms/cm) Key Specifications IPC-CC-830B, UL Recognized, Mil-Spec (United States Military Standard): I-46058-C: MIL-STD-810B; MIL-I-46058C, Type AR, Mil-Spec (United States Military Standard): MIL-STD-810B; MIL-I-46058C, Type AR -
Technical Data for Elantas (Altana) Conap CE-1170
Overview
-
Chemical Resistance
- Chemical Resistance : Relative Solvent Resistance - Fair solvent resistance
-
Application Type
- Conformal Coating - Conformal coat
-
1 Part or 2 Part
- 1-Part
-
Material Form
- Liquid
-
Substrate
- Glass
- Phenolic
- Epoxy
-
Industry
- Electronics - components, Electrical, Printed circuitry
-
Chemistry
-
Application Method
- Brush
- Spray
- Dip
-
Cure Method
- Room Temperature / Air Dry - Air dry
-
Color
- Clear / Transparent - Clear, colorless
- Red - Amber, Slight Haze
-
Key Specifications
- IPC (Association Connecting Electronics Industries) - IPC-CC-830B
- UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) - UL Recognized
- Mil-Spec (United States Military Standard) : I-46058-C : Type AR - MIL-STD-810B; MIL-I-46058C, Type AR
- Mil-Spec (United States Military Standard) : STD-810B - MIL-STD-810B; MIL-I-46058C, Type AR
-
Brand
- Conap
- Cytec
Specifications
Cure Specs
Cure Temperature (°C) 20 to 25, 25, 60 Cure Time (min) Viscosity (cPs) 400 Test Method Work / Pot Time (min) Indefinate Bond Strength
General Bond Strength (psi) Excellent Material Resistance
Flame Resistance Flame resistance Fungus Resistance Fungus resistance High Temperature Resistance (°C) 125 Low Temperature Resistance (°C) -65 Moisture/Humidity Resistance Moisture/humidity resistance Conductivity
Dissipation Factor 0.01000 Test Method Insulation Resistance (O) Insulation resistance, >1.5e16 (ohms), 2.5e12 (ohms), 1.0e16 (ohms) Test Method Dielectric Strength (V/mil) 1500 V.A.C. Test Method Dielectric Constant 2.50 to 3.00 Test Method Volume Resistivity (O) 2e15 (ohms/cm) Test Method Hardness
Flexibility Excellent, Flexibility - No cracking or crazing in bend over 1/8" diameter mandrel Test Method Other Properties
Specific Gravity 0.950 Test Method Flash Point (°F) 55.4 Test Method % Solids (%) 31 Business Information
Shelf Life Details Maintain containers at temperatures of 149°C-185°C (65 F-85 F) and keep securely closed when not in use. The shelf life of CONAP CE-1170 is 18 months from date of manufacture when stored in the original, unopened containers at 149°C-185°C (65 F -85 F). Shelf Life Type From date of manufacture Shelf Life (mon) 18 -
-
Best Practices for Elantas (Altana) Conap CE-1170
-
Application
CONAP® CE-1170 is a high-performance coating specifically designed as an electrical insulating coating for printed circuitry and components. The ultimate performance of the cured film is dependent on process controls used in application of the coating. Cleanliness of the substrate is a major factor in promoting adhesion and preventing under-film corrosion. Assemblies must be clean, oil-free, and dry. For specific recommendations, please request Technical Bulletin C-115.
CE-1170 may be applied by spraying, dipping, or brushing. If viscosity reduction is desired, dilutions of 10-20% by weight with CONAP® S-13 Solvent are recommended for most applications.
PLEASE NOTE: For spray applications, dilutions up to 1 to 1 by volume may be necessary to avoid cobwebbing.
CE-1170 may be sprayed with most conventional air spray equipment.
Two coats are recommended for optimum protection. A total cured film thickness of 2 ± 1 mil is recommended. CE-1170 may be re-coated, if desired, after the previous film is tack-free.
-
-
Comparable Materials for Elantas (Altana) Conap CE-1170
Spec Engine® Results
Closest Results from this Manufacturer
Popular Articles
Silicones in LED Lighting | Gluespec
Read ArticleInfographic: ENSURING A STRONG BOND - 6 Basic Methods of Surface Preparation
Read ArticleTesting the effectiveness of surface treatments
Read ArticleConformal Coatings
Read ArticleSponsored Articles
Unique Advantages of Contact Adhesives
Read ArticleUsing LOCTITE® 454™ is a Valid Option for Engineers Working with a Wide Variety of Materials
Read ArticleSylgard 184 by DOW is the Top Choice for a Transparent, Silicone Encapsulant. Read Why:
Read ArticleCase Study: Creating reliable, corrosion-free bonds with LORD® 406 acrylic adhesive
Read ArticleFeatured Ads

Tack Free Time Test Methods
Tack Free Time | Tack Free Temperature |
---|
Viscosity Test Methods
Viscosity | Test Method | Temperature |
---|---|---|
400 cPs | Brookfield Viscosity @ 25°C, cps | 25°C |
Dielectric Constant Test Methods
Dielectric Constant | Temperature | Test Method |
---|---|---|
2.50 to 3.00 | 25°C | Dielectric constant @ 100 Hz |
Dielectric Strength Test Methods
Dielectric Strength | Test Method |
---|---|
1500 V.A.C. | No flashover or breakdown (1500 VAC) |
Dissipation Factor Test Methods
Dissipation Factor | Temperature | Test Method |
---|---|---|
0.01000 | 25°C | Dissipation Factor @ 100 Hz |
Insulation Resistance Test Methods
Insulation Resistance | Temperature | Test Method |
---|---|---|
Insulation resistance | 25°C | Initially @ 25°C and 50% R.H, 2.0 mil films |
>1.5e16 (ohms) | 65°C | After 10 days @ 65°C and 95% R.H, 2.0 mil films |
2.5e12 (ohms) | 25°C | After conditioning 25 hours @ 25°C and 50% R.H, 2.0 mil films |
1.0e16 (ohms) |
Volume Resistivity Test Methods
Volume Resistivity | Temp (°C) |
---|---|
2e15 (ohms/cm) | 25°C |
Flexibility Test Methods
Flexibility | Test Method |
---|---|
Excellent | Flexibility Test Method |
Flexibility - No cracking or crazing in bend over 1/8" diameter mandrel | MIL-I-46058C |
Flash Point Test Methods
Flash Point | Test Method |
---|---|
13.0°C | Closed Cup |
Specific Gravity Test Methods
Specific Gravity | Temperature |
---|---|
0.950 | 25°C |