Elantas (Altana) Conap CE-1170

Elantas (Altana) Conap CE-1170 Datasheet
  • Description for Elantas (Altana) Conap CE-1170

    A single-component air drying room temperature curing acrylic conformal coating. Cured films maintain excellent adhesion to phenolic and epoxy-glass laminates even in adverse environmental conditions.

    *See Terms of Use Below

    Brand Conap, Cytec
    Application Type Conformal coat
    1 Part or 2 Part 1 Part
    Material Form Liquid
    Substrate Epoxy, Phenolic, Glass
    Industry components, Electrical, Electronics, Printed circuitry
    Manufacturer Elantas (Altana)
    Chemistry Acrylic, Solvent-based
    Cure Method Air dry
    Cure Temperature (°C) 20 to 25, 25, 60
    Viscosity (cPs) 400
    Color Amber, Slight Haze, Clear, colorless
    Fungus Resistance Fungus resistance
    Relative Solvent Resistance Chemical Resistance: Fair solvent resistance
    High Temperature Resistance (°C) 125
    Low Temperature Resistance (°C) -65
    Key Specifications IPC-CC-830B, UL Recognized, Mil-Spec (United States Military Standard): I-46058-C: MIL-STD-810B; MIL-I-46058C, Type AR, Mil-Spec (United States Military Standard): MIL-STD-810B; MIL-I-46058C, Type AR
  • Technical Data for Elantas (Altana) Conap CE-1170

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Liquid
    • Substrate
    • Industry
      • Electronics - components, Electrical, Printed circuitry
    • Application Method
      • Brush
      • Spray
      • Dip
    • Cure Method
      • Room Temperature / Air Dry - Air dry
    • Color
      • Clear / Transparent - Clear, colorless
      • Red - Amber, Slight Haze
    • Key Specifications
      • IPC (Association Connecting Electronics Industries) - IPC-CC-830B
      • UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) - UL Recognized
      • Mil-Spec (United States Military Standard): I-46058-C: Type AR - MIL-STD-810B; MIL-I-46058C, Type AR
      • Mil-Spec (United States Military Standard): STD-810B - MIL-STD-810B; MIL-I-46058C, Type AR
    • Brand
      • Conap
      • Cytec
    Specifications
    Cure Specs
    Cure Temperature (°C) 20 to 25, 25, 60
    Cure Time (min)
    Viscosity (cPs) 400 Test Method
    Work / Pot Time (min) Indefinate
    Bond Strength
    General Bond Strength (psi) Excellent
    Material Resistance
    Flame Resistance Flame resistance
    Fungus Resistance Fungus resistance
    High Temperature Resistance (°C) 125
    Low Temperature Resistance (°C) -65
    Moisture/Humidity Resistance Moisture/humidity resistance
    Conductivity
    Dissipation Factor 0.01000 Test Method
    Insulation Resistance (O) Insulation resistance, >1.5e16 (ohms), 2.5e12 (ohms), 1.0e16 (ohms) Test Method
    Dielectric Strength (V/mil) 1500 V.A.C. Test Method
    Dielectric Constant 2.50 to 3.00 Test Method
    Volume Resistivity (O) 2e15 (ohms/cm) Test Method
    Hardness
    Flexibility Excellent, Flexibility - No cracking or crazing in bend over 1/8" diameter mandrel Test Method
    Other Properties
    Specific Gravity 0.950 Test Method
    Flash Point (°F) 55.4 Test Method
    % Solids (%) 31
    Business Information
    Shelf Life Details Maintain containers at temperatures of 149°C-185°C (65 F-85 F) and keep securely closed when not in use. The shelf life of CONAP CE-1170 is 18 months from date of manufacture when stored in the original, unopened containers at 149°C-185°C (65 F -85 F).
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 18
  • Best Practices for Elantas (Altana) Conap CE-1170

    *See Terms of Use Below

    1. Application

      CONAP® CE-1170 is a high-performance coating specifically designed as an electrical insulating coating for printed circuitry and components. The ultimate performance of the cured film is dependent on process controls used in application of the coating. Cleanliness of the substrate is a major factor in promoting adhesion and preventing under-film corrosion. Assemblies must be clean, oil-free, and dry. For specific recommendations, please request Technical Bulletin C-115.

      CE-1170 may be applied by spraying, dipping, or brushing. If viscosity reduction is desired, dilutions of 10-20% by weight with CONAP® S-13 Solvent are recommended for most applications.

      PLEASE NOTE: For spray applications, dilutions up to 1 to 1 by volume may be necessary to avoid cobwebbing.

      CE-1170 may be sprayed with most conventional air spray equipment.

      Two coats are recommended for optimum protection. A total cured film thickness of 2 ± 1 mil is recommended. CE-1170 may be re-coated, if desired, after the previous film is tack-free.

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Tack Free Time Test Methods
Tack Free Time Tack Free Temperature
Viscosity Test Methods
Viscosity Test Method Temperature
400 cPs Brookfield Viscosity @ 25°C, cps 25°C
Dielectric Constant Test Methods
Dielectric Constant Temperature Test Method
2.50 to 3.00 25°C Dielectric constant @ 100 Hz
Dielectric Strength Test Methods
Dielectric Strength Test Method
1500 V.A.C. No flashover or breakdown (1500 VAC)
Dissipation Factor Test Methods
Dissipation Factor Temperature Test Method
0.01000 25°C Dissipation Factor @ 100 Hz
Volume Resistivity Test Methods
Volume Resistivity Temp (°C)
2e15 (ohms/cm) 25°C
Insulation Resistance Test Methods
Insulation Resistance Temperature Test Method
Insulation resistance 25°C Initially @ 25°C and 50% R.H, 2.0 mil films
>1.5e16 (ohms) 65°C After 10 days @ 65°C and 95% R.H, 2.0 mil films
2.5e12 (ohms) 25°C After conditioning 25 hours @ 25°C and 50% R.H, 2.0 mil films
1.0e16 (ohms)
Flexibility Test Methods
Flexibility Test Method
Excellent Flexibility Test Method
Flexibility - No cracking or crazing in bend over 1/8" diameter mandrel MIL-I-46058C
Flash Point Test Methods
Flash Point Test Method
13.0°C Closed Cup
Specific Gravity Test Methods
Specific Gravity Temperature
0.950 25°C
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