Elantas (Altana) Conathane CE-1155 Datasheet Elantas (Altana) Conathane CE-1155

Information provided by Gluespec
  • Description for Elantas (Altana) Conathane CE-1155

    A two-component, solvent-based polyurethane printed circuit board coating designed for use in adverse environments. CE-1155 provides outstanding resistance to moisture and good abrasion resistance.

    *See Terms of Use Below

    Brand Conathane, Cytec
    Chemical Resistance Excellent, Chemical Resistance: Excellent solvent resistance
    Application Type Conformal Coat
    1 Part or 2 Part 2-Part
    Material Form Liquid
    Substrate Phenolic, Epoxy-glass laminates
    Industry Electrical, Printed circuit board
    Manufacturer Elantas (Altana)
    Chemistry Solvent-based, Polyurethane
    Cure Method Part A/Part B
    Cure Temperature (°C) 25 Room Temprature, 60, 100
    Cure Time (min) 7,200 to 10,080, 180, 60, Fast
    Viscosity (cPs) 72, 92, 172, 432
    Fluorescent Fluorescent under UV lighting
    Color Clear Light Amber, Clear Light Amber, Transparent
    Fungus Resistance Fungus resistance
    High Temperature Resistance (°C) <130
    Other Resistance Excellent electrical barrier
    Volume Resistivity (O) 1.18e16 (ohms/cm), 1.2e16 (ohm-cm)
    Key Specifications Comply with Directive 2011/65/EU, Mil-Spec (United States Military Standard): MIL-E-5272C, Mil-Spec (United States Military Standard): I-46058-C: QPL listed for MIL-I-46058C for Type UR, Mil-Spec (United States Military Standard): MIL-STD-810B, UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL94 V-0
  • Technical Data for Elantas (Altana) Conathane CE-1155

    Overview
    • Chemical Resistance
      • Chemical Resistance - Excellent
      • Chemical Resistance : Relative Solvent Resistance - Excellent solvent resistance
    • Application Type
    • 1 Part or 2 Part
      • 2-Part
    • Material Form
      • Liquid
    • Substrate
      • Phenolic
      • Epoxy - Epoxy-glass laminates
    • Industry
      • Electronics - Electrical
      • Printed Circuit Board (PCB) - Printed circuit board
      • Other - Thin film applications
    • Application Method
      • Brush - Brush Applied
      • Spray - Spray Coating
      • Dip - Dip Coating
    • Cure Method
      • 2-Part Cure - Part A/Part B
    • Color
      • Clear / Transparent - Clear Light Amber, Transparent
      • Red - Clear Light Amber
    • Key Specifications
      • RoHS (Restriction of Hazardous Substances) - Comply with Directive 2011/65/EU
      • Mil-Spec (United States Military Standard) : E-5272C - MIL-E-5272C
      • Mil-Spec (United States Military Standard) : I-46058-C : Type UR - QPL listed for MIL-I-46058C for Type UR
      • Mil-Spec (United States Military Standard) : STD-810B - MIL-STD-810B
      • UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) : UL 94 : V0 - UL94 V-0
    • Brand
      • Conathane
      • Cytec
    Specifications
    Cure Specs
    Cure Temperature (°C) 25 Room Temprature, 60, 100
    Cure Time (min) 7,200 to 10,080, 180, 60, Fast
    Viscosity (cPs) 72, 92, 172, 432 Test Method
    Tack Free Time (min) 300 to 360, 30 to 45, 10 to 15 Test Method
    Fluorescent Fluorescent under UV lighting
    Work / Pot Time (min) 360 Test Method
    Mix Ratio 100:70 (by weight), 100:82 (by volume)
    Bond Strength
    General Bond Strength (psi) Excellent adhesion
    Material Resistance
    Fungus Resistance Fungus resistance
    Abrasion Resistance Excellent
    High Temperature Resistance (°C) <130
    Moisture/Humidity Resistance Outstanding, Excellent moisture barrier, Excellent hydrolytic stability
    Other Resistance Excellent electrical barrier
    Conductivity
    Dissipation Factor 0.01600, 0.01420, 0.01380, 0.01620, 0.01000, 0.01000, 0.02000 Test Method
    Insulation Resistance (O) >2.5e13 (ohms), 3.7e11 (ohms), 1.4e11 (ohms), 8.8e10 (ohms), 6.1e10 (ohms), 6.0e12 (ohms), >2.5e13 (ohms), 6.1e10 (ohms) Test Method
    Dielectric Strength (V/mil) 3,000, 1,045, No flashover or breakdown Test Method
    Dielectric Constant 3.50, 3.43, 3.21, 3.40, 3.20 Test Method
    Surface Resistivity (O) 5.66e14 (ohms) , 5.7e14 (ohms / sq.) Test Method
    Volume Resistivity (O) 1.18e16 (ohms/cm), 1.2e16 (ohm-cm) Test Method
    Hardness
    Shore D Hardness 70 Test Method
    Flexibility Flexibility - No cracking or crazing of film in bend over 1/8" mandrel, Flexible coating Test Method
    Other Properties
    Specific Gravity 1.130, 0.960 Test Method
    Flash Point (°F) 81.0, 45.0 Test Method
    % Solids (%) 60, 64 to 66
    Business Information
    Shelf Life Details The shelf life of CE-1155, Part A and Part B is 15 months from date of manufacture when stored in the original, unopened containers at the above recommended temperatures.;CONATHANE® CE-1155 should be stored at temperatures of 65°-85°F in tightly closed containers. If containers are opened and the contents only partially used, the container should be flushed with dry nitrogen (see CONAP® Dri-Purge) or dry air before being re-sealed., Store at 20 – 30°C / 68 – 85°F in a dry controlled environment out of direct sunlight. This material should be suitable for use stored under these conditions in the original sealed containers for twelve (12) months from the date of shipment.
    Shelf Life Temperature (°F) 77, 68 to 86
    Shelf Life Type From date of manufacture, From the date of shipment
    Shelf Life (mon) 15, 12
  • Best Practices for Elantas (Altana) Conathane CE-1155

    *See Terms of Use Below

    1. Surface Preparation

      Cleanliness of the substrate is a major factor in promoting adhesion and preventing under-film corrosion. Assemblies must be clean, oil-free, and dry.

    2. Application

      CE-1155 can be applied by spraying, dipping, or brushing. If viscosity reduction is desired, dilutions of 10 – 20% by weight with the CONAP® S-8 Solvent are recommended for most applications. For some spray applications, dilutions up to 1:1 by volume may be required to avoid cobwebbing.

      A minimum of two coats of CE-1155 is recommended for optimal protection. A total cured film thickness of 2 ± 1 mils is recommended. CE-1155 may be recoated after the previous film is tack-free.

    3. Curing

      Curing of the film is dependent upon the evaporation of the solvents and subsequent reaction of the polymer.

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    *See Terms of Use Below

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Tack Free Time Test Methods
Tack Free Time Tack Free Temperature
300 to 360 min 25°C Room Temperature
30 to 45 min 60°C
10 to 15 min 100°C
Viscosity Test Methods
Viscosity Test Method Temperature
72 cPs Viscosity @ 25°C Brookfield, initial 25°C Room Temperature
92 cPs Viscosity @ 25°C Brookfield, 1 hour 25°C Room Temperature
172 cPs Viscosity @ 25°C Brookfield, 3 hours 25°C Room Temperature
432 cPs Viscosity @ 25°C Brookfield, 6 hours 25°C Room Temperature
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
360 min 400 grams mass, Mixed 25°C Room Temperature
Dielectric Constant Test Methods
Dielectric Constant Temperature Test Method
3.50 25°C Room Temprature ASTM D150, @ 100 Hz
3.43 25°C Room Temprature @ 1 KHz
3.21 25°C Room Temprature @ 1 MHz
3.40 25°C ASTM D150, @ 1 KHz
3.20 25°C ASTM D150, @ 1 MHz
Dielectric Strength Test Methods
Dielectric Strength Test Method
3,000 V/mil ASTM D149, (0.002” thickness)
1,045 V/mil ASTM D149, (0.022” thickness)
No flashover or breakdown MIL-I-46058C, (1500 VAC), Dielectric Withstanding Voltage
Dissipation Factor Test Methods
Dissipation Factor Temperature Test Method
0.01600
0.01420 25°C Room Temprature @ 100 Hz
0.01380 25°C Room Temprature @ 1 KHz
0.01620 25°C Room Temprature @ 1 MHz
0.01000 25°C ASTM D150, @ 100 Hz
0.01000 25°C ASTM D150, @ 1 KHz
0.02000 25°C ASTM D150, @ 1 MHz
Insulation Resistance Test Methods
Insulation Resistance Temperature Test Method
>2.5e13 (ohms) 25°C Room Temprature Initial (25°C - 50% R.H.), 1.5-2.0 mil film, MIL-I-46058C
3.7e11 (ohms) 65°C 1st Cycle @ 65°C - 95% R.H., 1.5-2.0 mil film
1.4e11 (ohms) 65°C 4th Cycle @ 65°C - 95% R.H., 1.5-2.0 mil film
8.8e10 (ohms) 65°C 7th Cycle @ 65°C - 95% R.H., 1.5-2.0 mil film
6.1e10 (ohms) 65°C 10th Cycle @ 65°C - 95% R.H., 1.5-2.0 mil film
6.0e12 (ohms) 25°C Room Temprature 24 hours after 10th Cycle @ 25°C - 95% R.H., 1.5-2.0 mil film
>2.5e13 (ohms) 25°C MIL-I-46058C, 2 mils
6.1e10 (ohms) 65°C MIL-I-46058C, After 10 d @ 65°C / 95% RH
Surface Resistivity Test Methods
Surface Resistivity Temperature Test Method
5.66e14 (ohms) 25°C Room Temprature
5.7e14 (ohms / sq.) 25°C ASTM D257
Volume Resistivity Test Methods
Volume Resistivity Temp (°C) Test Method
1.18e16 (ohms/cm) 25°C Room Temprature
1.2e16 (ohm-cm) 25°C ASTM D257
Flexibility Test Methods
Flexibility Test Method
Flexibility - No cracking or crazing of film in bend over 1/8" mandrel MIL-I-46058C
Flexible coating
Shore D Hardness Test Methods
Shore D Hardness Shore Hardness Test Method Hardness Temperature
70 ASTM D2134, Sward Hardness 25°C
Flash Point Test Methods
Flash Point Test Method
27.2°C Seta Flash
7.2°C Seta Flash
Specific Gravity Test Methods
Specific Gravity Temperature
1.130 25°C Room Temperature
0.960 25°C Room Temperature